3d Ic Trends

Author : Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
Publisher : John Wiley & Sons
Page : 464 pages
File Size : 41,5 Mb
Release : 2018-03-29
Category : Technology & Engineering
ISBN : 9781119289661

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng Pdf

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
Page : 560 pages
File Size : 50,5 Mb
Release : 2012-11-27
Category : Technology & Engineering
ISBN : 9781441995421

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim Pdf

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
Publisher : Springer
Page : 179 pages
File Size : 43,5 Mb
Release : 2014-08-21
Category : Technology & Engineering
ISBN : 9783319076119

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Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby Pdf

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Author : Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Publisher : Springer
Page : 408 pages
File Size : 40,5 Mb
Release : 2015-12-09
Category : Science
ISBN : 9783319186757

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Three-Dimensional Integration of Semiconductors by Kazuo Kondo,Morihiro Kada,Kenji Takahashi Pdf

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Author : Rohit Sharma
Publisher : CRC Press
Page : 302 pages
File Size : 50,9 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781466589421

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Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
Publisher : Springer Science & Business Media
Page : 292 pages
File Size : 55,6 Mb
Release : 2009-12-02
Category : Technology & Engineering
ISBN : 9781441907844

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Three-Dimensional Integrated Circuit Design by Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar Pdf

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Author : Hong Xiao
Publisher : Spie Society of Photo-Optical Instrumentation Engineers (Spie
Page : 220 pages
File Size : 55,5 Mb
Release : 2016-04
Category : Three-dimensional integrated circuits
ISBN : 1510601465

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3D IC Devices, Technologies, and Manufacturing by Hong Xiao Pdf

This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.

Author : Yu Hao,Tan Chuan Seng
Publisher : World Scientific
Page : 392 pages
File Size : 53,8 Mb
Release : 2015-08-28
Category : Technology & Engineering
ISBN : 9789814699037

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Advances In 3d Integrated Circuits And Systems by Yu Hao,Tan Chuan Seng Pdf

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Author : Yan Li,Deepak Goyal
Publisher : Springer Nature
Page : 629 pages
File Size : 40,5 Mb
Release : 2020-11-23
Category : Technology & Engineering
ISBN : 9789811570902

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Author : Serge Luryi,Jimmy Xu,Alexander Zaslavsky
Publisher : John Wiley & Sons
Page : 384 pages
File Size : 54,6 Mb
Release : 2016-09-12
Category : Technology & Engineering
ISBN : 9781119069188

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Future Trends in Microelectronics by Serge Luryi,Jimmy Xu,Alexander Zaslavsky Pdf

Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.

Author : Nauman Khan,Soha Hassoun
Publisher : Springer Science & Business Media
Page : 76 pages
File Size : 54,8 Mb
Release : 2012-09-22
Category : Technology & Engineering
ISBN : 9781461455080

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Designing TSVs for 3D Integrated Circuits by Nauman Khan,Soha Hassoun Pdf

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Author : Anonim
Publisher : Iulia Tomut
Page : 170 pages
File Size : 43,7 Mb
Release : 2024-04-19
Category : Electronic
ISBN : 8210379456XXX

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Monolithic 3D - In General by Anonim Pdf

Author : Veena S. Chakravarthi,Shivananda R. Koteshwar
Publisher : Springer Nature
Page : 173 pages
File Size : 48,5 Mb
Release : 2022-06-06
Category : Technology & Engineering
ISBN : 9783030981129

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SoC Physical Design by Veena S. Chakravarthi,Shivananda R. Koteshwar Pdf

SoC Physical Design is a comprehensive practical guide for VLSI designers that thoroughly examines and explains the practical physical design flow of system on chip (SoC). The book covers the rationale behind making design decisions on power, performance, and area (PPA) goals for SoC and explains the required design environment algorithms, design flows, constraints, handoff procedures, and design infrastructure requirements in achieving them. The book reveals challenges likely to be faced at each design process and ways to address them in practical design environments. Advanced topics on 3D ICs, EDA trends, and SOC trends are discussed in later chapters. Coverage also includes advanced physical design techniques followed for deep submicron SOC designs. The book provides aspiring VLSI designers, practicing design engineers, and electrical engineering students with a solid background on the complex physical design requirements of SoCs which are required to contribute effectively in design roles.

Author : E.I. Givargizov
Publisher : Springer Science & Business Media
Page : 377 pages
File Size : 44,6 Mb
Release : 2013-11-21
Category : Technology & Engineering
ISBN : 9781489925602

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Oriented Crystallization on Amorphous Substrates by E.I. Givargizov Pdf

Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential.

Author : Banqiu Wu,Ajay Kumar,Sesh Ramaswami
Publisher : McGraw Hill Professional
Page : 544 pages
File Size : 53,7 Mb
Release : 2011-07-07
Category : Technology & Engineering
ISBN : 9780071741958

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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami Pdf

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology