Connectors And Interconnections Handbook Basic Technology

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Electronic Connector Handbook

Author : Robert S. Mroczkowski
Publisher : McGraw Hill Professional
Page : 446 pages
File Size : 49,8 Mb
Release : 1998
Category : Technology & Engineering
ISBN : 0070414017

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Electronic Connector Handbook by Robert S. Mroczkowski Pdf

Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.

Microelectronics Packaging Handbook

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 53,5 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

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Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Multichip Module Technologies and Alternatives: The Basics

Author : Daryl Ann Doane,Paul Franzon
Publisher : Springer Science & Business Media
Page : 895 pages
File Size : 50,6 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461531005

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Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane,Paul Franzon Pdf

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Electronic Connector Handbook

Author : Robert S. Mroczkowski
Publisher : McGraw-Hill Professional Publishing
Page : 458 pages
File Size : 46,8 Mb
Release : 1998
Category : Technology & Engineering
ISBN : UOM:39015040165808

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Electronic Connector Handbook by Robert S. Mroczkowski Pdf

Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.

Annual Connector Symposium Proceedings

Author : Anonim
Publisher : Unknown
Page : 100 pages
File Size : 46,9 Mb
Release : 1968
Category : Electric connectors
ISBN : UOM:39076001057582

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Annual Connector Symposium Proceedings by Anonim Pdf

Insulation/circuits

Author : Anonim
Publisher : Unknown
Page : 1864 pages
File Size : 50,5 Mb
Release : 1980
Category : Electric apparatus and appliances
ISBN : UIUC:30112008051333

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Insulation/circuits by Anonim Pdf

Includes a special annual issue: Insulation/circuits directory/encyclopedia.

Connectors and Interconnections Handbook

Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 54,9 Mb
Release : 1977
Category : Electric connectors
ISBN : LCCN:77088086

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Connectors and Interconnections Handbook by Anonim Pdf

Audio Systems Design and Installation

Author : Philip Giddings
Publisher : Focal Press
Page : 616 pages
File Size : 50,5 Mb
Release : 1990
Category : Music
ISBN : UOM:39015019672636

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Audio Systems Design and Installation by Philip Giddings Pdf

The ideal guide to audio systems. This practical hands-on tool is designed to help the audio professional find information quickly. Features many useful tables and checklists; illustrates the text with numerous photos and diagrams; improves and expedites system design; and provides tips and strategies for efficient audio system installation.

Electronic Packaging and Production

Author : Anonim
Publisher : Unknown
Page : 812 pages
File Size : 46,6 Mb
Release : 1993
Category : Electronic apparatus and appliances
ISBN : UIUC:30112008143742

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Electronic Packaging and Production by Anonim Pdf

Microelectronics Packaging Handbook

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 53,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461540861

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Encyclopedia of Chemical Technology

Author : Raymond Eller Kirk
Publisher : Unknown
Page : 968 pages
File Size : 53,5 Mb
Release : 1979
Category : Chemistry, Technical
ISBN : UOM:39015039943686

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Encyclopedia of Chemical Technology by Raymond Eller Kirk Pdf

Through-Silicon Vias for 3D Integration

Author : John Lau
Publisher : McGraw Hill Professional
Page : 514 pages
File Size : 48,7 Mb
Release : 2012-09-20
Category : Technology & Engineering
ISBN : 9780071785143

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Through-Silicon Vias for 3D Integration by John Lau Pdf

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging