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Grain Boundary Diffusion and Properties of Nanostructured Materials by Yu R. Kolobov Pdf
The authors examine the main relationships of the process of grain boundary diffusion in bicrystals, coarse-grained polycrystals and nanostructured materials. The results of investigations of diffusion-related processes of recovery, recystallisation and development of plastic deformation in creep, static and cyclic loading in bulk nanostructured materials produced by high-intensity plastic deformation are presented.
Semiconductor Devices and Integrated Electronics by A. G. Milnes Pdf
For some time there has been a need for a semiconductor device book that carries diode and transistor theory beyond an introductory level and yet has space to touch on a wider range of semiconductor device principles and applica tions. Such topics are covered in specialized monographs numbering many hun dreds, but the voluminous nature of this literature limits access for students. This book is the outcome of attempts to develop a broad course on devices and integrated electronics for university students at about senior-year level. The edu cational prerequisites are an introductory course in semiconductor junction and transistor concepts, and a course on analog and digital circuits that has intro duced the concepts of rectification, amplification, oscillators, modulation and logic and SWitching circuits. The book should also be of value to professional engineers and physicists because of both, the information included and the de tailed guide to the literature given by the references. The aim has been to bring some measure of order into the subject area examined and to provide a basic structure from which teachers may develop themes that are of most interest to students and themselves. Semiconductor devices and integrated circuits are reviewed and fundamental factors that control power levels, frequency, speed, size and cost are discussed. The text also briefly mentions how devices are used and presents circuits and comments on representative applications. Thus, the book seeks a balance be tween the extremes of device physics and circuit design.
H. J. BEYER AND H. KLEINPOPPEN During the preparation of Parts A and B of Progress in Atomic Spectros copy a few years ago, it soon became obvious that a comprehensive review and description of this field of modern atomic physics could not be achieved within the limitations of a two-volume book. While it was possible to include a large variety of spectroscopic methods, inevitably some fields had to be cut short or left out altogether. Other fields have developed so rapidly that they demand full cover in an additional volume. One of the major problems, already encountered during the prepar ation of the first volumes, was to keep track of new developments and approaches which result in spectroscopic data. We have to look far beyond the area of traditional atomic spectroscopy since methods of atomic and ion collision physics, nuclear physics, and even particle physics all make important contributions to our knowledge of the static and dynamical state of atoms and ions, and thereby greatly add to the continuing fascination of a field of research which has given us so much fundamental knowledge since the middle of the last century. In this volume, we have tried to strike a balance between contribu tions belonging to the more established fields of atomic structure and spectroscopy and those fields where atomic spectroscopy overlaps with other areas.
Materials Data for Cyclic Loading by Chr. Boller,T. Seeger Pdf
Materials Data for Cyclic Loading, Part D: Aluminium and Titanium Alloys presents materials data for cyclic loading which provide the basis for materials assessment by direct comparison of data or characteristic values and for estimating the crack initiation lives of aluminum and titanium alloys under constant and variable amplitude loading. The data include stress-strain curves, strain life curves, and mean stress parameter life curves for cyclic loading. Each data sheet takes up a maximum of four pages. The first page gives a description of the material and testing procedure. The chemical composition is always given in weight percent and corresponds to the values given in the literature referred to. The second and third pages show the diagrams for: stress-strain curves for monotonic and cyclic loading; strain life curve;, and mean stress (damage) parameter life curve according to the parameter of Smith, Watson and Topper. Unless indicated otherwise in the plots, the experiments were carried out at room temperature in laboratory air. The diagrams for the stress-strain relationships contain at the most three curves, one for monotonic loading and two for cyclic loading, the latter being evaluated from incremental step tests and constant amplitude tests. All three curves can be described approximately by an analytical function. This book will be of interest to materials scientists.