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Author : IEEE.,Components, Packaging, and Manufacturing Technology Society,Institute of Electrical and Electronics Engineers,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Components, Packaging & Manufacturing Technology Society. Malaysia Chapter
Publisher : Unknown
Page : 706 pages
File Size : 46,8 Mb
Release : 2008
Category : Components, Circuits, Devices & Systems
ISBN : 1424433924
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 40,5 Mb
Release : 2010
Category : Ball grid array technology
ISBN : 1424433932
Author : Avram Bar-Cohen,Jeffrey C. Suhling,Andrew A. O. Tay
Publisher : World Scientific
Page : 1079 pages
File Size : 47,9 Mb
Release : 2019
Category : Packaging
ISBN : 9789811209635
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Author : Anshuman Tripathi,Amit Soni,Ashish Shrivastava,Anil Swarnkar,Jagrati Sahariya
Publisher : Springer Nature
Page : 775 pages
File Size : 48,8 Mb
Release : 2022-06-13
Category : Technology & Engineering
ISBN : 9789811902529
This book compiles the best selected research papers presented during the 2nd International Conference on Intelligent Computing Techniques for Smart Energy Systems (ICTSES 2021), held at Manipal University, Jaipur, Rajasthan, India. It presents the diligent work of the research community where intelligent computing techniques are applied in allied fields of engineering ranging from engineering materials to electrical engineering to electronics and communication engineering- to computer-related fields. The theoretical research concepts are supported with extensive reviews highlighting the trends in the possible and real-life applications of computational intelligence. The high-quality content with broad range of the topics is thoroughly peer-reviewed and published on suitable recommendations.
Author : Lorenzo Mucchi,Matti Hämäläinen,Sara Jayousi,Simone Morosi
Publisher : Springer Nature
Page : 411 pages
File Size : 40,5 Mb
Release : 2019-11-15
Category : Medical
ISBN : 9783030348335
This book constitutes the refereed post-conference proceedings of the 14th EAI International Conference on Body Area Networks, BodyNets 2019, held in Florence, Italy, in October 2019. The 27 papers presented were selected from 54 submissions and issue new technologies to provide trustable measuring and communications mechanisms from the data source to medical health databases. Wireless body area networks (WBAN) are one major element in this process. Not only on-body devices but also technologies providing information from inside a body are in the focus of this conference. Dependable communications combined with accurate localization and behavior analysis will benefit WBAN technology and make the healthcare processes more effective.
Author : Navid Asadizanjani,Mir Tanjidur Rahman,Mark Tehranipoor
Publisher : Springer Nature
Page : 193 pages
File Size : 46,7 Mb
Release : 2021-02-15
Category : Technology & Engineering
ISBN : 9783030626099
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author : John H. Lau
Publisher : Springer
Page : 303 pages
File Size : 46,8 Mb
Release : 2018-04-05
Category : Technology & Engineering
ISBN : 9789811088841
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Author : Mohd Fadzli Bin Abdollah,Hilmi Amiruddin,Amrik Singh Phuman Singh
Publisher : Centre for Advanced Research on Energy
Page : 414 pages
File Size : 50,7 Mb
Release : 2020-12-01
Category : Technology & Engineering
ISBN : 9789672454366
This e-book is a compilation of 170 articles presented at the 7th Mechanical Engineering Research Day (MERD'20) - Kampus Teknologi UTeM (virtual), Melaka, Malaysia on 16 December 2020.
Author : Frank Suli
Publisher : Woodhead Publishing
Page : 490 pages
File Size : 50,7 Mb
Release : 2018-11-15
Category : Technology & Engineering
ISBN : 9780081023914
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Author : Richa Mishra,T.K. Bhattacharyya
Publisher : CRC Press
Page : 243 pages
File Size : 43,5 Mb
Release : 2023-12-11
Category : Technology & Engineering
ISBN : 9781003823414
This book introduces transdermal drug delivery and the developments that have taken place in various transdermal drug delivery techniques including the system-level design approach of a novel miniaturized medical device to offer precise and painless drug delivery via a skin-based transdermal route. It discusses the microelectromechanical systems (MEMS)-based fabrication technique and the design, fabrication and characterization of different MEMS-based components like microneedles and micropumps. It further includes a MEMS-based component micropump with design, analysis, fabrication and characterization of the transdermal drug delivery device and challenges encountered in the design improvements. Features: Summarizes transdermal drug delivery systems especially with a focus on MEMS and microneedles, including theoretical concepts Emphasizes system integration by describing simulation and design techniques as well as experimental fabrication Discusses system-level integration for miniaturized therapeutic devices Includes working simulation models covering microneedles and micropump analysis Explores future direction in development of pertinent devices. The book is aimed at researchers, professionals, and graduate students in biomedical engineering, microelectronics, micro-electro-mechanical-systems, and drug delivery.
Author : IEEE Staff,Institute of Electrical and Electronics Engineers,Components, Packaging & Manufacturing Technology Society. Malaysia Chapter
Publisher : Unknown
Page : 128 pages
File Size : 50,9 Mb
Release : 2012-11-06
Category : Electronic apparatus and appliances
ISBN : 1467343846
Author : S. W. Ricky Lee,Jeffery C. C. Lo,Mian Tao,Huaiyu Ye
Publisher : John Wiley & Sons
Page : 256 pages
File Size : 43,6 Mb
Release : 2021-09-17
Category : Technology & Engineering
ISBN : 9781118881552
FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Author : K. L. Mittal,Tanweer Ahsan
Publisher : John Wiley & Sons
Page : 293 pages
File Size : 47,8 Mb
Release : 2014-08-25
Category : Technology & Engineering
ISBN : 9781118831342
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author : Alor-Hernández, Giner
Publisher : IGI Global
Page : 674 pages
File Size : 43,6 Mb
Release : 2016-05-03
Category : Business & Economics
ISBN : 9781522501312
Competitive advantage is a key factor to the success of any business in modern society. To achieve this goal, effective strategies for process improvement must be researched and implemented into an organization. The Handbook of Research on Managerial Strategies for Achieving Optimal Performance in Industrial Processes examines optimization techniques for improved business operations and procedures in the industrial sector. Highlighting management techniques, innovative approaches, and technological tools, this publication is an essential reference source for professionals, researchers, consultants, upper-level students, and academicians interested in the advancement of knowledge in industrial communities.
Author : Sergey Yurish
Publisher : Lulu.com
Page : 536 pages
File Size : 52,7 Mb
Release : 2018-01-12
Category : Technology & Engineering
ISBN : 9788469786338
The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.