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2018 Ieee 38th International Electronics Manufacturing Technology Conference Iemt Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2018 Ieee 38th International Electronics Manufacturing Technology Conference Iemt book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 55,8 Mb
Release : 2018
Category : Electronic apparatus and appliances
ISBN : 1538662116
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 50,7 Mb
Release : 2018-09-04
Category : Electronic
ISBN : 1538662124
It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field Theme Packaging for the SMART world The selection is based on simplicity & catchy of the tag line, but focus on the new trends in our technological work world on the SMART devices The convergence to the SMART World unlocks the potential of packaging inside that builds smart things everywhere, from I4 0 (smart Industry & manufacture) to ADAS HEV (smart vehicle) to everything that s intelligent (smart city, smart devices, IoT, )
Author : I. Jeena Jacob,Selvanayaki Kolandapalayam Shanmugam,Selwyn Piramuthu,Przemyslaw Falkowski-Gilski
Publisher : Springer Nature
Page : 916 pages
File Size : 48,5 Mb
Release : 2021-01-08
Category : Technology & Engineering
ISBN : 9789811585302
This book discusses new cognitive informatics tools, algorithms and methods that mimic the mechanisms of the human brain which lead to an impending revolution in understating a large amount of data generated by various smart applications. The book is a collection of peer-reviewed best selected research papers presented at the International Conference on Data Intelligence and Cognitive Informatics (ICDICI 2020), organized by SCAD College of Engineering and Technology, Tirunelveli, India, during 8–9 July 2020. The book includes novel work in data intelligence domain which combines with the increasing efforts of artificial intelligence, machine learning, deep learning and cognitive science to study and develop a deeper understanding of the information processing systems.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 50,9 Mb
Release : 2016
Category : Electronic apparatus and appliances
ISBN : 1509034439
Annotation It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field.
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 40,6 Mb
Release : 2016-09-20
Category : Electronic
ISBN : 1509034447
It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field
Author : Anonim
Publisher : Unknown
Page : 388 pages
File Size : 53,6 Mb
Release : 1992
Category : Electronic apparatus and appliances
ISBN : UOM:39015026572084
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 44,6 Mb
Release : 2010
Category : Ball grid array technology
ISBN : 1424433932
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 388 pages
File Size : 43,8 Mb
Release : 2000-01-01
Category : Ball grid array technology
ISBN : 078036483X
Author : Anonim
Publisher : Unknown
Page : 0 pages
File Size : 55,8 Mb
Release : 1998
Category : Electronic apparatus and appliances
ISBN : OCLC:637783831
Author : Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht
Publisher : Springer Science & Business Media
Page : 254 pages
File Size : 49,9 Mb
Release : 2013-09-20
Category : Technology & Engineering
ISBN : 9781461457619
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author : Yufeng Jin,Zhiping Wang,Jing Chen
Publisher : CRC Press
Page : 232 pages
File Size : 45,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781439865972
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author : Anthony C. Fischer-Cripps
Publisher : Unknown
Page : 60 pages
File Size : 44,5 Mb
Release : 2005
Category : Surfaces (Technology)
ISBN : 0958552541
Author : Sanka Ganesan,Michael G. Pecht
Publisher : John Wiley & Sons
Page : 804 pages
File Size : 51,9 Mb
Release : 2006-02-17
Category : Technology & Engineering
ISBN : 9780471786177
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : Louis Redding,Rajkumar Roy
Publisher : Springer
Page : 457 pages
File Size : 43,8 Mb
Release : 2014-12-26
Category : Technology & Engineering
ISBN : 9783319121116
Demonstrating the latest research and analysis in the area of through-life engineering services (TES), this book utilizes case studies and expert analysis from an international array of practitioners and researchers – who together represent multiple manufacturing sectors: aerospace, railway and automotive – to maximize reader insights into the field of through-life engineering services. As part of the EPSRC Centre in Through-life Engineering Services program to support the academic and industrial community, this book presents an overview of non-destructive testing techniques and applications and provides the reader with the information needed to assess degradation and possible automation of through-life engineering service activities . The latest developments in maintenance-repair-overhaul (MRO) are presented with emphasis on cleaning technologies, repair and overhaul approaches and planning and digital assistance. The impact of these technologies on sustainable enterprises is also analyzed. This book will help to support the existing TES community and will provide future studies with a strong base from which to analyze and apply techn9olgical trends to real world examples.
Author : Pradeep Lall,Michael G. Pecht,Edward B. Hakim
Publisher : CRC Press
Page : 332 pages
File Size : 52,9 Mb
Release : 2020-07-09
Category : Technology & Engineering
ISBN : 9780429605598
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The