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Author : Anonim
Publisher : Unknown
Page : 300 pages
File Size : 40,9 Mb
Release : 1974
Category : Electronic apparatus and appliances
ISBN : UCSD:31822023199243
Author : Anonim
Publisher : Unknown
Page : 460 pages
File Size : 40,8 Mb
Release : 1978
Category : Electronic apparatus and appliances
ISBN : UCSD:31822015731425
Author : Anonim
Publisher : Unknown
Page : 412 pages
File Size : 43,5 Mb
Release : 1978
Category : Integrated circuits
ISBN : UOM:39015004479013
Author : Anonim
Publisher : Unknown
Page : 0 pages
File Size : 45,6 Mb
Release : 2023
Category : Electronic
ISBN : 9798350334982
Author : Anonim
Publisher : Unknown
Page : 2170 pages
File Size : 41,9 Mb
Release : 2012
Category : Detectors
ISBN : 1467319643
Author : Anonim
Publisher : Unknown
Page : 440 pages
File Size : 47,5 Mb
Release : 1976
Category : Electronic apparatus and appliances
ISBN : UCSD:31822025768201
Author : Dongkai Shangguan
Publisher : CRC Press
Page : 549 pages
File Size : 43,7 Mb
Release : 2024-06-28
Category : Technology & Engineering
ISBN : 9781040028698
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Anonim
Publisher : Unknown
Page : 440 pages
File Size : 48,9 Mb
Release : 1975
Category : Electronic apparatus and appliances
ISBN : UCSD:31822025768193
Author : Anonim
Publisher : Unknown
Page : 450 pages
File Size : 45,5 Mb
Release : 1979
Category : Electronic apparatus and appliances
ISBN : UCSD:31822025767948
Author : Environmental Research Institute of Michigan. Infrared Information and Analysis Center,United States. Office of Naval Research
Publisher : Unknown
Page : 1740 pages
File Size : 48,8 Mb
Release : 1978
Category : Infrared radiation
ISBN : UCR:31210003060389
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 54,8 Mb
Release : 2017-05-30
Category : Electronic
ISBN : 1509063161
premier components, packaging and technology conference
Author : Mike Golio
Publisher : CRC Press
Page : 1377 pages
File Size : 53,8 Mb
Release : 2000-12-20
Category : Technology & Engineering
ISBN : 9781420036763
The recent shift in focus from defense and government work to commercial wireless efforts has caused the job of the typical microwave engineer to change dramatically. The modern microwave and RF engineer is expected to know customer expectations, market trends, manufacturing technologies, and factory models to a degree that is unprecedented in the
Author : Mike Golio,Janet Golio
Publisher : CRC Press
Page : 736 pages
File Size : 50,5 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420006728
In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped components can be used in high frequency applications, their behavior does not resemble that observed at lower frequencies. RF and Microwave Passive and Active Technologies provides detailed information about a wide range of component technologies used in modern RF and microwave systems. Updated chapters include new material on such technologies as MEMS, device packaging, surface acoustic wave (SAW) filters, bipolar junction and heterojunction transistors, and high mobility electron transistors (HMETs). The book also features a completely rewritten section on wide bandgap transistors.
Author : Mike Golio
Publisher : CRC Press
Page : 2208 pages
File Size : 52,8 Mb
Release : 2018-10-08
Category : Technology & Engineering
ISBN : 9781439833230
By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 46,9 Mb
Release : 2016-05-31
Category : Electronic
ISBN : 1509012052
premier components, packaging and technology conference