Beam Solid Interactions For Materials Synthesis And Characterization Volume 354
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Beam-Solid Interactions for Materials Synthesis and Characterization: Volume 354 by Dale C. Jacobson Pdf
Proceedings of the title symposium, held at the 1994 MRS Fall Meeting in Boston, 28 November-2 December 1994. Selected papers that were presented in both oral and poster sessions are divided into six topical groups: ion beam processing; defects and diffusion; ion-beam modification of polymers; analysis and characterization; sputtering; and laser-assisted and induced processes. Annotation copyright by Book News, Inc., Portland, OR
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference. Key Features: The first comprehensive volume on ionized physical vapor deposition Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD Emphasizes practical applications in the area of IC fabrication and interconnect technology Serves as a guide to select the most appropriate technology for any deposition application *This single source saves time and effort by including comprehensive information at one's finger tips *The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD *The numerous practical applications assist the working engineer to select and refine thin film processes
This volume introduces the subject of laser ablation and desorption to scientists and engineers. It covers fundamental experimental and theoretical tools, models, and techniques, and introduces the most important applications. Clearly written and organized in a straightforward manner, Laser Ablation and Desorption lead the reader straight through the fundamentals of laser-surface interactions. Each chapter is self-contained and includes references to other chapters as necessary, so that readers may begin with the topic of greatest interest and follow the references to other aspects of the subject contained within the book. Key Features * Provides up-to-date information about one of the most active fields in physics today * Written and edited by major figures in the field of laser ablation and desorption * Represents the most comprehensive treatment of the state-of-the-art available
Ion-Solid Interactions for Materials Modification and Processing: Volume 396 by D. B. Poker Pdf
Several beam-solid interaction techniques have been developed that can either stand alone or be used in connection with others for materials processing, for fabrication of devices with enhanced electro-optical and mechanical properties, and with enhanced resistance to corrosion and erosion. For example, advances in focused ion beams (FIB) have brought out-of-reach ideas and applications to fruition. This book from MRS focuses on the developments in ion-beam-assisted processing of materials and reviews successful applications of the techniques. Topics include: fundamentals of ion-solid interactions; ion-beam mixing; radiation damage; insulators and wide bandgap materials; polymers; optical materials; plasma and ion-assisted techniques; metals and tribology; focused ion beams; fundamental semiconductor processing and compound semiconductors.
Electronic Packaging Materials Science VIII: Volume 390 by Robert C. Sundahl Pdf
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Materials Reliability in Microelectronics V: Volume 391 by Anthony S. Oates Pdf
This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Structure and Properties of Multilayered Thin Films: Volume 382 by Tai D. Nguyen Pdf
Layered thin film structures often have unusual properties which make them appealing in a wide range of applications. Fabrication of submicron and nanometer multilayers can produce metastable phases that many not be predicted from the bulk equilibrium phase diagrams. Understanding the growth, structure, stability and properties of multilayers, and controlling their microstructure through processing, are important in many applications. This book focuses on the relationship of structure and processing to the properties that are relevant to all researchers in the field of multilayers. Topics include: phase transformation and reaction kinetics; processing and growth; structural characterization; magnetic, electronic and optical properties; mechanical properties; X-ray optics; thin-film interfaces.
Strained Layer Epitaxy: Volume 379 by Eugene Fitzgerald Pdf
An interdisciplinary discussion of key materials issues and controversies in strained layer epitaxy is presented in this new volume from MRS. Research involving GeSi alloys and Si:C alloys are well represented. In the case of GeSi alloys, utilizing both strained and relaxed structures appears to be a strong component of the current research. Applications, devices and synthesis of improved relaxed and strained materials are featured. Special efforts to integrate the III-V and IV communities were also made during this symposium, and those efforts are reflected in the proceedings volume as well. Results on compositional graded layers in both the GeSi and III-V materials systems are presented. Topics include: general issues; ordering/low dimensional structures; characterization; device applications; growth of Si-based materials; and growth of compound semiconductors.
Polymer/Inorganic Interfaces II: Volume 385 by Materials Research Society. Meeting Pdf
Polymer/inorganic interfaces play a fundamental role in a wide range of applications, yet understanding of the fundamental interactions between polymers and inorganic phases, and how they affect the strength and durability of the interface, is still in its infancy. This proceedings volume addresses various aspects of polymer/inorganic interfaces, including surface preparation and treatment, characterization and interface performance. In addition, applications where the interface and its properties play a significant role, such as in biointerfaces, microelectronics, polymer composites and interpenetrating polymer networks, are discussed. Contributions to the volume examine various inorganic material/polymer interfaces with an emphasis on composites, epoxy resins, polyurethanes, poly(methyl methacrylate), polysiloxanes and various hydrophilic polymers. These are arranged in seven units that identify major research efforts in specific fields. They include: experimental probes of interfaces; biointeractions and biointerfaces; adhesion and interface durability; interface characterization; primers for interface preparation; interfaces and composites and surface preparation.
Thin Films for Integrated Optics Applications: Volume 392 by Bruce W. Wessels,Seth R. Marder,David M. Walba Pdf
The combination of electro-optic (EO) thin films with silicon-integrated circuits provides a promising approach to creating optoelectronic integrated circuits (OEICs) capable of sending information at data rates greater than 1 Gbit/second with low power consumption. These devices are of two basic types - very highly parallel (64K channels or greater) or very high speed (Gbits/ second/channel). Materials scientists, chemists and physicists come together in this new volume to discuss EO thin-film materials and devices, and to learn about advances in fields outside of their specific areas. Electro-optic materials featured include organic polymers and/or multilayers, liquid crystals, and inorganic thin films. Materials design, processing, and device issues are addressed. Topics include: nonlinear organics; liquid crystals for integrated optics; ferroelectric thin films; Er-doped inorganic thin films; inorganic thin film waveguides.
