Design For High Performance Low Power And Reliable 3d Integrated Circuits
Design For High Performance Low Power And Reliable 3d Integrated Circuits Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Design For High Performance Low Power And Reliable 3d Integrated Circuits book. This book definitely worth reading, it is an incredibly well-written.
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim Pdf
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman Pdf
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
High Performance Integrated Circuit Design by Emre Salman,Eby Friedman Pdf
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Three-Dimensional Integrated Circuit Design by Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar Pdf
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Handbook of Approximation Algorithms and Metaheuristics by Teofilo F. Gonzalez Pdf
Handbook of Approximation Algorithms and Metaheuristics, Second Edition reflects the tremendous growth in the field, over the past two decades. Through contributions from leading experts, this handbook provides a comprehensive introduction to the underlying theory and methodologies, as well as the various applications of approximation algorithms and metaheuristics. Volume 1 of this two-volume set deals primarily with methodologies and traditional applications. It includes restriction, relaxation, local ratio, approximation schemes, randomization, tabu search, evolutionary computation, local search, neural networks, and other metaheuristics. It also explores multi-objective optimization, reoptimization, sensitivity analysis, and stability. Traditional applications covered include: bin packing, multi-dimensional packing, Steiner trees, traveling salesperson, scheduling, and related problems. Volume 2 focuses on the contemporary and emerging applications of methodologies to problems in combinatorial optimization, computational geometry and graphs problems, as well as in large-scale and emerging application areas. It includes approximation algorithms and heuristics for clustering, networks (sensor and wireless), communication, bioinformatics search, streams, virtual communities, and more. About the Editor Teofilo F. Gonzalez is a professor emeritus of computer science at the University of California, Santa Barbara. He completed his Ph.D. in 1975 from the University of Minnesota. He taught at the University of Oklahoma, the Pennsylvania State University, and the University of Texas at Dallas, before joining the UCSB computer science faculty in 1984. He spent sabbatical leaves at the Monterrey Institute of Technology and Higher Education and Utrecht University. He is known for his highly cited pioneering research in the hardness of approximation; for his sublinear and best possible approximation algorithm for k-tMM clustering; for introducing the open-shop scheduling problem as well as algorithms for its solution that have found applications in numerous research areas; as well as for his research on problems in the areas of job scheduling, graph algorithms, computational geometry, message communication, wire routing, etc.
Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Publisher : John Wiley & Sons Page : 488 pages File Size : 47,9 Mb Release : 2019-05-06 Category : Technology & Engineering ISBN : 9783527338559
Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
3D Stacked Chips by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis Pdf
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
A Fresh Concept of Software-resemblant Hardware to Leap to 6G and Future Networks by Jacopo Iannacci Pdf
For a decade, with the uptake of 4G, we have become accustomed to the relentless increase in data and services on the move. The deployment of 5G is advancing crucial key performance indicators (KPIs), along with quality of service (QoS). Setting the horizon to 2030 and later, 6G will take the KPIs to numbers 100–1000 times better than 5G. Yet, the actual disruption of 6G and future networks (FN) will take place following other unprecedented paths. Artificial intelligence (AI) will be exploited in a threadlike fashion, at any level of the network physical infrastructure. This will introduce, to date unknown features, like self-sustaining, self-evolution and high-resilience of small portions of the infrastructure, pioneering the concept of a network of networks. Each segment of the infrastructure will bear a high degree of independence, while working at the same time as a whole, in full orchestration with the rest of the network. Given such a scenario, this book claims that the established and currently in use paradigms for the design and development of hardware–software (HW–SW) systems, are not appropriate to address the challenges of 6G and, further ahead, of FN. In response, unprecedented design approaches are suggested, relying on a fresh reinterpretation of the standard concept of HW, with specific attention to the network edge and edge intelligence (EI). This work develops some conceptual tools that may help address the technical challenges resulting from the intricate scenario sketched above. Within the mentioned HW reconceptualization, a pivotal role is forecasted for microtechnologies and nanotechnologies, intended with a broad meaning, which embraces, among others, devices, systems (MEMS/NEMS) and materials.
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by Luciano Lavagno,Igor L. Markov,Grant Martin,Louis K. Scheffer Pdf
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Physical Design for 3D Integrated Circuits by Aida Todri-Sanial,Chuan Seng Tan Pdf
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Solid-State Radiation Detectors by Salah Awadalla Pdf
Integrating aspects of engineering, application physics, and medical science, Solid-State Radiation Detectors: Technology and Applications offers a comprehensive review of new and emerging solid-state materials-based technologies for radiation detection. Each chapter is structured to address the current advantages and challenges of each material and technology presented, as well as to discuss novel research and applications. Featuring contributions from leading experts in industry and academia, this authoritative text: Covers modern semiconductors used for radiation monitoring Examines CdZnTe and CdTe technology for imaging applications including three-dimensional capability detectors Highlights interconnect technology for current pixel detectors Describes hybrid pixel detectors and their characterizations Tackles the integrated analog signal processing read-out front ends for particle detectors Considers new organic materials with direct bandgap for direct energy detection Summarizes recent developments involving lanthanum halide and cerium bromide scintillators Analyzes the potential of recent progress in the field of crystallogenesis, quantum dots, and photonics crystals toward a new concept of x- and gamma-ray detectors based on metamaterials Explores position-sensitivity photomultipliers and silicon photomultipliers for scintillation crystals Solid-State Radiation Detectors: Technology and Applications provides a valuable reference for engineers and scientists looking to enhance the performance of radiation detector technology for medical imaging and other applications.
Physical Design for 3D Integrated Circuits by Aida Todri-Sanial,Chuan Seng Tan Pdf
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Analog Electronics for Radiation Detection by Renato Turchetta Pdf
Analog Electronics for Radiation Detection showcases the latest advances in readout electronics for particle, or radiation, detectors. Featuring chapters written by international experts in their respective fields, this authoritative text: Defines the main design parameters of front-end circuitry developed in microelectronics technologies Explains the basis for the use of complementary metal–oxide semiconductor (CMOS) image sensors for the detection of charged particles and other non-consumer applications Delivers an in-depth review of analog-to-digital converters (ADCs), evaluating the pros and cons of ADCs integrated at the pixel, column, and per-chip levels Describes incremental sigma–delta ADCs, time-to-digital converter (TDC) architectures, and digital pulse-processing techniques complementary to analog processing Examines the fundamental parameters and front-end types associated with silicon photomultipliers used for single visible-light photon detection Discusses pixel sensors with per-pixel TDCs, channel density challenges, and emerging 3D technologies interconnecting detectors and electronics Thus, Analog Electronics for Radiation Detection provides a single source for state-of-the-art information on analog electronics for the readout of radiation detectors.
Through-Silicon Vias for 3D Integration by John Lau Pdf
A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging