Download Full eBooks in PDF
Designing High Speed Interconnect Circuits Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Designing High Speed Interconnect Circuits book. This book definitely worth reading, it is an incredibly well-written.
Author : Dennis Miller
Publisher : Unknown
Page : 0 pages
File Size : 52,8 Mb
Release : 2006
Category : Integrated circuits
ISBN : OCLC:300191662
Author : Stephen H. Hall,Garrett W. Hall,James A. McCall
Publisher : Wiley-IEEE Press
Page : 376 pages
File Size : 40,9 Mb
Release : 2000-09-08
Category : Computers
ISBN : UOM:39076002094824
A cutting-edge guide to the theory and practice of high-speed digital system design An understanding of high-speed interconnect phenomena is essential for digital designers who must deal with the challenges posed by the ever-increasing operating speeds of today's microprocessors. This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies. Written by three leading Intel engineers, High-Speed Digital System Design clarifies difficult and often neglected topics involving the effects of high frequencies on digital buses and presents a variety of proven techniques and application examples. Extensive appendices, formulas, modeling techniques as well as hundreds of figures are also provided. Coverage includes: * A thorough introduction to the digital aspects of basic transmission line theory * Crosstalk and nonideal transmission line effects on signal quality and timings * The impact of packages, vias, and connectors on signal integrity * The effects of nonideal return current paths, high frequency power delivery, and simultaneous switching noise * Explanations of how driving circuit characteristics affect the quality of the digital signal * Digital timing analysis at the system level that incorporates high-speed signaling effects into timing budgets * Methodologies for designing high-speed buses and handling the very large number of variables that affect interconnect performance * Radiated emission problems and how to minimize system noise * The practical aspects of making measurements in high-speed digital systems
Author : Dennis Miller
Publisher : Unknown
Page : 0 pages
File Size : 55,6 Mb
Release : 2004
Category : Electrical engineering
ISBN : 0974364967
Miller, who has dedicated over four decades to the electronics industry, has written this book for experienced engineers responsible for digital design and signal integrity who want to create digital connections that operate at microwave frequencies. Starting with a short history of digital interconnections, Miller continues with descriptions of tr
Author : Ramesh Harjani
Publisher : World Scientific
Page : 233 pages
File Size : 52,6 Mb
Release : 2006
Category : Technology & Engineering
ISBN : 9789812565907
MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible.The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O.
Author : Stephen H. Hall,Howard L. Heck
Publisher : John Wiley & Sons
Page : 608 pages
File Size : 51,9 Mb
Release : 2011-09-20
Category : Science
ISBN : 9781118210680
A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Author : Hanqiao Zhang,Steven Krooswyk,Jeffrey Ou
Publisher : Elsevier
Page : 272 pages
File Size : 43,6 Mb
Release : 2015-08-17
Category : Technology & Engineering
ISBN : 9780124186675
High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole. It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address their root causes. The authors offer a strong foundation that will help you get high speed digital system designs right the first time. Taking a systems design approach, High Speed Digital Design offers a progression from fundamental to advanced concepts, starting with transmission line theory, covering core concepts as well as recent developments. It then covers the challenges of signal and power integrity, offers guidelines for channel modeling, and optimizing link circuits. Tying together concepts presented throughout the book, the authors present Intel processors and chipsets as real-world design examples. Provides knowledge and guidance in the design of high speed digital circuits Explores the latest developments in system design Covers everything that encompasses a successful printed circuit board (PCB) product Offers insight from Intel insiders about real-world high speed digital design
Author : Ashok K. Goel
Publisher : John Wiley & Sons
Page : 433 pages
File Size : 49,9 Mb
Release : 2007-10-19
Category : Technology & Engineering
ISBN : 9780470165966
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Author : Yehea I. Ismail,Eby G. Friedman
Publisher : Springer Science & Business Media
Page : 310 pages
File Size : 42,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461516859
The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Author : Emre Salman,Eby Friedman
Publisher : McGraw Hill Professional
Page : 738 pages
File Size : 54,7 Mb
Release : 2012-08-21
Category : Technology & Engineering
ISBN : 9780071635769
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 40,8 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Howard W. Johnson,Martin Graham
Publisher : Unknown
Page : 447 pages
File Size : 50,5 Mb
Release : 1993-01-01
Category : Technology & Engineering
ISBN : 0133957241
Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.
Author : Hugo Veenstra,John R. Long
Publisher : Springer Science & Business Media
Page : 256 pages
File Size : 42,8 Mb
Release : 2008-06-04
Category : Technology & Engineering
ISBN : 9781402068843
Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the ‘interconnect’) and circuit design. This detailed book covers each of these topics from theory to practice, with sufficient detail to help you produce circuits that are ‘first-time right’. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.
Author : Terry C. Edwards,Michael B. Steer
Publisher : John Wiley & Sons
Page : 688 pages
File Size : 51,9 Mb
Release : 2016-02-01
Category : Technology & Engineering
ISBN : 9781118936184
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author : Anantha Chandrakasan
Publisher : Wiley-IEEE Press
Page : 592 pages
File Size : 46,7 Mb
Release : 2001
Category : Technology & Engineering
ISBN : STANFORD:36105028623390
The authors present readers with a compelling, one-stop, advanced system perspective on the intrinsic issues of digital system design. This invaluable reference prepares readers to meet the emerging challenges of the device and circuit issues associated with deep submicron technology. It incorporates future trends with practical, contemporary methodologies.
Author : Andrey Mezhiba,Eby G. Friedman
Publisher : Springer Science & Business Media
Page : 287 pages
File Size : 45,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461503996
Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.