Handbook Of Silicon Wafer Cleaning Technology 2nd Edition

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Handbook of Silicon Wafer Cleaning Technology

Author : Karen Reinhardt,Werner Kern
Publisher : William Andrew
Page : 760 pages
File Size : 46,5 Mb
Release : 2018-03-16
Category : Technology & Engineering
ISBN : 9780323510851

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Handbook of Silicon Wafer Cleaning Technology by Karen Reinhardt,Werner Kern Pdf

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Author : Karen Reinhardt,Werner Kern
Publisher : William Andrew
Page : 660 pages
File Size : 52,5 Mb
Release : 2008
Category : Science
ISBN : 1493303430

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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition by Karen Reinhardt,Werner Kern Pdf

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries. Covers processes and equipment, as well as new materials and changes required for the surface conditioning process. Editors are two of the top names in the field and are both extensively published. Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol."

Handbook of Semiconductor Wafer Cleaning Technology

Author : Werner Kern
Publisher : William Andrew
Page : 654 pages
File Size : 52,8 Mb
Release : 1993-12-31
Category : Science
ISBN : UOM:39015029095125

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Handbook of Semiconductor Wafer Cleaning Technology by Werner Kern Pdf

Discusses semiconductor wafer cleaning and the scientific and technical disciplines associated directly or indirectly with this subject. Intended to serve as a handbook for practitioners and professionals in the field.

Handbook for Cleaning for Semiconductor Manufacturing

Author : Karen A. Reinhardt,Richard F. Reidy
Publisher : John Wiley & Sons
Page : 596 pages
File Size : 44,6 Mb
Release : 2011-04-12
Category : Technology & Engineering
ISBN : 9781118099513

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Handbook for Cleaning for Semiconductor Manufacturing by Karen A. Reinhardt,Richard F. Reidy Pdf

Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Author : Karen Reinhardt,Werner Kern
Publisher : William Andrew
Page : 660 pages
File Size : 52,5 Mb
Release : 2008-12-10
Category : Technology & Engineering
ISBN : 9780815517733

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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition by Karen Reinhardt,Werner Kern Pdf

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning

Author : Rajiv Kohli,Kashmiri L. Mittal
Publisher : William Andrew
Page : 212 pages
File Size : 47,5 Mb
Release : 2016-11-04
Category : Technology & Engineering
ISBN : 9780323431729

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Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning by Rajiv Kohli,Kashmiri L. Mittal Pdf

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. Provides a comprehensive coverage of innovations in surface cleaning Written by established experts in the surface cleaning field, presenting an authoritative resource Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process

Handbook of Silicon Based MEMS Materials and Technologies

Author : Markku Tilli,Mervi Paulasto-Krockel,Veli-Matti Airaksinen,Sami Franssila,Veikko Lindroos,Ari Lehto,Teruaki Motooka
Publisher : Elsevier
Page : 668 pages
File Size : 55,8 Mb
Release : 2009-12-08
Category : Technology & Engineering
ISBN : 0815519885

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Handbook of Silicon Based MEMS Materials and Technologies by Markku Tilli,Mervi Paulasto-Krockel,Veli-Matti Airaksinen,Sami Franssila,Veikko Lindroos,Ari Lehto,Teruaki Motooka Pdf

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Author : Karen Reinhardt,Werner Kern
Publisher : William Andrew
Page : 660 pages
File Size : 55,7 Mb
Release : 2008-12-10
Category : Technology & Engineering
ISBN : 0815517734

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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition by Karen Reinhardt,Werner Kern Pdf

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques

Author : Rajiv Kohli,K.L. Mittal
Publisher : Elsevier
Page : 830 pages
File Size : 47,7 Mb
Release : 2018-11-27
Category : Technology & Engineering
ISBN : 9780128155783

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Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques by Rajiv Kohli,K.L. Mittal Pdf

Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques, Volume Eleven, part of the Developments in Surface Contamination and Cleaning series, provides a guide to recent advances in the application of cleaning techniques for the removal of surface contamination in various industries, such as aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. The material in this new edition compiles cleaning applications into one easy reference that has been fully updated to incorporate new applications and techniques. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. Presents the latest reviewed technical information on precision cleaning applications as written by established experts in the field Provides a single source on the applications of innovative precision cleaning techniques for a wide variety of industries Serves as a guide to the selection of precision cleaning techniques for specific applications

Advances in Systematic Creativity

Author : Leonid Chechurin,Mikael Collan
Publisher : Springer
Page : 369 pages
File Size : 45,6 Mb
Release : 2018-11-01
Category : Business & Economics
ISBN : 9783319780757

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Advances in Systematic Creativity by Leonid Chechurin,Mikael Collan Pdf

This book presents a collection of the most current research into systemic creativity and TRIZ, engendering discussion and the exchange of new discoveries in the field. With chapters on idea generation, decision making, creativity support tools, artificial intelligence and literature based discovery, it will include a number of instruments of inventive design automation. Consisting of 15-20 chapters written by leading experts in the theory for inventive problem solving (TRIZ) and adjacent fields focused upon heuristics, the contributions will add to the method of inventive design, dialogue with other tools and methods, and teaching creativity in management education through real-life case studies.

Case Studies in Micromechatronics

Author : Stephanus Büttgenbach,Iordania Constantinou,Andreas Dietzel,Monika Leester-Schädel
Publisher : Springer Nature
Page : 302 pages
File Size : 41,6 Mb
Release : 2020-05-15
Category : Technology & Engineering
ISBN : 9783662613207

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Case Studies in Micromechatronics by Stephanus Büttgenbach,Iordania Constantinou,Andreas Dietzel,Monika Leester-Schädel Pdf

The book “Case Studies in Micromechatronics – From Systems to Process” offers prominent sample applications of micromechatronic systems and the enabling fabrication technologies. The chosen examples represent five main fields of application: consumer electronics (pressure sensor), mobility and navigation (acceleration sensor), handling technology and automation (micro gripper), laboratory diagnostics (point of care system), and biomedical technology (smart skin). These five sample systems are made from different materials requiring a large variety of modern fabrication methods and design rules, which are explained in detail. As a result, an inverted introduction “from prominent applications to base technologies” is provided. Examples of applications are selected to offer a broad overview of the development environment of micromechatronic systems including established as well as cutting-edge microfabrication technologies.

Particle Adhesion and Removal

Author : K. L. Mittal,Ravi Jaiswal
Publisher : John Wiley & Sons
Page : 576 pages
File Size : 47,8 Mb
Release : 2015-02-02
Category : Technology & Engineering
ISBN : 9781118831557

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Particle Adhesion and Removal by K. L. Mittal,Ravi Jaiswal Pdf

The book provides a comprehensive and easily accessiblereference source covering all important aspects of particleadhesion and removal. The core objective is to cover bothfundamental and applied aspects of particle adhesion and removalwith emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion andremoval. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) tounderstand particle-particle and particle-substrateinteractions. 4. Mechanics of adhesion of micro- and nanoscaleparticles. 5. Various factors affecting particle adhesion to a variety ofsubstrates. 6. Surface modification techniques to modulate particleadhesion. 7. Various cleaning methods (both wet & dry) for particleremoval. 8. Relevance of particle adhesion in a host of technologies rangingfrom simple to ultra-sophisticated.

Developments in Surface Contamination and Cleaning, Vol. 1

Author : Rajiv Kohli,Kashmiri L. Mittal
Publisher : William Andrew
Page : 894 pages
File Size : 55,8 Mb
Release : 2015-11-12
Category : Technology & Engineering
ISBN : 9780323312707

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Developments in Surface Contamination and Cleaning, Vol. 1 by Rajiv Kohli,Kashmiri L. Mittal Pdf

Developments in Surface Contamination and Cleaning, Vol. 1: Fundamentals and Applied Aspects, Second Edition, provides an excellent source of information on alternative cleaning techniques and methods for characterization of surface contamination and validation. Each volume in this series contains a particular topical focus, covering the key techniques and recent developments in the area. This volume forms the heart of the series, covering the fundamentals and application aspects, characterization of surface contaminants, and methods for removal of surface contamination. In addition, new cleaning techniques effective at smaller scales are considered and employed for removal where conventional cleaning techniques fail, along with new cleaning techniques for molecular contaminants. The Volume is edited by the leading experts in small particle surface contamination and cleaning, providing an invaluable reference for researchers and engineers in R&D, manufacturing, quality control, and procurement specification in a multitude of industries such as aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. Provides best-practice guidance for scientists and engineers engaged in surface cleaning or those who handle the consequences of surface contamination Addresses the continuing trends of shrinking device size and contamination vulnerability in a range of industries as spearheaded by the semiconductor industry Presents state-of-the-art survey information on precision cleaning and characterization methods as written by a team of world-class experts in the field

Handbook of Semiconductor Manufacturing Technology

Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 3276 pages
File Size : 50,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351829823

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Handbook of Semiconductor Manufacturing Technology by Yoshio Nishi,Robert Doering Pdf

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
Page : 764 pages
File Size : 52,8 Mb
Release : 2007-10-19
Category : Technology & Engineering
ISBN : 9780471719199

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Microelectronic Applications of Chemical Mechanical Planarization by Yuzhuo Li Pdf

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.