High Frequency Characterization Of Electronic Packaging

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High-Frequency Characterization of Electronic Packaging

Luc Martens
High Frequency Characterization of Electronic Packaging Book PDF

Author : Luc Martens
Publisher : Springer Science & Business Media
Page : 169 pages
File Size : 46,5 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461556237

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High-Frequency Characterization of Electronic Packaging by Luc Martens Pdf

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition

Jose Moreira,Hubert Werkmann
An Engineer s Guide to Automated Testing of High Speed Interfaces Second Edition Book PDF

Author : Jose Moreira,Hubert Werkmann
Publisher : Artech House
Page : 706 pages
File Size : 53,9 Mb
Release : 2016-04-30
Category : Technology & Engineering
ISBN : 9781608079865

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An Engineer's Guide to Automated Testing of High-Speed Interfaces, Second Edition by Jose Moreira,Hubert Werkmann Pdf

This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.

Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies

Vadim Issakov
Microwave Circuits for 24 GHz Automotive Radar in Silicon based Technologies Book PDF

Author : Vadim Issakov
Publisher : Springer Science & Business Media
Page : 218 pages
File Size : 40,5 Mb
Release : 2010-08-05
Category : Technology & Engineering
ISBN : 9783642135989

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Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies by Vadim Issakov Pdf

There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.

RF and Microwave Microelectronics Packaging II

Ken Kuang,Rick Sturdivant
RF and Microwave Microelectronics Packaging II Book PDF

Author : Ken Kuang,Rick Sturdivant
Publisher : Springer
Page : 172 pages
File Size : 55,5 Mb
Release : 2017-03-09
Category : Technology & Engineering
ISBN : 9783319516974

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RF and Microwave Microelectronics Packaging II by Ken Kuang,Rick Sturdivant Pdf

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Interconnection Noise in VLSI Circuits

Francesc Moll,Miquel Roca
Interconnection Noise in VLSI Circuits Book PDF

Author : Francesc Moll,Miquel Roca
Publisher : Springer Science & Business Media
Page : 214 pages
File Size : 55,7 Mb
Release : 2007-05-08
Category : Technology & Engineering
ISBN : 9780306487194

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Interconnection Noise in VLSI Circuits by Francesc Moll,Miquel Roca Pdf

This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Modeling Analysis Design and Tests for Electronics Packaging beyond Moore Book PDF

Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Publisher : Woodhead Publishing
Page : 436 pages
File Size : 50,8 Mb
Release : 2019-11-14
Category : Technology & Engineering
ISBN : 9780081025338

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao Pdf

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Grounding and Shielding

Ralph Morrison
Grounding and Shielding Book PDF

Author : Ralph Morrison
Publisher : John Wiley & Sons
Page : 224 pages
File Size : 48,6 Mb
Release : 2016-03-24
Category : Science
ISBN : 9781119183730

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Grounding and Shielding by Ralph Morrison Pdf

Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field. Grounding and Shielding: Circuits and Interference, Sixth Edition: Includes new material on vias and field control, capacitors as transmission lines, first energy sources, and high speed designs using boards with only two layers Demonstrates how circuit geometry controls performance from dc to gigahertz Examines the use of multi-shielded transformers in clean-power installations Provides effective techniques for handling noise problems in analog and digital circuits Discusses how to use conductor geometry to improve performance, limit radiation, and reduce susceptibility to all types of hardware and systems Grounding and Shielding: Circuits and Interference, Sixth Edition is an updated guide for circuit design engineers and technicians. It will also serve as a reference for engineers in the semiconductor device industry.

RF and Microwave Microelectronics Packaging

Ken Kuang,Franklin Kim,Sean S. Cahill
RF and Microwave Microelectronics Packaging Book PDF

Author : Ken Kuang,Franklin Kim,Sean S. Cahill
Publisher : Springer Science & Business Media
Page : 295 pages
File Size : 44,9 Mb
Release : 2009-12-01
Category : Technology & Engineering
ISBN : 9781441909848

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RF and Microwave Microelectronics Packaging by Ken Kuang,Franklin Kim,Sean S. Cahill Pdf

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Signal and Power Integrity - Simplified

Eric Bogatin
Signal and Power Integrity Simplified Book PDF

Author : Eric Bogatin
Publisher : Pearson Education
Page : 793 pages
File Size : 44,9 Mb
Release : 2009-07-13
Category : Technology & Engineering
ISBN : 9780137035038

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Signal and Power Integrity - Simplified by Eric Bogatin Pdf

The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.

The Handbook of Advanced Materials

Anonim
The Handbook of Advanced Materials Book PDF

Author : Anonim
Publisher : John Wiley & Sons
Page : 656 pages
File Size : 53,6 Mb
Release : 2004-04-27
Category : Science
ISBN : 9780471454755

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The Handbook of Advanced Materials by Anonim Pdf

Written to educate readers about recent advances in the area of new materials used in making products. Materials and their properties usually limit the component designer. * Presents information about all of these advanced materials that enable products to be designed in a new way * Provides a cost effective way for the design engineer to become acquainted with new materials * The material expert benefits by being aware of the latest development in all these areas so he/she can focus on further improvements

Antenna-in-Package Technology and Applications

Duixian Liu,Yueping Zhang
Antenna in Package Technology and Applications Book PDF

Author : Duixian Liu,Yueping Zhang
Publisher : John Wiley & Sons
Page : 416 pages
File Size : 49,8 Mb
Release : 2020-03-10
Category : Technology & Engineering
ISBN : 9781119556640

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Antenna-in-Package Technology and Applications by Duixian Liu,Yueping Zhang Pdf

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Principles and Techniques of Electromagnetic Compatibility

Christos Christopoulos
Principles and Techniques of Electromagnetic Compatibility Book PDF

Author : Christos Christopoulos
Publisher : CRC Press
Page : 534 pages
File Size : 50,9 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420006339

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Principles and Techniques of Electromagnetic Compatibility by Christos Christopoulos Pdf

Circuits are faster and more tightly packed than ever, wireless technologies increase the electromagnetic (EM) noise environment, new materials entail entirely new immunity issues, and new standards govern the field of electromagnetic compatibility (EMC). Maintaining the practical and comprehensive approach of its predecessor, Principles and Techniques of Electromagnetic Compatibility, Second Edition reflects these emerging challenges and new technologies introduced throughout the decade since the first edition appeared. What's new in the Second Edition? Characterization and testing for high-speed design of clock frequencies up to and above 6 GHz Updates to the regulatory framework governing EM compliance Additional coverage of the printed circuit board (PCB) environment as well as additional numerical tools An entirely new section devoted to new applications, including signal integrity, wireless and broadband technologies, EMC safety, and statistical EMC Added coverage of new materials such as nanomaterials, band gap devices, and composites Along with new and updated content, this edition also includes additional worked examples that demonstrate how estimates can guide the early stages of design. The focus remains on building a sound foundation on the fundamental concepts and linking this to practical applications, rather than supplying application-specific fixes that do not easily generalize to other areas.

Electrical Design of Through Silicon Via

Manho Lee,Jun So Pak,Joungho Kim
Electrical Design of Through Silicon Via Book PDF

Author : Manho Lee,Jun So Pak,Joungho Kim
Publisher : Springer
Page : 280 pages
File Size : 45,8 Mb
Release : 2014-05-11
Category : Technology & Engineering
ISBN : 9789401790383

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Electrical Design of Through Silicon Via by Manho Lee,Jun So Pak,Joungho Kim Pdf

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Dielectric and Conductor-loss Characterization and Measurements on Electronic Packaging Materials

James Baker-Jarvis,Michael D. Janezic,Bill Riddle,Christopher L. Holloway,N... G. Paulter,J... E. Blendell
Dielectric and Conductor loss Characterization and Measurements on Electronic Packaging Materials Book PDF

Author : James Baker-Jarvis,Michael D. Janezic,Bill Riddle,Christopher L. Holloway,N... G. Paulter,J... E. Blendell
Publisher : Unknown
Page : 152 pages
File Size : 43,7 Mb
Release : 2001
Category : Electronic measurements
ISBN : 0160664896

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Dielectric and Conductor-loss Characterization and Measurements on Electronic Packaging Materials by James Baker-Jarvis,Michael D. Janezic,Bill Riddle,Christopher L. Holloway,N... G. Paulter,J... E. Blendell Pdf

This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low and high temperature co-fired ceramic substrates, printed wiring boards, and other packaging materials. The most commonly used methods are presented. We particularly emphasize method that can be used nondestructively either in the laboratory or on the assembly line. We begin with an overview of pertinent electrical properties of sustrate materials and conductors. We then describe frequency-dependent metal losses on conductors. We also overview cavity and dielectric resonators, full-sheet resonance, coaxial probe, stripline, and capacitive methods. The frequency ranges of applicability and typical uncertainties associated with the methods are summarized. We also present measurement results of many substrate materials.

Handbook of 3D Integration, Volume 4

Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Handbook of 3D Integration Volume 4 Book PDF

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 265 pages
File Size : 52,8 Mb
Release : 2019-01-25
Category : Technology & Engineering
ISBN : 9783527697045

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Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.