Led Packaging Technologies

Author : Luruthudass Annaniah,Mohamed Salleh M. Saheed,Rajan Jose
Publisher : John Wiley & Sons
Page : 181 pages
File Size : 50,5 Mb
Release : 2023-11-13
Category : Technology & Engineering
ISBN : 9783527348787

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LED Packaging Technologies by Luruthudass Annaniah,Mohamed Salleh M. Saheed,Rajan Jose Pdf

Up-to-date practitioner's guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries. LED Packaging Technologies includes information on: History of primitive lighting in human civilization to the invention of modern LEDs based lighting, and historic evolution of LED packaging technology Basic light emission and extraction technology in LED packages, covering package design impacting light emission and extraction Medical industry applications of LED, especially in healthcare treatments, such as in skin rejuvenation and wound healing and closure Quantum confinement phenomena and size-dependent optical properties of quantum dots, and the advancement of future quantum dot LEDs Covering the fundamentals, design, and manufacturing of LED packaging technology and assisting in removing some of the barriers in development of LED packaging and new applications, LED Packaging Technologies is an essential source of information for engineers in the LED and lighting industries, as well as researchers in academia.

Author : Shen Liu,Xiaobing Luo
Publisher : John Wiley & Sons
Page : 375 pages
File Size : 49,5 Mb
Release : 2011-07-05
Category : Technology & Engineering
ISBN : 9780470828403

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LED Packaging for Lighting Applications by Shen Liu,Xiaobing Luo Pdf

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Author : Yufeng Jin,Zhiping Wang,Jing Chen
Publisher : CRC Press
Page : 233 pages
File Size : 40,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351832977

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Introduction to Microsystem Packaging Technology by Yufeng Jin,Zhiping Wang,Jing Chen Pdf

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Author : Shen Liu,Xiaobing Luo
Publisher : John Wiley & Sons
Page : 375 pages
File Size : 48,8 Mb
Release : 2011-07-05
Category : Technology & Engineering
ISBN : 9780470827833

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LED Packaging for Lighting Applications by Shen Liu,Xiaobing Luo Pdf

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Author : Cher Ming Tan,Preetpal Singh
Publisher : Woodhead Publishing
Page : 190 pages
File Size : 50,9 Mb
Release : 2022-09-24
Category : Technology & Engineering
ISBN : 9780128224076

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Reliability and Failure Analysis of High-Power LED Packaging by Cher Ming Tan,Preetpal Singh Pdf

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs

Author : Anonim
Publisher : TrendForce
Page : 52 pages
File Size : 54,8 Mb
Release : 2024-06-27
Category : Electronic
ISBN : 8210379456XXX

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BeLight Vol. 02 by Anonim Pdf

Author : Jian-Jang Huang,Hao-Chung Kuo,Shyh-Chiang Shen
Publisher : Woodhead Publishing
Page : 822 pages
File Size : 44,8 Mb
Release : 2017-10-24
Category : Technology & Engineering
ISBN : 9780081019436

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Nitride Semiconductor Light-Emitting Diodes (LEDs) by Jian-Jang Huang,Hao-Chung Kuo,Shyh-Chiang Shen Pdf

Nitride Semiconductor Light-Emitting Diodes (LEDs): Materials, Technologies, and Applications, Second Edition reviews the fabrication, performance and applications of the technology, encompassing the state-of-the-art material and device development, along with considerations regarding nitride-based LED design. This updated edition is based on the latest research and advances, including two new chapters on LEDs for large displays and laser lighting. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques, the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. The book also addresses the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. It is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. Features new chapters on laser lighting, addressing the latest advances on this topic Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting Provides a comprehensive discussion of gallium nitride on both silicon and sapphire substrates

Author : Xiaobing Luo,Run Hu,Bin Xie
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 49,5 Mb
Release : 2024-05-29
Category : Technology & Engineering
ISBN : 9781119179290

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Thermal Management for Opto-electronics Packaging and Applications by Xiaobing Luo,Run Hu,Bin Xie Pdf

A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Author : S. W. Ricky Lee,Jeffery C. C. Lo,Mian Tao,Huaiyu Ye
Publisher : John Wiley & Sons
Page : 256 pages
File Size : 53,6 Mb
Release : 2021-09-17
Category : Technology & Engineering
ISBN : 9781118881552

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From LED to Solid State Lighting by S. W. Ricky Lee,Jeffery C. C. Lo,Mian Tao,Huaiyu Ye Pdf

FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

Author : Jinmin Li,Junxi Wang,Xiaoyan Yi,Zhiqiang Liu,Tongbo Wei,Jianchang Yan,Bin Xue
Publisher : Springer Nature
Page : 295 pages
File Size : 46,7 Mb
Release : 2020-08-31
Category : Technology & Engineering
ISBN : 9789811579493

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III-Nitrides Light Emitting Diodes: Technology and Applications by Jinmin Li,Junxi Wang,Xiaoyan Yi,Zhiqiang Liu,Tongbo Wei,Jianchang Yan,Bin Xue Pdf

The book provides an overview of III-nitride-material-based light-emitting diode (LED) technology, from the basic material physics to the latest advances in the field, such as homoepitaxy and heteroepitaxy of the materials on different substrates. It also includes the latest advances in the field, such as approaches to improve quantum efficiency and reliability as well as novel structured LEDs. It explores the concept of material growth, chip structure, packaging, reliability and application of LEDs. With spectra coverage from ultraviolet (UV) to entire visible light wavelength, the III-nitride-material-based LEDs have a broad application potential, and are not just limited to illumination. These novel applications, such as health & medical, visible light communications, fishery and horticulture, are also discussed in the book.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 40,9 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : Clemens J.M. Lasance,András Poppe
Publisher : Springer Science & Business Media
Page : 551 pages
File Size : 48,7 Mb
Release : 2013-09-17
Category : Technology & Engineering
ISBN : 9781461450917

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Thermal Management for LED Applications by Clemens J.M. Lasance,András Poppe Pdf

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Author : Tao Han,Haibo Ruan,Shixiu Cao,Youwei Guan,Dianyong Tang,Xin Yang
Publisher : World Scientific
Page : 494 pages
File Size : 45,7 Mb
Release : 2021-05-25
Category : Science
ISBN : 9789811230622

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Photoelectric Materials And Devices by Tao Han,Haibo Ruan,Shixiu Cao,Youwei Guan,Dianyong Tang,Xin Yang Pdf

This book mainly introduces the basic theory and physical characteristics of photoelectric materials, the preparation technology of photoelectric components, the working principle, the latest application, the latest progress of photoelectric materials and devices technology and the correlation with other technologies. The content mainly involves the theoretical basis of photoelectric materials, micro-nano photoelectric materials and devices, semiconductor luminescent materials and devices, inorganic photoluminescence materials, LED packaging technology, transparent conductive materials, touch screen, display screen, solar cell materials and the basic principles and development trend of their applications. In particular, the book gives a systematic theoretical analysis of new photoelectric materials and devices, such as optoelectronic materials and devices, transparent conductive materials, and provides application examples.

Author : Rajagopal
Publisher : Springer Nature
Page : 312 pages
File Size : 44,9 Mb
Release : 2019-11-20
Category : Business & Economics
ISBN : 9783030339265

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Transgenerational Marketing by Rajagopal Pdf

This book critically examines the evolution of marketing scholarship over generations from Marketing 1.0 to 4.0. It argues that most firms look to gain competitive advantage in the marketplace by driving tactical moves, inculcating small cost-effective changes in marketing approaches. Often, strategic choices of companies lean towards developing competitive differentiations that enable consumers to realize the value of money, causing loyalty shifts in the competitive marketplace. The book focuses on the consumer as the pivot of marketing and argues that the consumer serves as a bidirectional channel during pre-and post-purchase period. It explains how consumer affections sentimentally and emotionally help in growing the brands and companies over generations. This book significantly contributes to the existing literature and serves as a learning post and a think tank for students, researchers, and business managers.

Author : Azman Ismail,Wardiah Mohd Dahalan,Andreas Öchsner
Publisher : Springer Nature
Page : 375 pages
File Size : 46,7 Mb
Release : 2022-03-11
Category : Technology & Engineering
ISBN : 9783030929640

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Advanced Materials and Engineering Technologies by Azman Ismail,Wardiah Mohd Dahalan,Andreas Öchsner Pdf

This book reports on various real-world and global engineering problems while touching on evolving design strategies. The chapters were selected from the 2nd International Conference on Marine and Advanced Technologies 2021 (ICMAT 2021). The papers discuss best practice and theory in relation to multi-disciplinary approaches in materials engineering technology. Among the topics are advanced materials, applied science, marine engineering and energy application.