Download Full eBooks in PDF
Noise Coupling In System On Chip Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Noise Coupling In System On Chip book. This book definitely worth reading, it is an incredibly well-written.
Author : Thomas Noulis
Publisher : Unknown
Page : 128 pages
File Size : 40,8 Mb
Release : 2018
Category : Electronic circuits
ISBN : 1138746193
Author : Thomas Noulis
Publisher : CRC Press
Page : 519 pages
File Size : 44,5 Mb
Release : 2018-01-09
Category : Technology & Engineering
ISBN : 9781138031616
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Author : Stéphane Donnay,Georges Gielen
Publisher : Springer Science & Business Media
Page : 287 pages
File Size : 49,8 Mb
Release : 2006-05-31
Category : Technology & Engineering
ISBN : 9780306481703
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Author : Ahmed Helmy,Mohammed Ismail
Publisher : Springer Science & Business Media
Page : 119 pages
File Size : 45,9 Mb
Release : 2008-03-23
Category : Technology & Engineering
ISBN : 9781402081668
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Author : X. Aragones,J.L. Gonzalez,Antonio Rubio
Publisher : Springer Science & Business Media
Page : 242 pages
File Size : 41,6 Mb
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 9781475730135
Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Author : Krzysztof Iniewski
Publisher : John Wiley & Sons
Page : 328 pages
File Size : 42,7 Mb
Release : 2009-02-18
Category : Science
ISBN : 0470451807
A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
Author : Bashir M. Al-Hashimi
Publisher : IET
Page : 940 pages
File Size : 53,9 Mb
Release : 2006-01-31
Category : Technology & Engineering
ISBN : 9780863415524
This book highlights both the key achievements of electronic systems design targeting SoC implementation style, and the future challenges presented by the continuing scaling of CMOS technology.
Author : Stephane Bronckers,Geert Van der Plas,Yves Rolain,Gerd Vandersteen
Publisher : Artech House
Page : 272 pages
File Size : 53,5 Mb
Release : 2010
Category : Technology & Engineering
ISBN : 9781596932722
This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Author : Luciano Lavagno,Louis Scheffer,Grant Martin
Publisher : CRC Press
Page : 608 pages
File Size : 44,9 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420007954
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Author : Luciano Lavagno,Igor L. Markov,Grant Martin,Louis K. Scheffer
Publisher : CRC Press
Page : 893 pages
File Size : 53,5 Mb
Release : 2017-02-03
Category : Technology & Engineering
ISBN : 9781351831000
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author : Louis Scheffer,Luciano Lavagno,Grant Martin
Publisher : CRC Press
Page : 544 pages
File Size : 41,8 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420007947
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The first volume, EDA for IC System Design, Verification, and Testing, thoroughly examines system-level design, microarchitectural design, logical verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for IC designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. Save on the complete set.
Author : Krzysztof Iniewski
Publisher : CRC Press
Page : 762 pages
File Size : 41,9 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351838207
Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.
Author : Rob A. Rutenbar,Georges G. E. Gielen
Publisher : John Wiley & Sons
Page : 773 pages
File Size : 44,9 Mb
Release : 2002-05-06
Category : Technology & Engineering
ISBN : 9780471227823
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Author : Raminderpal Singh
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 54,7 Mb
Release : 2001-12-12
Category : Technology & Engineering
ISBN : 9780471150428
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Author : Jari Nurmi,H. Tenhunen,J. Isoaho,Axel Jantsch
Publisher : Springer Science & Business Media
Page : 450 pages
File Size : 42,8 Mb
Release : 2006-03-20
Category : Technology & Engineering
ISBN : 9781402078361
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.