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Author : F. H. Murray,G. Young
Publisher : Unknown
Page : 12 pages
File Size : 42,7 Mb
Release : 1944
Category : Elasticity
ISBN : UOM:39015086572842
Author : U.S. Atomic Energy Commission
Publisher : Unknown
Page : 1104 pages
File Size : 42,7 Mb
Release : 1955
Category : Nuclear engineering
ISBN : UGA:32108024656814
Author : Anonim
Publisher : Unknown
Page : 1098 pages
File Size : 41,9 Mb
Release : 1955
Category : Nuclear engineering
ISBN : CORNELL:31924004695999
Author : John F. Hogerton,Walter Henry Zinn
Publisher : Unknown
Page : 1088 pages
File Size : 54,8 Mb
Release : 1955
Category : Nuclear reactors
ISBN : UOM:39015086444695
Author : U.S. Atomic Energy Commission
Publisher : Unknown
Page : 1102 pages
File Size : 54,8 Mb
Release : 1955
Category : Nuclear engineering
ISBN : SRLF:D0001516525
Author : John Lau
Publisher : Springer Science & Business Media
Page : 904 pages
File Size : 54,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781468477672
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author : United States. Wright Air Development Division
Publisher : Unknown
Page : 1540 pages
File Size : 47,7 Mb
Release : 1956
Category : Aeronautics
ISBN : UOM:39015022486677
Author : Anonim
Publisher : Unknown
Page : 28 pages
File Size : 46,7 Mb
Release : 1954
Category : Energy development
ISBN : CORNELL:31924105661908
Author : U.S. Atomic Energy Commission
Publisher : Unknown
Page : 28 pages
File Size : 45,6 Mb
Release : 1954
Category : Nuclear engineering
ISBN : UOM:39015095048420
Author : D. J. Johns
Publisher : Elsevier
Page : 230 pages
File Size : 46,8 Mb
Release : 2013-10-22
Category : Technology & Engineering
ISBN : 9781483227047
Thermal Stress Analyses deals with both elastic and plastic thermal stresses produced from large variations in temperature and thermal expansion in materials whose properties are time-independent. This book is composed of eight chapters. The opening chapter illustrates the general three-dimensional thermoelastic problem, which requires the determination of stress, strains and displacements, when the body forces and boundary conditions are known while the next chapter demonstrate a simpler, two-dimensional formulation involving plane strain and plane stress. The succeeding five chapters describe thermal stresses in various structures, including in thin plates, beams, circular cylinders, and shells. The closing chapters consider the mechanism of thermal buckling and sundry design problems. This book is of value to mechanical engineers, and to mechanical engineering teachers and students.
Author : United States. Superintendent of Documents
Publisher : Unknown
Page : 1560 pages
File Size : 51,5 Mb
Release : 1951
Category : Government publications
ISBN : CORNELL:31924055800142
February issue includes Appendix entitled Directory of United States Government periodicals and subscription publications; September issue includes List of depository libraries; June and December issues include semiannual index.
Author : James M. Jacobs,Gifford A. Young
Publisher : Unknown
Page : 180 pages
File Size : 48,9 Mb
Release : 1957
Category : Heat
ISBN : UOM:39015095049030
Author : M.F. Hassan,S.M. Megahed
Publisher : Elsevier
Page : 665 pages
File Size : 55,5 Mb
Release : 2000-01-31
Category : Technology & Engineering
ISBN : 9780080530147
The International Conference on Mechanical Design and Production has over the years established itself as an excellent forum for the exchange of ideas in these established fields. The first of these conferences was held in 1979. The seventh, and most recent, conference in the series was held in Cairo during February 15-17, 2000. International engineers and scientists gathered to exchange experiences and highlight the state-of-the-art research in the fields of mechanical design and production. In addition a heavy emphasis was placed on the issue of technology transfer. Over 100 papers were accepted for presentation at the conference. Current Advances in Mechanical Design & Production VII does not, however, attempt to publish the complete work presented but instead offers a sample that represents the quality and breadth of both the work and the conference. Ten invited papers and 54 ordinary papers have been selected for inclusion in these proceedings. They cover a range of basic and applied topics that can be classified into six main categories: System Dynamics, Solid Mechanics, Material Science, Manufacturing Processes, Design and Tribology, and Industrial Engineering and its Applications.
Author : V.V. Vasiliev
Publisher : CRC Press
Page : 517 pages
File Size : 55,8 Mb
Release : 2017-10-05
Category : Science
ISBN : 9781351432566
This book compiles techniques used to analyze composite structural elements ranging from beams through plates to stiffened shells. The content is suitable for graduate-level students with a basic background in mechanics of composite materials. Moreover, this book will be placed in an active spot on the bookshelves of composite structures designers as well as researchers.
Author : M. M. R. Williams
Publisher : Elsevier
Page : 258 pages
File Size : 52,9 Mb
Release : 2013-10-22
Category : Technology & Engineering
ISBN : 9781483187273
Random Processes in Nuclear Reactors describes the problems that a nuclear engineer may meet which involve random fluctuations and sets out in detail how they may be interpreted in terms of various models of the reactor system. Chapters set out to discuss topics on the origins of random processes and sources; the general technique to zero-power problems and bring out the basic effect of fission, and fluctuations in the lifetime of neutrons, on the measured response; the interpretation of power reactor noise; and associated problems connected with mechanical, hydraulic and thermal noise sources. The book will be very useful to nuclear engineers.
