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Author : Ruolong Liu,Electrical Carleton University. Dissertation. Engineering,ProQuest Co
Publisher : Unknown
Page : 198 pages
File Size : 45,9 Mb
Release : 1993
Category : Electronic
ISBN : OCLC:290423354
Author : Michel S. Nakhla,Q.J. Zhang
Publisher : Springer Science & Business Media
Page : 104 pages
File Size : 44,9 Mb
Release : 2011-06-28
Category : Technology & Engineering
ISBN : 9781461527183
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Author : Stephen Lum,Electrical Carleton University. Dissertation. Engineering,ProQuest Co
Publisher : Unknown
Page : 282 pages
File Size : 47,9 Mb
Release : 1991
Category : Electronic
ISBN : OCLC:290270369
Author : Lup Shun Nelson Liu,Electronics Carleton University. Dissertation. Engineering,ProQuest Co
Publisher : Unknown
Page : 264 pages
File Size : 54,6 Mb
Release : 1993
Category : Electronic
ISBN : OCLC:290428338
Author : Konstantin Moiseev,Avinoam Kolodny,Shmuel Wimer
Publisher : Springer
Page : 233 pages
File Size : 44,6 Mb
Release : 2014-11-07
Category : Technology & Engineering
ISBN : 9781461408215
This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Author : Wai-Kai Chen
Publisher : CRC Press
Page : 1788 pages
File Size : 41,8 Mb
Release : 2019-07-17
Category : Technology & Engineering
ISBN : 1420049674
Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Author : Wai-Kai Chen
Publisher : CRC Press
Page : 314 pages
File Size : 54,7 Mb
Release : 2003-03-26
Category : Technology & Engineering
ISBN : 9780203009284
As the complexity of electronic systems continues to increase, the micro-electronic industry depends upon automation and simulations to adapt quickly to market changes and new technologies. Compiled from chapters contributed to CRC's best-selling VLSI Handbook, this volume of the Principles and Applications in Engineering series covers a broad rang
Author : Wade H. Shafer
Publisher : Springer Science & Business Media
Page : 426 pages
File Size : 55,8 Mb
Release : 2012-12-06
Category : Science
ISBN : 9781461519690
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
Author : Khin-Yong Lam,Heow-Pueh Lee
Publisher : World Scientific
Page : 396 pages
File Size : 54,7 Mb
Release : 2005-10-26
Category : Mathematics
ISBN : 9789814480208
This volume documents the research carried out by visiting scientists attached to the Institute for Mathematical Sciences (IMS) at the National University of Singapore and the Institute of High Performance Computing (IHPC) under the program “Advances and Mathematical Issues in Large Scale Simulation.” From 2002 to 2003, researchers from various countries gathered to initiate interesting and innovative work on various themes related to multiscale simulation and fast algorithms. Today, modeling and simulation are used extensively to solve complex problems and to reduce the use of experimentation during the design and analysis stage. It is important to know the various issues that have to be considered in the successful development of computational methodologies for such work. This volume is a compilation of the research by various visiting scientists in the area of modeling and multiscale simulation. Each article covers a major project and documents how computational methodology, mathematical modeling, high performance computing and simulation are combined in a multiscale scheme to solve a variety of complex problems. Some of these include the design, synthesis, processing, characterization and manufacture of nanomaterials and nanostructures, new algorithms for computational work, and grid computing. Through the included examples, readers can realize the vast potential of computational modeling and large scale simulation for the solution of problems in a variety of disciplines and applications. Contents:Methods of Multiscale Modeling in Mechanics (W A Curtin)Efficient and Accurate Boundary Methods for Computational Optics (C Hafner & J Smajic)Finite Element Modeling of Periodic Structures (Z Lou & J-M Jin)Factorization of Potential and Field Distributions without Utilizing the Addition Theorem (A-R Baghi-Wadji & E Li)Virtualization-Aware Application Framework for Hierarchical Multiscale Simulations on a Grid (A Nakano et al.)Molecular Dynamics Simulation and Local Quantities (T Ikeshoji)Recent Advances in Modeling and Simulation of High-Speed Interconnects (M Nakhla & R Achar)Multiscale Modeling of Degradation and Failure of Interconnect Lines Driven by Electromigration and Stress Gradients (R Atkinson & A M Cuitiño) Readership: Engineers, scientists and graduate students who need further insights into the applications and power of computational methodology for the solution of a wide array of problems. Keywords:Large Scale Simulation;High Performance Computing;Multiscale Simulation;Fast Algorithms;Computational MethodologyKey Features:Provides insight into the applications and power of computational methodology in solving a wide array of complex problems
Author : Harvey J. Greenberg
Publisher : Springer Science & Business Media
Page : 353 pages
File Size : 50,6 Mb
Release : 2006-06-16
Category : Business & Economics
ISBN : 9780387228273
This volume reflects the theme of the INFORMS 2004 Meeting in Denver: Back to OR Roots. Emerging as a quantitative approach to problem-solving in World War II, our founders were physicists, mathematicians, and engineers who quickly found peace-time uses. It is fair to say that Operations Research (OR) was born in the same incubator as computer science, and it has spawned many new disciplines, such as systems engineering, health care management, and transportation science. Although people from many disciplines routinely use OR methods, many scientific researchers, engineers, and others do not understand basic OR tools and how they can help them. Disciplines ranging from finance to bioengineering are the beneficiaries of what we do — we take an interdisciplinary approach to problem-solving. Our strengths are modeling, analysis, and algorithm design. We provide a quanti- tive foundation for a broad spectrum of problems, from economics to medicine, from environmental control to sports, from e-commerce to computational - ometry. We are both producers and consumers because the mainstream of OR is in the interfaces. As part of this effort to recognize and extend OR roots in future probl- solving, we organized a set of tutorials designed for people who heard of the topic and want to decide whether to learn it. The 90 minutes was spent addre- ing the questions: What is this about, in a nutshell? Why is it important? Where can I learn more? In total, we had 14 tutorials, and eight of them are published here.
Author : Vazgen Melikyan
Publisher : Springer Nature
Page : 351 pages
File Size : 45,7 Mb
Release : 2024-01-31
Category : Technology & Engineering
ISBN : 9783031507144
This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
Author : Yulei Zhang
Publisher : Unknown
Page : 115 pages
File Size : 49,6 Mb
Release : 2011
Category : Electronic
ISBN : 1124738606
As semiconductor technology advances in the ultra deep sub-micron era, on-chip global interconnections have been an ever-greater barrier to achieving high-performance and low-power for the increasingly larger system-on-chip (SoC) designs. Various on-chip interconnection schemes are proposed to tackle the scaling issue of global wires by manipulating the wire operation regions, changing signaling methods, and applying different equalization techniques. Optimization frameworks are also proposed to aid the transmitter-wire-receiver co-design based on user-defined constraints. For the six representative global interconnection schemes, we investigate their performance metrics with technology scaling by performing optimizations using the proposed SQP-based framework. A set of simple models is also developed to enable early-stage system-level analysis. Performance of different interconnection schemes are predicted and compared over several technology nodes. We further perform studies on the pipelined $RC$ interconnection by exploring its performance metrics with voltage and technology scaling based on different design objectives. A performance evaluation flow is developed to generate the optimal designs for given objectives. Also, impacts of pipelining depth, voltage and technology scaling are illustrated. Finally, we propose an energy-efficient high-speed on-chip global interconnection by employing continuous-time active equalization. Modeling and design of transmitter and receiver circuits are discussed. Analytical formula of received eye-opening is derived for system-level design planning. We further perform transmitter-receiver co-design through an optimization framework and explore the design space to generate design based on best energy-throughput tradeoff.
Author : Natarajan Meghanathan,Nabendu Chaki,Dhinaharan Nagamalai
Publisher : Springer
Page : 667 pages
File Size : 44,7 Mb
Release : 2012-04-24
Category : Computers
ISBN : 9783642273087
The three volume set LNICST 84 - LNICST 86 constitute the refereed proceedings ofthe Second International Conference on Computer Science and InformationTechnology, CCSIT 2012, held in Bangalore, India, in January 2012. The 70 revised full papers presented in this volume were carefullyreviewed and selected from numerous submissions and address all major fields ofthe Computer Science and Information Technology in theoretical, methodological,and practical or applicative aspects. The papers feature cutting-edge developmentand current research in computer science and engineering.
Author : Anonim
Publisher : Academic Press
Page : 484 pages
File Size : 45,7 Mb
Release : 2012-11-01
Category : Technology & Engineering
ISBN : 9780123946362
Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. Contributions from leading authorities Informs and updates on all the latest developments in the field
Author : Q. J. Zhang,K. C. Gupta,Kuldip C. Gupta
Publisher : Artech House Publishers
Page : 396 pages
File Size : 48,8 Mb
Release : 2000
Category : Computers
ISBN : UOM:39015050190514
Discover the new, unconventional alternatives for conquering RF and microwave design and modeling problems using neural networks -- information processing systems that can learn, generalize, and even allow model development when component formulas are missing -- with this book and software package. It shows you the ease of creating models with neural networks, and how quick model evaluation can be done, plus other opportunities presented by neural networks for conquering the toughest RF and microwave CAD problems.