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Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 40,9 Mb
Release : 2008
Category : Electronic
ISBN : OCLC:746482439
Author : Alexei L. Glebov,Ray T. Chen
Publisher : Society of Photo Optical
Page : 312 pages
File Size : 48,7 Mb
Release : 2009
Category : Technology & Engineering
ISBN : 0819474673
Includes Proceedings Vol. 7821
Author : Allen M. Earman,Ray T. Chen
Publisher : Society of Photo Optical
Page : 274 pages
File Size : 50,5 Mb
Release : 2007
Category : Technology & Engineering
ISBN : 0819465917
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Anonim
Publisher : Unknown
Page : 286 pages
File Size : 40,8 Mb
Release : 2007
Category : Microelectronic packaging
ISBN : UOM:39015069203084
Author : Alexei L. Glebov,Ray T. Chen
Publisher : Society of Photo Optical
Page : 364 pages
File Size : 48,8 Mb
Release : 2008-01-01
Category : Technology & Engineering
ISBN : 0819470740
Includes Proceedings Vol. 7821
Author : Lukas Chrostowski,Krzysztof Iniewski
Publisher : CRC Press
Page : 223 pages
File Size : 49,5 Mb
Release : 2017-12-19
Category : Computers
ISBN : 9781466516045
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Author : Michael R. Feldman
Publisher : SPIE-International Society for Optical Engineering
Page : 440 pages
File Size : 46,6 Mb
Release : 2000
Category : Technology & Engineering
ISBN : STANFORD:36105029159816
Author : Anonim
Publisher : Unknown
Page : 272 pages
File Size : 44,6 Mb
Release : 2003
Category : Microelectronic packaging
ISBN : UOM:39015060031203
Author : Tolga Tekin,Nikos Pleros,Richard Pitwon,Andreas Hakansson
Publisher : Woodhead Publishing
Page : 428 pages
File Size : 42,9 Mb
Release : 2016-11-01
Category : Computers
ISBN : 9780081005132
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Author : Hugo Thienpont
Publisher : Society of Photo Optical
Page : 516 pages
File Size : 46,8 Mb
Release : 2006
Category : Technology & Engineering
ISBN : 0819462411
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 40,9 Mb
Release : 2006
Category : Integrated optics
ISBN : OCLC:1012076437
Author : Ivan Kaminow,Tingye Li,Alan E Willner
Publisher : Academic Press
Page : 795 pages
File Size : 41,8 Mb
Release : 2013-05-03
Category : Technology & Engineering
ISBN : 9780123972354
Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Author : Nikos Bamiedakis,Kevin A. Williams,Richard V. Penty,Ian H. White
Publisher : Elsevier Inc. Chapters
Page : 794 pages
File Size : 43,8 Mb
Release : 2013-05-03
Category : Technology & Engineering
ISBN : 9780128060650
Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.
Author : John H. Lau
Publisher : Springer
Page : 368 pages
File Size : 40,7 Mb
Release : 2019-04-03
Category : Technology & Engineering
ISBN : 9789811372247
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author : Ulrich H. P. Fischer-Hirchert
Publisher : Springer
Page : 325 pages
File Size : 47,7 Mb
Release : 2015-04-11
Category : Technology & Engineering
ISBN : 9783642253768
This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.