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Author : Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair
Publisher : The Electrochemical Society
Page : 436 pages
File Size : 44,8 Mb
Release : 1994
Category : Science
ISBN : 1566770882
Author : Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair
Publisher : The Electrochemical Society
Page : 308 pages
File Size : 54,8 Mb
Release : 1999
Category : Science
ISBN : 1566772524
Author : Electrochemical Society. Corrosion Division,Electrochemical Society. Dielectric Science and Technology Division
Publisher : Unknown
Page : 292 pages
File Size : 49,6 Mb
Release : 1999
Category : Electronic apparatus and appliances
ISBN : OCLC:670028762
Author : Robert B. Comizzoli
Publisher : Unknown
Page : 604 pages
File Size : 43,9 Mb
Release : 1993
Category : Technology & Engineering
ISBN : 1566770513
Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Page : 1720 pages
File Size : 55,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420017663
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Anonim
Publisher : ASM International
Page : 1234 pages
File Size : 52,7 Mb
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 0871702851
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : James Douglas Sinclair
Publisher : Unknown
Page : 1208 pages
File Size : 49,7 Mb
Release : 2001
Category : Science
ISBN : STANFORD:36105025972253
Author : Christofer Leygraf,Inger Odnevall Wallinder,Johan Tidblad,Thomas Graedel
Publisher : John Wiley & Sons
Page : 623 pages
File Size : 51,5 Mb
Release : 2016-06-07
Category : Science
ISBN : 9781118762189
ATMOSPHERIC CORROSION Presents a comprehensive look at atmospheric corrosion, combining expertise in corrosion science and atmospheric chemistry Atmospheric corrosion has been a subject of engineering study, largely empirical, for nearly a century. Scientists came to the field rather later on and had considerable difficulty bringing their arsenal of tools to bear on the problem. Atmospheric corrosion was traditionally studied by specialists in corrosion having little knowledge of atmospheric chemistry, history, or prospects. Atmospheric Corrosion provides a combined approach bringing together experimental corrosion and atmospheric chemistry. The second edition expands on this approach by including environmental aspects of corrosion, atmospheric corrosion modeling, and international corrosion exposure programs. The combination of specialties provides a more comprehensive coverage of the topic. These scientific insights into the corrosion process and its amelioration are the focus of this book. Key topics include the following: Basic principles of atmospheric corrosion chemistry Corrosion mechanisms in controlled and uncontrolled environments Degradation of materials in architectural, transport, and structural applications; electronic devices; and cultural artifacts Protection of existing materials and choosing new ones that resist corrosion Prediction of how and where atmospheric corrosion may evolve in the future Complete with appendices discussing experimental techniques, computer models, and the degradation of specific metals, Atmospheric Corrosion, Second Edition continues to be an invaluable resource for corrosion scientists, corrosion engineers, conservators, environmental scientists, and anyone interested in the theory and application of this evolving field. The book concerns primarily the atmospheric corrosion of metals and is written at a level suitable for advanced undergraduates or beginning graduate students in any of the physical or engineering sciences.
Author : J. W. McPherson
Publisher : Springer
Page : 463 pages
File Size : 44,7 Mb
Release : 2018-12-20
Category : Technology & Engineering
ISBN : 9783319936833
This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.
Author : ASM International
Publisher : ASM International
Page : 524 pages
File Size : 50,6 Mb
Release : 2005-01-01
Category : Technology & Engineering
ISBN : 9781615030880
Author : Pradeep Lall,Michael G. Pecht,Edward B. Hakim
Publisher : CRC Press
Page : 332 pages
File Size : 48,7 Mb
Release : 2020-07-09
Category : Technology & Engineering
ISBN : 9780429605598
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author : Anonim
Publisher : Unknown
Page : 488 pages
File Size : 49,8 Mb
Release : 2001
Category : Electronic packaging
ISBN : CORNELL:31924071771079
Author : Elissa M. Bumiller,David A. Douthit,Joan Pecht
Publisher : CRC Press
Page : 236 pages
File Size : 44,9 Mb
Release : 2002-11-12
Category : Technology & Engineering
ISBN : 9781420040067
Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Author : Anonim
Publisher : Unknown
Page : 2740 pages
File Size : 49,6 Mb
Release : 2001
Category : Books
ISBN : STANFORD:36105111051640
Author : Anonim
Publisher : Unknown
Page : 556 pages
File Size : 41,6 Mb
Release : 2005
Category : Electronic apparatus and appliances
ISBN : UOM:39015062539302
