Reflow Soldering

Author : Balázs Illés,Oliver Krammer,Attila Geczy
Publisher : Elsevier
Page : 295 pages
File Size : 51,6 Mb
Release : 2020-07-02
Category : Technology & Engineering
ISBN : 9780128185063

Get Book

Reflow Soldering by Balázs Illés,Oliver Krammer,Attila Geczy Pdf

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Author : Ning-Cheng Lee
Publisher : Elsevier
Page : 288 pages
File Size : 48,9 Mb
Release : 2002-01-24
Category : Technology & Engineering
ISBN : 9780080492247

Get Book

Reflow Soldering Processes by Ning-Cheng Lee Pdf

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Author : R. Sengupta
Publisher : New Age International
Page : 122 pages
File Size : 41,6 Mb
Release : 1997
Category : Electronic
ISBN : 8122411096

Get Book

Principles of Reliable Soldering Techniques by R. Sengupta Pdf

Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.

Author : Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau
Publisher : Springer Science & Business Media
Page : 434 pages
File Size : 51,9 Mb
Release : 1994-01-31
Category : Computers
ISBN : 0442015054

Get Book

Mechanics of Solder Alloy Interconnects by Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau Pdf

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Author : Dongkai Shangguan
Publisher : ASM International
Page : 292 pages
File Size : 50,9 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 9781615030934

Get Book

Lead-Free Solder Interconnect Reliability by Dongkai Shangguan Pdf

Author : Jasbir Bath
Publisher : Springer Science & Business Media
Page : 307 pages
File Size : 55,8 Mb
Release : 2007-06-26
Category : Technology & Engineering
ISBN : 9780387684222

Get Book

Lead-Free Soldering by Jasbir Bath Pdf

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Author : Robbin Gourley
Publisher : ASM International
Page : 533 pages
File Size : 43,9 Mb
Release : 2012-01-01
Category : Technology & Engineering
ISBN : 9781615039937

Get Book

Brazing and Soldering 2012 by Robbin Gourley Pdf

Author : Ning-Cheng Lee
Publisher : Newnes
Page : 282 pages
File Size : 53,8 Mb
Release : 2002-01-11
Category : Technology & Engineering
ISBN : 9780750672184

Get Book

Reflow Soldering Processes by Ning-Cheng Lee Pdf

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Author : Ray Prasad
Publisher : Springer Science & Business Media
Page : 791 pages
File Size : 41,7 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461540847

Get Book

Surface Mount Technology by Ray Prasad Pdf

A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Author : Baoyan Duan,Kazunori Umeda,Chang-wan Kim
Publisher : Springer Nature
Page : 2195 pages
File Size : 45,9 Mb
Release : 2022-07-12
Category : Technology & Engineering
ISBN : 9789811913099

Get Book

Proceedings of the Eighth Asia International Symposium on Mechatronics by Baoyan Duan,Kazunori Umeda,Chang-wan Kim Pdf

The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.

Author : Jasbir Bath
Publisher : John Wiley & Sons
Page : 512 pages
File Size : 55,8 Mb
Release : 2020-06-12
Category : Technology & Engineering
ISBN : 9781119482048

Get Book

Lead-free Soldering Process Development and Reliability by Jasbir Bath Pdf

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Author : Y.C. Lee,W.T. Chen
Publisher : Springer Science & Business Media
Page : 270 pages
File Size : 50,5 Mb
Release : 2012-12-06
Category : Science
ISBN : 9781461558033

Get Book

Manufacturing Challenges in Electronic Packaging by Y.C. Lee,W.T. Chen Pdf

About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Page : 1044 pages
File Size : 47,5 Mb
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 9780203021484

Get Book

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter Pdf

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Author : Frank Riley,Electronic Packaging and Production
Publisher : Springer Science & Business Media
Page : 576 pages
File Size : 55,8 Mb
Release : 2013-06-29
Category : Technology & Engineering
ISBN : 9783662131619

Get Book

The Electronics Assembly Handbook by Frank Riley,Electronic Packaging and Production Pdf

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Author : Ryszard Jablonski,Mateusz Turkowski,Roman Szewczyk
Publisher : Springer Science & Business Media
Page : 709 pages
File Size : 54,8 Mb
Release : 2007-09-19
Category : Technology & Engineering
ISBN : 9783540739562

Get Book

Recent Advances in Mechatronics by Ryszard Jablonski,Mateusz Turkowski,Roman Szewczyk Pdf

This book presents recent state of advances in mechatronics presented on the 7th International Conference Mechatronics 2007, hosted at the Faculty of Mechatronics, Warsaw University of Technology, Poland. The selected papers give an overview of the state-of-the-art and present new research results and prospects of the future development in this interdisciplinary field of mechatronic systems.