Reliability Prediction For Microelectronics

Author : Joseph B. Bernstein,Alain Bensoussan,Emmanuel Bender
Publisher : John Wiley & Sons
Page : 404 pages
File Size : 43,5 Mb
Release : 2024-02-13
Category : Technology & Engineering
ISBN : 9781394210954

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Reliability Prediction for Microelectronics by Joseph B. Bernstein,Alain Bensoussan,Emmanuel Bender Pdf

RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Author : Joseph B. Bernstein,Alain Bensoussan,Emmanuel Bender
Publisher : John Wiley & Sons
Page : 404 pages
File Size : 46,5 Mb
Release : 2024-02-20
Category : Technology & Engineering
ISBN : 9781394210930

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Reliability Prediction for Microelectronics by Joseph B. Bernstein,Alain Bensoussan,Emmanuel Bender Pdf

RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Author : Andrew E. Perkins,Suresh K. Sitaraman
Publisher : Springer Science & Business Media
Page : 202 pages
File Size : 45,8 Mb
Release : 2008-12-16
Category : Technology & Engineering
ISBN : 9780387793948

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Solder Joint Reliability Prediction for Multiple Environments by Andrew E. Perkins,Suresh K. Sitaraman Pdf

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Author : Shahrzad Salemi
Publisher : RIAC
Page : 271 pages
File Size : 48,7 Mb
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 9781933904290

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Physics-of-Failure Based Handbook of Microelectronic Systems by Shahrzad Salemi Pdf

Author : Joseph Bernstein
Publisher : Academic Press
Page : 108 pages
File Size : 49,5 Mb
Release : 2014-03-06
Category : Technology & Engineering
ISBN : 9780128008195

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Reliability Prediction from Burn-In Data Fit to Reliability Models by Joseph Bernstein Pdf

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. The ability to include reliability calculations and test results in their product design The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions Have accurate failure rate calculations for calculating warrantee period replacement costs

Author : Jerome Klion
Publisher : Springer Science & Business Media
Page : 616 pages
File Size : 45,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789401169707

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Practical Electronic Reliability Engineering by Jerome Klion Pdf

This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to comprehend and carry out all the tasks associated with a reliability program from specification generation to final demonstration of reliability achieved. Most available texts on reliability concentrate on the mathematics and statistics used for reliability analysis, evaluation, and demonstration. They are more often suited more for the professional with a heavier mathematical background that most engineers have, and more often than not, ignore or pay short-shrift to basic engineering design and organizational efforts associated with a reliability program. A reliability engineer must be familiar with both the mathematics and engineering aspects of a reliability program. This text: 1. Describes the mathematics needed for reliability analysis, evaluation, and demonstration commensurate with an engineer's background. 2. Provides background material, guidance, and references necessary to the structure and implementation of a reliability program including: • identification of the reliability standards in most common use • how to generate and respond to a reliability specification • how reliability can be increased • the tasks which make up a reliability program and how to judge the need and scope of each; how each is commonly performed; caution and comments about their application.

Author : Lev M. Klyatis,Edward L. Anderson
Publisher : John Wiley & Sons
Page : 270 pages
File Size : 44,7 Mb
Release : 2018-11-20
Category : Technology & Engineering
ISBN : 9781119411888

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Reliability Prediction and Testing Textbook by Lev M. Klyatis,Edward L. Anderson Pdf

This textbook reviews the methodologies of reliability prediction as currently used in industries such as electronics, automotive, aircraft, aerospace, off-highway, farm machinery, and others. It then discusses why these are not successful; and, presents methods developed by the authors for obtaining accurate information for successful prediction. The approach is founded on approaches that accurately duplicate the real world use of the product. Their approach is based on two fundamental components needed for successful reliability prediction; first, the methodology necessary; and, second, use of accelerated reliability and durability testing as a source of the necessary data. Applicable to all areas of engineering, this textbook details the newest techniques and tools to achieve successful reliabilityprediction and testing. It demonstrates practical examples of the implementation of the approaches described. This book is a tool for engineers, managers, researchers, in industry, teachers, and students. The reader will learn the importance of the interactions of the influencing factors and the interconnections of safety and human factors in product prediction and testing.

Author : Way Kuo,Wei-Ting Kary Chien,Taeho Kim
Publisher : Springer Science & Business Media
Page : 407 pages
File Size : 41,8 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461556718

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Reliability, Yield, and Stress Burn-In by Way Kuo,Wei-Ting Kary Chien,Taeho Kim Pdf

The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

Author : A. Christou
Publisher : RIAC
Page : 410 pages
File Size : 46,9 Mb
Release : 2006
Category : Microelectronics
ISBN : 9781933904153

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Reliability and Quality in Microelectronic Manufacturing by A. Christou Pdf

Author : Willem Dirk van Driel,Maryam Yazdan Mehr
Publisher : Springer Nature
Page : 552 pages
File Size : 47,5 Mb
Release : 2022-01-31
Category : Technology & Engineering
ISBN : 9783030815769

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Reliability of Organic Compounds in Microelectronics and Optoelectronics by Willem Dirk van Driel,Maryam Yazdan Mehr Pdf

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Author : Ilia B. Frenkel,Alex Karagrigoriou,Anatoly Lisnianski,Andre Kleyner
Publisher : John Wiley & Sons
Page : 449 pages
File Size : 40,5 Mb
Release : 2013-08-22
Category : Technology & Engineering
ISBN : 9781118701898

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Applied Reliability Engineering and Risk Analysis by Ilia B. Frenkel,Alex Karagrigoriou,Anatoly Lisnianski,Andre Kleyner Pdf

This complete resource on the theory and applications of reliability engineering, probabilistic models and risk analysis consolidates all the latest research, presenting the most up-to-date developments in this field. With comprehensive coverage of the theoretical and practical issues of both classic and modern topics, it also provides a unique commemoration to the centennial of the birth of Boris Gnedenko, one of the most prominent reliability scientists of the twentieth century. Key features include: expert treatment of probabilistic models and statistical inference from leading scientists, researchers and practitioners in their respective reliability fields detailed coverage of multi-state system reliability, maintenance models, statistical inference in reliability, systemability, physics of failures and reliability demonstration many examples and engineering case studies to illustrate the theoretical results and their practical applications in industry Applied Reliability Engineering and Risk Analysis is one of the first works to treat the important areas of degradation analysis, multi-state system reliability, networks and large-scale systems in one comprehensive volume. It is an essential reference for engineers and scientists involved in reliability analysis, applied probability and statistics, reliability engineering and maintenance, logistics, and quality control. It is also a useful resource for graduate students specialising in reliability analysis and applied probability and statistics. Dedicated to the Centennial of the birth of Boris Gnedenko, renowned Russian mathematician and reliability theorist

Author : Titu I. Bajenescu,Marius I. Bazu
Publisher : Springer Science & Business Media
Page : 547 pages
File Size : 45,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642585050

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Reliability of Electronic Components by Titu I. Bajenescu,Marius I. Bazu Pdf

This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Author : Lev M. Klyatis
Publisher : Springer Nature
Page : 281 pages
File Size : 50,9 Mb
Release : 2023-01-03
Category : Technology & Engineering
ISBN : 9783031166556

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Prediction Technologies for Improving Engineering Product Efficiency by Lev M. Klyatis Pdf

This book is aimed at readers who need to learn the latest solutions for interconnected simulation, testing, and prediction technologies that improve engineering product efficiency, including reliability, safety, quality, durability, maintainability, life-cycle costing and profit. It provides a detailed analysis of technologies now being used in industries such as electronics, automotive, aircraft, aerospace, off-highway, farm machinery, and others. It includes clear examples, charts, and illustrations. This book provides analyses of the simulation, testing, and prediction approaches and methodologies with descriptive, negative trends in their development. The author discusses why many current methods of simulation, testing, and prediction are not successful and describes novel techniques and tools developed for eliminating these problems. This book is a tool for engineers, managers, researches in industry, teachers, and students. Lev Klyatis, Hab. Dr.-Ing., ScD., PhD, Senior Advisor SoHaR, Inc., has been a professor at Moscow State Agricultural Engineering University, research leader and chairman of State Enterprise TESTMASH, and served on the US Technical Advisory Group for the International Electrotechnical Commission (IEC), the ISO/IEC Join Study Group in Safety Aspects of Risk Assessment, the United Nations European Economical Commission, and US-USSR Trade and Economic Council. He is presently a member of World Quality Council, the Elmer A. Sperry Board of Award, SAE International G-41 Reliability Committee, the Integrated Design and Manufacturing Committee and session chairman of SAE International World Congresses in Detroit since 2012. His vast experience and innovation enable him to create a new direction for the successful prediction of product efficiency during any given time, including accurate simulation of real-world conditions, accelerated reliability and durability testing technology, and reducing recalls. His approach has been verified in various industries, primarily automotive, farm machinery, aerospace, and aircraft industries. He has shared his new direction working as the seminar instructor and consultant to Ford, DaimlerChrysler, Nissan, Toyota, Jatko Ltd., Thermo King, Black an Dekker, NASA Research Centers, Karl Schenck, and many others. He holds over 30 patents worldwide and is the author of over 300 publications, including 15 books.

Author : Pradeep Lall,Michael Pecht,Edward B. Hakim
Publisher : CRC Press
Page : 327 pages
File Size : 43,7 Mb
Release : 2020-07-09
Category : Technology & Engineering
ISBN : 9780429611117

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Influence of Temperature on Microelectronics and System Reliability by Pradeep Lall,Michael Pecht,Edward B. Hakim Pdf

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Author : Abdelkhalak El Hami,David Delaux,Henri Grzeskowiak
Publisher : John Wiley & Sons
Page : 324 pages
File Size : 55,8 Mb
Release : 2023-01-12
Category : Technology & Engineering
ISBN : 9781786308818

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Reliability and Physics-of-Healthy in Mechatronics by Abdelkhalak El Hami,David Delaux,Henri Grzeskowiak Pdf

This book illustrates simply, but with many details, the state of the art of reliability science, exploring clear reliability disciplines and applications through concrete examples from their industries and from real life, based on industrial experiences. Many experts believe that reliability is not only a matter of statistics but is a multidisciplinary scientific topic, involving materials, tests, simulations, quality tools, manufacturing, electronics, mechatronics, environmental engineering and Big Data, among others. For a complex mechatronic system, failure risks have to be identified at an early stage of the design. In the automotive and aeronautic industries, fatigue simulation is used both widely and efficiently. Problems arise from the variability of inputs such as fatigue parameters and life curves. This book aims to discuss probabilistic fatigue and reliability simulation. To do this, Reliability and Physics-of-Healthy in Mechatronics provides a study on some concepts of a predictive reliability model of microelectronics, with examples from the automotive, aeronautic and space industries, based on entropy and Physics-of-Healthy