The Printed Circuit Designer S Guide To Thermal Management

Author : American Standard Circuits
Publisher : Unknown
Page : 128 pages
File Size : 44,9 Mb
Release : 2020-10-06
Category : Electronic
ISBN : 1734200561

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The Printed Circuit Designer's Guide To... Thermal Management by American Standard Circuits Pdf

Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.

Author : Ventec International
Publisher : Unknown
Page : 128 pages
File Size : 50,8 Mb
Release : 2018-03-22
Category : Electronic
ISBN : 0999864831

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The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates by Ventec International Pdf

Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.

Author : Ventec International Group
Publisher : Unknown
Page : 0 pages
File Size : 42,8 Mb
Release : 2022-07-25
Category : Electronic
ISBN : 9798985602050

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The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2 by Ventec International Group Pdf

This book is meant to be a companion to The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, which describes material selection for cost-effective solutions and reliable designs. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.Among the most pertinent questions is how to improve reliability of components as they become smaller and smaller, while being more efficient.Readers will also learn the value of understanding the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary.

Author : Douglas Brooks,Johannes Adam
Publisher : Artech House
Page : 246 pages
File Size : 55,7 Mb
Release : 2021-02-28
Category : Technology & Engineering
ISBN : 9781630818616

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PCB Design Guide to Via and Trace Currents and Temperatures by Douglas Brooks,Johannes Adam Pdf

A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

Author : Jerry E. Sergent,Al Krum
Publisher : McGraw Hill Professional
Page : 370 pages
File Size : 43,6 Mb
Release : 1998
Category : Science
ISBN : 0070266999

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Thermal Management Handbook: For Electronic Assemblies by Jerry E. Sergent,Al Krum Pdf

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Author : Tim Williams
Publisher : Unknown
Page : 302 pages
File Size : 41,7 Mb
Release : 1993-01-01
Category : Technology & Engineering
ISBN : 075061756X

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The Circuit Designer's Companion by Tim Williams Pdf

This is a compendium of practical wisdom concerning real world aspects of electronic circuit design gathered during years of experience in industry. The Companion enables circuit designers to produce more effective working circuits. Valued by linear and digital designers alike, this guide explains and outlines solutions that take into account the imperfect behaviour of real components, interconnections and circuits. Electronic circuit design can be divided into two areas: the first consists in designing a circuit that will fulfil its specified function; the second consists in designing the same circuit so that every production model of it will fulfil its specified function reliably over its lifetime. Designers who can appreciate the techniques and tools used in the latter area are becoming increasingly rare. The aim of this guide is to help such people. The subjects covered include grounding, printed circuit design and layout, the characteristics of practical active and passive components, cables, linear ICs, logic circuits and their interfaces, power supplies, electromagnetic compatibility, safety and thermal management. Throughout, the implications of manufacturability and cost are stressed. The style is direct and lucid, providing straightforward practical advice. This is the ideal guide to real world design for both students and practitioners.

Author : Kraig Mitzner,Bob Doe,Alexander Akulin,Anton Suponin,Dirk Muller
Publisher : Academic Press
Page : 612 pages
File Size : 41,6 Mb
Release : 2019-06-20
Category : Technology & Engineering
ISBN : 9780128176856

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Complete PCB Design Using OrCAD Capture and PCB Editor by Kraig Mitzner,Bob Doe,Alexander Akulin,Anton Suponin,Dirk Muller Pdf

Complete PCB Design Using OrCAD Capture and PCB Editor, Second Edition, provides practical instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. Chapters cover how to Design a PCB using OrCAD Capture and OrCAD Layout, adding PSpice simulation capabilities to a design, how to develop custom schematic parts, how to create footprints and PSpice models, and how to perform documentation, simulation and board fabrication from the same schematic design. This book is suitable for both beginners and experienced designers, providing basic principles and the program's full capabilities for optimizing designs. Presents a fully updated edition on OrCAD Capture, Version 17.2 Combines the theoretical and practical parts of PCB design Includes real-life design examples that show how and why designs work, providing a comprehensive toolset for understanding OrCAD software Provides the exact order in which a circuit and PCB are designed Introduces the IPC, JEDEC and IEEE standards relating to PCB design

Author : American Standard Circuits
Publisher : Unknown
Page : 80 pages
File Size : 46,7 Mb
Release : 2018-01-18
Category : Electronic
ISBN : 0998288594

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The Printed Circuit Designer's Guide To... Fundamentals of RF/Microwave PCBs by American Standard Circuits Pdf

Author : David Marrakchi
Publisher : Unknown
Page : 128 pages
File Size : 47,8 Mb
Release : 2017-02-28
Category : Electronic
ISBN : 0979618932

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The Printed Circuit Designer's Guide To... DFM by David Marrakchi Pdf

This book provides an in-depth look at DFM: what DFM entails, why it's so critical today, and how to implement the DFM techniques necessary to produce a manufacturable and functional board. With something to offer for both the seasoned designer and the newbie, after reading this book, PCB designers will have all the DFM knowledge they need to eliminate costly design re-spins and get a good board back, every time.

Author : Neeraj Kumar Singh,Porselvan Muthukrishnan,Satyanarayana Sanpini
Publisher : Apress
Page : 268 pages
File Size : 41,7 Mb
Release : 2019-07-15
Category : Computers
ISBN : 9781484235348

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Industrial System Engineering for Drones by Neeraj Kumar Singh,Porselvan Muthukrishnan,Satyanarayana Sanpini Pdf

Explore a complex mechanical system where electronics and mechanical engineers work together as a cross-functional team. Using a working example, this book is a practical “how to” guide to designing a drone system. As system design becomes more and more complicated, systematic, and organized, there is an increasingly large gap in how system design happens in the industry versus what is taught in academia. While the system design basics and fundamentals mostly remain the same, the process, flow, considerations, and tools applied in industry are far different than that in academia. Designing Drone Systems takes you through the entire flow from system conception to design to production, bridging the knowledge gap between academia and the industry as you build your own drone systems. What You’ll LearnGain a high level understanding of drone systems Design a drone systems and elaborating the various aspects and considerations of design Review the principles of the industrial system design process/flow, and the guidelines for drone systems Look at the challenges, limitations, best practices, and patterns of system design Who This Book Is For Primarily for beginning or aspiring system design experts, recent graduates, and system design engineers. Teachers, trainers, and system design mentors can also benefit from this content.

Author : Alessandro Birolini
Publisher : Springer Science & Business Media
Page : 564 pages
File Size : 40,7 Mb
Release : 2003-08-20
Category : Technology & Engineering
ISBN : 354040287X

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Reliability Engineering by Alessandro Birolini Pdf

Using clear language, this book shows you how to build in, evaluate, and demonstrate reliability and availability of components, equipment, and systems. It presents the state of the art in theory and practice, and is based on the author's 30 years' experience, half in industry and half as professor of reliability engineering at the ETH, Zurich. In this extended edition, new models and considerations have been added for reliability data analysis and fault tolerant reconfigurable repairable systems including reward and frequency / duration aspects. New design rules for imperfect switching, incomplete coverage, items with more than 2 states, and phased-mission systems, as well as a Monte Carlo approach useful for rare events are given. Trends in quality management are outlined. Methods and tools are given in such a way that they can be tailored to cover different reliability requirement levels and be used to investigate safety as well. The book contains a large number of tables, figures, and examples to support the practical aspects.

Author : Gerald L. Ginsberg
Publisher : Springer Science & Business Media
Page : 285 pages
File Size : 44,6 Mb
Release : 2013-11-27
Category : Science
ISBN : 9781461535423

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Electronic Equipment Packaging Technology by Gerald L. Ginsberg Pdf

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
Page : 633 pages
File Size : 54,8 Mb
Release : 2011-01-05
Category : Technology & Engineering
ISBN : 9781441977595

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Pdf

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : Mark Benson
Publisher : Springer Science & Business Media
Page : 130 pages
File Size : 51,7 Mb
Release : 2014-01-03
Category : Technology & Engineering
ISBN : 9781493902989

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The Art of Software Thermal Management for Embedded Systems by Mark Benson Pdf

This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.

Author : Irving Granet,Maurice Bluestein
Publisher : CRC Press
Page : 838 pages
File Size : 45,7 Mb
Release : 2014-11-10
Category : Science
ISBN : 9781482238563

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Thermodynamics and Heat Power by Irving Granet,Maurice Bluestein Pdf

Building on the last edition, (dedicated to exploring alternatives to coal- and oil-based energy conversion methods and published more than ten years ago), Thermodynamics and Heat Power, Eighth Edition updates the status of existing direct energy conversion methods as described in the previous work. Offering a systems approach to the analysis of en