Thermal Spreading And Contact Resistance

Author : Yuri S. Muzychka,M. Michael Yovanovich
Publisher : John Wiley & Sons
Page : 469 pages
File Size : 52,7 Mb
Release : 2023-08-09
Category : Science
ISBN : 9781394187546

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Thermal Spreading and Contact Resistance by Yuri S. Muzychka,M. Michael Yovanovich Pdf

Thermal Spreading and Contact Resistance: Fundamentals and Applications Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.

Author : Yuri Muzychka,M. Michael Yovanovich
Publisher : John Wiley & Sons
Page : 469 pages
File Size : 42,5 Mb
Release : 2023-08-29
Category : Technology & Engineering
ISBN : 9781394187522

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Thermal Spreading and Contact Resistance by Yuri Muzychka,M. Michael Yovanovich Pdf

Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.

Author : C.V. Madhusudana
Publisher : Springer Science & Business Media
Page : 192 pages
File Size : 43,9 Mb
Release : 1995-12-15
Category : Science
ISBN : 0387945342

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Thermal Contact Conductance by C.V. Madhusudana Pdf

Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.

Author : Adrian Bejan,Allan D. Kraus
Publisher : John Wiley & Sons
Page : 1496 pages
File Size : 54,9 Mb
Release : 2003-06-30
Category : Technology & Engineering
ISBN : 9780471390152

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Heat Transfer Handbook by Adrian Bejan,Allan D. Kraus Pdf

Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.

Author : Chakravarti V. Madhusudana
Publisher : Springer Science & Business Media
Page : 272 pages
File Size : 50,9 Mb
Release : 2013-09-24
Category : Science
ISBN : 9783319012766

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Thermal Contact Conductance by Chakravarti V. Madhusudana Pdf

The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.

Author : Sadik Kakaç,Hafit Yüncü,K. Hijikata
Publisher : Springer Science & Business Media
Page : 953 pages
File Size : 43,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9789401110907

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Cooling of Electronic Systems by Sadik Kakaç,Hafit Yüncü,K. Hijikata Pdf

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Author : Anonim
Publisher : Advanced Thermal Solutions
Page : 186 pages
File Size : 48,5 Mb
Release : 2024-06-29
Category : Electronic
ISBN : 9780615236605

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Qpedia Thermal Management – Electronics Cooling Book, Volume 1 by Anonim Pdf

Author : HoSung Lee
Publisher : John Wiley & Sons
Page : 932 pages
File Size : 52,5 Mb
Release : 2022-05-20
Category : Technology & Engineering
ISBN : 9781119686019

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Thermal Design by HoSung Lee Pdf

Thermal Design Discover a new window to thermal engineering and thermodynamics through the study of thermal design Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy — as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable. In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems — all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. Readers of the Second Edition of Thermal Design will also find: A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed More problems and examples to help clarify points throughout the book A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work A solutions manual provided on a companion website Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering.

Author : Chuang Wen,Yuying Yan
Publisher : Springer Nature
Page : 914 pages
File Size : 55,7 Mb
Release : 2021-06-01
Category : Science
ISBN : 9789813347656

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Advances in Heat Transfer and Thermal Engineering by Chuang Wen,Yuying Yan Pdf

This book gathers selected papers from the 16th UK Heat Transfer Conference (UKHTC2019), which is organised every two years under the aegis of the UK National Heat Transfer Committee. It is the premier forum in the UK for the local and international heat transfer community to meet, disseminate ongoing work, and discuss the latest advances in the heat transfer field. Given the range of topics discussed, these proceedings offer a valuable asset for engineering researchers and postgraduate students alike.

Author : Sergey Yurish
Publisher : Lulu.com
Page : 536 pages
File Size : 45,7 Mb
Release : 2018-01-12
Category : Technology & Engineering
ISBN : 9788469786338

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'Advances in Microelectronics: Reviews', Vol_1 by Sergey Yurish Pdf

The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Author : HoSung Lee
Publisher : John Wiley & Sons
Page : 450 pages
File Size : 47,9 Mb
Release : 2016-11-14
Category : Technology & Engineering
ISBN : 9781118848951

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Thermoelectrics by HoSung Lee Pdf

Thermoelectrics: Design and Materials HoSung Lee, Western Michigan University, USA A comprehensive guide to the basic principles of thermoelectrics Thermoelectrics plays an important role in energy conversion and electronic temperature control. The book comprehensively covers the basic physical principles of thermoelectrics as well as recent developments and design strategies of materials and devices. The book is divided into two sections: the first section is concerned with design and begins with an introduction to the fast developing and multidisciplinary field of thermoelectrics. This section also covers thermoelectric generators and coolers (refrigerators) before examining optimal design with dimensional analysis. A number of applications are considered, including solar thermoelectric generators, thermoelectric air conditioners and refrigerators, thermoelectric coolers for electronic devices, thermoelectric compact heat exchangers, and biomedical thermoelectric energy harvesting systems. The second section focuses on materials, and covers the physics of electrons and phonons, theoretical modeling of thermoelectric transport properties, thermoelectric materials, and nanostructures. Key features: Provides an introduction to a fast developing and interdisciplinary field. Includes detailed, fundamental theories. Offers a platform for advanced study. Thermoelectrics: Design and Materials is a comprehensive reference ideal for engineering students, as well as researchers and practitioners working in thermodynamics. Cover designed by Yujin Lee

Author : Ralph Remsburg
Publisher : Springer Science & Business Media
Page : 589 pages
File Size : 49,7 Mb
Release : 2011-06-27
Category : Technology & Engineering
ISBN : 9781441985095

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Advanced Thermal Design of Electronic Equipment by Ralph Remsburg Pdf

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.

Author : Xiaobing Luo,Run Hu,Bin Xie
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 51,9 Mb
Release : 2024-05-29
Category : Technology & Engineering
ISBN : 9781119179290

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Thermal Management for Opto-electronics Packaging and Applications by Xiaobing Luo,Run Hu,Bin Xie Pdf

A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Author : Adrian Bejan
Publisher : John Wiley & Sons
Page : 612 pages
File Size : 42,6 Mb
Release : 2022-04-05
Category : Technology & Engineering
ISBN : 9781119467403

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Heat Transfer by Adrian Bejan Pdf

HEAT TRANSFER Provides authoritative coverage of the fundamentals of heat transfer, written by one of the most cited authors in all of Engineering Heat Transfer presents the fundamentals of the generation, use, conversion, and exchange of heat between physical systems. A pioneer in establishing heat transfer as a pillar of the modern thermal sciences, Professor Adrian Bejan presents the fundamental concepts and problem-solving methods of the discipline, predicts the evolution of heat transfer configurations, the principles of thermodynamics, and more. Building upon his classic 1993 book Heat Transfer, the author maintains his straightforward scientific approach to teaching essential developments such as Fourier conduction, fins, boundary layer theory, duct flow, scale analysis, and the structure of turbulence. In this new volume, Bejan explores topics and research developments that have emerged during the past decade, including the designing of convective flow and heat and mass transfer, the crucial relationship between configuration and performance, and new populations of configurations such as tapered ducts, plates with multi-scale features, and dendritic fins. Heat Transfer: Evolution, Design and Performance: Covers thermodynamics principles and establishes performance and evolution as fundamental concepts in thermal sciences Demonstrates how principles of physics predict a future with economies of scale, multi-scale design, vascularization, and hierarchical distribution of many small features Explores new work on conduction architecture, convection with nanofluids, boiling and condensation on designed surfaces, and resonance of natural circulation in enclosures Includes numerous examples, problems with solutions, and access to a companion website Heat Transfer: Evolution, Design and Performance is essential reading for undergraduate and graduate students in mechanical and chemical engineering, and for all engineers, physicists, biologists, and earth scientists.

Author : Zhaojun Wang,Yingxin Zhu,Fang Wang,Peng Wang,Chao Shen,Jing Liu
Publisher : Springer Nature
Page : 1492 pages
File Size : 46,8 Mb
Release : 2020-03-19
Category : Technology & Engineering
ISBN : 9789811395284

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Proceedings of the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019) by Zhaojun Wang,Yingxin Zhu,Fang Wang,Peng Wang,Chao Shen,Jing Liu Pdf

This book presents selected papers from the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019), with a focus on HVAC techniques for improving indoor environment quality and the energy efficiency of heating and cooling systems. Presenting inspiration for implementing more efficient and safer HVAC systems, the book is a valuable resource for academic researchers, engineers in industry, and government regulators.