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2007 32nd Ieee Cpmt International Electronics Manufacturing Technology Symposium Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of 2007 32nd Ieee Cpmt International Electronics Manufacturing Technology Symposium book. This book definitely worth reading, it is an incredibly well-written.
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 53,7 Mb
Release : 2007
Category : Ball grid array technology
ISBN : 1509084797
Author : Anonim
Publisher : IEEE
Page : 223 pages
File Size : 45,9 Mb
Release : 2007
Category : Technology & Engineering
ISBN : 1424413354
Author : Anonim
Publisher : Unknown
Page : 194 pages
File Size : 50,8 Mb
Release : 1998
Category : Electronic apparatus and appliances
ISBN : UOM:39015040307921
Author : Eugenio Iannone
Publisher : CRC Press
Page : 1351 pages
File Size : 49,8 Mb
Release : 2018-09-03
Category : Medical
ISBN : 9781351832069
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Author : IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium
Publisher : Unknown
Page : 128 pages
File Size : 49,6 Mb
Release : 2002
Category : Electronic industries
ISBN : OCLC:1109236488
Author : Ephraim Suhir,T. X. Yu,David S. Steinberg
Publisher : John Wiley & Sons
Page : 610 pages
File Size : 53,6 Mb
Release : 2011-04-04
Category : Technology & Engineering
ISBN : 9780470886793
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Author : Zhiyong Ma,David G. Seiler
Publisher : CRC Press
Page : 843 pages
File Size : 52,5 Mb
Release : 2017-03-27
Category : Science
ISBN : 9781351733946
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author : Anupama B. Kaul
Publisher : CRC Press
Page : 464 pages
File Size : 43,6 Mb
Release : 2017-12-19
Category : Science
ISBN : 9781466509559
Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.
Author : Salah Awadalla
Publisher : CRC Press
Page : 384 pages
File Size : 48,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781482262216
Integrating aspects of engineering, application physics, and medical science, Solid-State Radiation Detectors: Technology and Applications offers a comprehensive review of new and emerging solid-state materials-based technologies for radiation detection. Each chapter is structured to address the current advantages and challenges of each material and technology presented, as well as to discuss novel research and applications. Featuring contributions from leading experts in industry and academia, this authoritative text: Covers modern semiconductors used for radiation monitoring Examines CdZnTe and CdTe technology for imaging applications including three-dimensional capability detectors Highlights interconnect technology for current pixel detectors Describes hybrid pixel detectors and their characterizations Tackles the integrated analog signal processing read-out front ends for particle detectors Considers new organic materials with direct bandgap for direct energy detection Summarizes recent developments involving lanthanum halide and cerium bromide scintillators Analyzes the potential of recent progress in the field of crystallogenesis, quantum dots, and photonics crystals toward a new concept of x- and gamma-ray detectors based on metamaterials Explores position-sensitivity photomultipliers and silicon photomultipliers for scintillation crystals Solid-State Radiation Detectors: Technology and Applications provides a valuable reference for engineers and scientists looking to enhance the performance of radiation detector technology for medical imaging and other applications.
Author : Rohit Sharma
Publisher : CRC Press
Page : 302 pages
File Size : 50,8 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781466589421
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author : Anonim
Publisher : IEEE Computer Society Press
Page : 396 pages
File Size : 47,5 Mb
Release : 2000
Category : Technology & Engineering
ISBN : UOM:39015053510049
Author : Anonim
Publisher : Unknown
Page : 232 pages
File Size : 51,6 Mb
Release : 1994
Category : Electronic apparatus and appliances
ISBN : UOM:39015030269750
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 44,6 Mb
Release : 2010
Category : Ball grid array technology
ISBN : 1424433932
Author : IEMT,IMC Symposium
Publisher : Unknown
Page : 388 pages
File Size : 52,9 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0780366212
Author : M.S.J. Hashmi
Publisher : Elsevier
Page : 1467 pages
File Size : 50,9 Mb
Release : 2016-08-29
Category : Technology & Engineering
ISBN : 9780128032503
Finish Manufacturing Processes are those final stage processing techniques which are deployed to bring a product to readiness for marketing and putting in service. Over recent decades a number of finish manufacturing processes have been newly developed by researchers and technologists. Many of these developments have been reported and illustrated in existing literature in a piecemeal manner or in relation only to specific applications. For the first time, Comprehensive Materials Finishing, Three Volume Set integrates a wide body of this knowledge and understanding into a single, comprehensive work. Containing a mixture of review articles, case studies and research findings resulting from R & D activities in industrial and academic domains, this reference work focuses on how some finish manufacturing processes are advantageous for a broad range of technologies. These include applicability, energy and technological costs as well as practicability of implementation. The work covers a wide range of materials such as ferrous, non-ferrous and polymeric materials. There are three main distinct types of finishing processes: Surface Treatment by which the properties of the material are modified without generally changing the physical dimensions of the surface; Finish Machining Processes by which a small layer of material is removed from the surface by various machining processes to render improved surface characteristics; and Surface Coating Processes by which the surface properties are improved by adding fine layer(s) of materials with superior surface characteristics. Each of these primary finishing processes is presented in its own volume for ease of use, making Comprehensive Materials Finishing an essential reference source for researchers and professionals at all career stages in academia and industry. Provides an interdisciplinary focus, allowing readers to become familiar with the broad range of uses for materials finishing Brings together all known research in materials finishing in a single reference for the first time Includes case studies that illustrate theory and show how it is applied in practice