3d Ic Integration And Packaging

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3D IC Integration and Packaging

John H. Lau
3D IC Integration and Packaging Book PDF

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 512 pages
File Size : 47,8 Mb
Release : 2015-07-06
Category : Technology & Engineering
ISBN : 9780071848077

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3D IC Integration and Packaging by John H. Lau Pdf

A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Through-Silicon Vias for 3D Integration

John H. Lau
Through Silicon Vias for 3D Integration Book PDF

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 513 pages
File Size : 49,9 Mb
Release : 2012-08-05
Category : Technology & Engineering
ISBN : 9780071785150

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Through-Silicon Vias for 3D Integration by John H. Lau Pdf

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Handbook of 3D Integration, Volume 1

Philip Garrou,Christopher Bower,Peter Ramm
Handbook of 3D Integration Volume 1 Book PDF

Author : Philip Garrou,Christopher Bower,Peter Ramm
Publisher : John Wiley & Sons
Page : 798 pages
File Size : 40,6 Mb
Release : 2011-09-22
Category : Technology & Engineering
ISBN : 9783527623068

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Handbook of 3D Integration, Volume 1 by Philip Garrou,Christopher Bower,Peter Ramm Pdf

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Design And Modeling For 3d Ics And Interposers

Swaminathan Madhavan,Han Ki Jin
Design And Modeling For 3d Ics And Interposers Book PDF

Author : Swaminathan Madhavan,Han Ki Jin
Publisher : World Scientific
Page : 380 pages
File Size : 47,9 Mb
Release : 2013-11-05
Category : Technology & Engineering
ISBN : 9789814508612

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Design And Modeling For 3d Ics And Interposers by Swaminathan Madhavan,Han Ki Jin Pdf

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility Book PDF

Author : Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
Publisher : John Wiley & Sons
Page : 464 pages
File Size : 52,9 Mb
Release : 2018-03-29
Category : Technology & Engineering
ISBN : 9781119289661

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng Pdf

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

3D Integration in VLSI Circuits

Katsuyuki Sakuma
3D Integration in VLSI Circuits Book PDF

Author : Katsuyuki Sakuma
Publisher : CRC Press
Page : 219 pages
File Size : 43,8 Mb
Release : 2018-04-17
Category : Technology & Engineering
ISBN : 9781351779821

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3D Integration in VLSI Circuits by Katsuyuki Sakuma Pdf

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Handbook of 3D Integration, Volume 4

Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Handbook of 3D Integration Volume 4 Book PDF

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 488 pages
File Size : 40,8 Mb
Release : 2019-05-06
Category : Technology & Engineering
ISBN : 9783527338559

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Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

John H. Lau
Reliability of RoHS Compliant 2D and 3D IC Interconnects Book PDF

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 640 pages
File Size : 42,5 Mb
Release : 2010-10-22
Category : Technology & Engineering
ISBN : 9780071753807

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects by John H. Lau Pdf

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Semiconductor Advanced Packaging

John H. Lau
Semiconductor Advanced Packaging Book PDF

Author : John H. Lau
Publisher : Springer Nature
Page : 513 pages
File Size : 42,6 Mb
Release : 2021-05-17
Category : Technology & Engineering
ISBN : 9789811613760

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Semiconductor Advanced Packaging by John H. Lau Pdf

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

3D Integration for VLSI Systems

Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
3D Integration for VLSI Systems Book PDF

Author : Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Publisher : CRC Press
Page : 376 pages
File Size : 53,7 Mb
Release : 2016-04-19
Category : Science
ISBN : 9789814303828

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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester Pdf

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Wafer Level 3-D ICs Process Technology

Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
Wafer Level 3 D ICs Process Technology Book PDF

Author : Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
Publisher : Springer Science & Business Media
Page : 365 pages
File Size : 55,6 Mb
Release : 2009-06-29
Category : Technology & Engineering
ISBN : 9780387765341

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Wafer Level 3-D ICs Process Technology by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif Pdf

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility Book PDF

Author : Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
Publisher : John Wiley & Sons
Page : 464 pages
File Size : 49,7 Mb
Release : 2018-03-28
Category : Technology & Engineering
ISBN : 9781119289678

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng Pdf

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

3D IC Stacking Technology

Banqiu Wu,Ajay Kumar,Sesh Ramaswami
3D IC Stacking Technology Book PDF

Author : Banqiu Wu,Ajay Kumar,Sesh Ramaswami
Publisher : McGraw Hill Professional
Page : 543 pages
File Size : 42,6 Mb
Release : 2011-10-14
Category : Technology & Engineering
ISBN : 9780071741965

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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami Pdf

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Integrated Circuit Packaging, Assembly and Interconnections

William Greig
Integrated Circuit Packaging Assembly and Interconnections Book PDF

Author : William Greig
Publisher : Springer Science & Business Media
Page : 312 pages
File Size : 41,7 Mb
Release : 2007-04-24
Category : Technology & Engineering
ISBN : 9780387339139

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Integrated Circuit Packaging, Assembly and Interconnections by William Greig Pdf

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

3D Integration in VLSI Circuits

Katsuyuki Sakuma
3D Integration in VLSI Circuits Book PDF

Author : Katsuyuki Sakuma
Publisher : CRC Press
Page : 217 pages
File Size : 42,8 Mb
Release : 2018
Category : Computers
ISBN : 1315200694

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3D Integration in VLSI Circuits by Katsuyuki Sakuma Pdf

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.