Semiconductor Advanced Packaging

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Semiconductor Advanced Packaging

John H. Lau
Semiconductor Advanced Packaging Book PDF

Author : John H. Lau
Publisher : Springer Nature
Page : 513 pages
File Size : 51,9 Mb
Release : 2021-05-17
Category : Technology & Engineering
ISBN : 9789811613760

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Semiconductor Advanced Packaging by John H. Lau Pdf

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Materials for Advanced Packaging

Daniel Lu,C.P. Wong
Materials for Advanced Packaging Book PDF

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 45,5 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Semiconductor Packaging

Andrea Chen,Randy Hsiao-Yu Lo
Semiconductor Packaging Book PDF

Author : Andrea Chen,Randy Hsiao-Yu Lo
Publisher : CRC Press
Page : 216 pages
File Size : 49,8 Mb
Release : 2016-04-19
Category : Technology & Engineering
ISBN : 9781439862070

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Semiconductor Packaging by Andrea Chen,Randy Hsiao-Yu Lo Pdf

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Beth Keser,Steffen Kröhnert
Advances in Embedded and Fan Out Wafer Level Packaging Technologies Book PDF

Author : Beth Keser,Steffen Kröhnert
Publisher : John Wiley & Sons
Page : 576 pages
File Size : 55,9 Mb
Release : 2019-02-12
Category : Technology & Engineering
ISBN : 9781119314134

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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by Beth Keser,Steffen Kröhnert Pdf

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Advanced Flip Chip Packaging

Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Advanced Flip Chip Packaging Book PDF

Author : Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Publisher : Springer Science & Business Media
Page : 560 pages
File Size : 45,9 Mb
Release : 2013-03-20
Category : Technology & Engineering
ISBN : 9781441957689

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong Pdf

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau
Chiplet Design and Heterogeneous Integration Packaging Book PDF

Author : John H. Lau
Publisher : Springer Nature
Page : 542 pages
File Size : 55,8 Mb
Release : 2023-03-27
Category : Technology & Engineering
ISBN : 9789811999178

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Chiplet Design and Heterogeneous Integration Packaging by John H. Lau Pdf

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Wafer-Level Chip-Scale Packaging

Shichun Qu,Yong Liu
Wafer Level Chip Scale Packaging Book PDF

Author : Shichun Qu,Yong Liu
Publisher : Springer
Page : 322 pages
File Size : 47,9 Mb
Release : 2014-09-10
Category : Technology & Engineering
ISBN : 9781493915569

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Wafer-Level Chip-Scale Packaging by Shichun Qu,Yong Liu Pdf

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Integrated Circuit Packaging, Assembly and Interconnections

William Greig
Integrated Circuit Packaging Assembly and Interconnections Book PDF

Author : William Greig
Publisher : Springer Science & Business Media
Page : 312 pages
File Size : 50,9 Mb
Release : 2007-04-24
Category : Technology & Engineering
ISBN : 9780387339139

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Integrated Circuit Packaging, Assembly and Interconnections by William Greig Pdf

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

Beth Keser,Steffen Kröhnert
Embedded and Fan Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Book PDF

Author : Beth Keser,Steffen Kröhnert
Publisher : John Wiley & Sons
Page : 324 pages
File Size : 47,6 Mb
Release : 2021-12-29
Category : Technology & Engineering
ISBN : 9781119793779

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by Beth Keser,Steffen Kröhnert Pdf

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

Beth Keser,Steffen Kröhnert
Embedded and Fan Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Book PDF

Author : Beth Keser,Steffen Kröhnert
Publisher : John Wiley & Sons
Page : 324 pages
File Size : 40,7 Mb
Release : 2021-12-06
Category : Technology & Engineering
ISBN : 9781119793892

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by Beth Keser,Steffen Kröhnert Pdf

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Semiconductor Packaging

Robert J. Hannemann,Allan D. Kraus,Michael Pecht
Semiconductor Packaging Book PDF

Author : Robert J. Hannemann,Allan D. Kraus,Michael Pecht
Publisher : Wiley-Interscience
Page : 0 pages
File Size : 46,7 Mb
Release : 1997-04-01
Category : Technology & Engineering
ISBN : 0471181234

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Semiconductor Packaging by Robert J. Hannemann,Allan D. Kraus,Michael Pecht Pdf

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them. In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors... Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade. The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

Power Electronic Packaging

Yong Liu
Power Electronic Packaging Book PDF

Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 45,8 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410539

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Power Electronic Packaging by Yong Liu Pdf

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Antenna-in-Package Technology and Applications

Duixian Liu,Yueping Zhang
Antenna in Package Technology and Applications Book PDF

Author : Duixian Liu,Yueping Zhang
Publisher : John Wiley & Sons
Page : 416 pages
File Size : 55,5 Mb
Release : 2020-03-31
Category : Technology & Engineering
ISBN : 9781119556633

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Antenna-in-Package Technology and Applications by Duixian Liu,Yueping Zhang Pdf

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Wide Bandgap Power Semiconductor Packaging

Katsuaki Suganuma
Wide Bandgap Power Semiconductor Packaging Book PDF

Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Page : 240 pages
File Size : 52,8 Mb
Release : 2018-05-28
Category : Technology & Engineering
ISBN : 9780081020951

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Wide Bandgap Power Semiconductor Packaging by Katsuaki Suganuma Pdf

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Microelectromechanical Systems

Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems,Commission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council
Microelectromechanical Systems Book PDF

Author : Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems,Commission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council
Publisher : National Academies Press
Page : 57 pages
File Size : 51,5 Mb
Release : 1997-12-15
Category : Technology & Engineering
ISBN : 9780309591515

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Microelectromechanical Systems by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems,Commission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council Pdf

Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.