Advanced Adhesives In Electronics

Author : M O Alam,C Bailey
Publisher : Elsevier
Page : 279 pages
File Size : 49,9 Mb
Release : 2011-05-25
Category : Technology & Engineering
ISBN : 9780857092892

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Advanced Adhesives in Electronics by M O Alam,C Bailey Pdf

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Author : James J. Licari,Dale W. Swanson
Publisher : William Andrew
Page : 415 pages
File Size : 41,5 Mb
Release : 2011-06-24
Category : Technology & Engineering
ISBN : 9781437778908

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Adhesives Technology for Electronic Applications by James J. Licari,Dale W. Swanson Pdf

Approx.512 pages Approx.512 pages

Author : Kenji Uchino
Publisher : Elsevier
Page : 696 pages
File Size : 50,5 Mb
Release : 2010-09-27
Category : Technology & Engineering
ISBN : 9781845699758

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Advanced Piezoelectric Materials by Kenji Uchino Pdf

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Author : Ernest W. Flick
Publisher : William Andrew
Page : 1038 pages
File Size : 45,7 Mb
Release : 1992-12-31
Category : Science
ISBN : UOM:39015025186936

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Adhesives, Sealants and Coatings for the Electronics Industry by Ernest W. Flick Pdf

The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

Author : Sulaiman Khalifeh
Publisher : Elsevier
Page : 617 pages
File Size : 53,9 Mb
Release : 2020-04-01
Category : Technology & Engineering
ISBN : 9781927885680

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Polymers in Organic Electronics by Sulaiman Khalifeh Pdf

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Author : Yi (Grace) Li,Daniel Lu,C.P. Wong
Publisher : Springer Science & Business Media
Page : 445 pages
File Size : 49,9 Mb
Release : 2009-10-08
Category : Technology & Engineering
ISBN : 9780387887838

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Electrical Conductive Adhesives with Nanotechnologies by Yi (Grace) Li,Daniel Lu,C.P. Wong Pdf

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 47,7 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : K. L. Mittal,S. K. Panigrahi
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 49,9 Mb
Release : 2023-03-23
Category : Technology & Engineering
ISBN : 9781394175581

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Structural Adhesives by K. L. Mittal,S. K. Panigrahi Pdf

Structural Adhesives Uniquely provides up-to-date and comprehensive information on the topic in an easily-accessible form. A structural adhesive can be described as a high-strength adhesive material that is isotropic in nature and bonds two or more parts together in a load-bearing structure. A structural adhesive material must be capable of transmitting the stress/load without loss of structural integrity within design limits. There are many types of established structural adhesives, including epoxy, urethane, acrylic, silicone, etc. Structural Adhesives comprises nine chapters and is divided into two parts: Part 1, Preparation, Properties, and Characterization; Part 2, Applications. The topics covered include: structural epoxy adhesives; biological reinforcement of epoxies as structural adhesives; marble dust reinforced epoxy structural adhesive composites; characterization of various structural adhesive materials; effects of shear and peel stress distributions on the behavior of structural adhesives; the inelastic response of structural aerospace adhesives; structural reactive acrylic adhesives: their preparation, characterization, properties, and applications; application of structural adhesives in composite connections; and naval applications of structural adhesives. Audience This book should be of much use and interest to adhesionists, materials scientists, adhesive technologists, polymer scientists, and those working in the construction, railway, automotive, aviation, bridge, and shipbuilding industries.

Author : K. L. Mittal,Tanweer Ahsan
Publisher : John Wiley & Sons
Page : 357 pages
File Size : 49,5 Mb
Release : 2014-08-25
Category : Technology & Engineering
ISBN : 9781118831342

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Adhesion in Microelectronics by K. L. Mittal,Tanweer Ahsan Pdf

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
Publisher : Springer Science & Business Media
Page : 1471 pages
File Size : 52,8 Mb
Release : 2007-05-26
Category : Technology & Engineering
ISBN : 9780387329895

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by Ephraim Suhir,Y.C. Lee,C.P. Wong Pdf

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Author : Johan Liu
Publisher : Unknown
Page : 432 pages
File Size : 50,5 Mb
Release : 1999
Category : Adhesive joints
ISBN : 0901150371

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Conductive Adhesives for Electronics Packaging by Johan Liu Pdf

Author : Serge Zhuiykov
Publisher : Woodhead Publishing
Page : 466 pages
File Size : 48,5 Mb
Release : 2014-02-14
Category : Technology & Engineering
ISBN : 9781782422242

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Nanostructured Semiconductor Oxides for the Next Generation of Electronics and Functional Devices by Serge Zhuiykov Pdf

Nanostructured Semiconductor Oxides for the Next Generation of Electronics and Functional Devices focuses on the development of semiconductor nanocrystals, their technologies and applications, including energy harvesting, solar cells, solid oxide fuel cells, and chemical sensors. Semiconductor oxides are used in electronics, optics, catalysts, sensors, and other functional devices. In their 2D form, the reduction in size confers exceptional properties, useful for creating faster electronics and more efficient catalysts. After explaining the physics affecting the conductivity and electron arrangement of nanostructured semiconductors, the book addresses the structural and chemical modification of semiconductor nanocrystals during material growth. It then covers their use in nanoscale functional devices, particularly in electronic devices and carbon nanotubes. It explores the impact of 2D nanocrystals, such as graphene, chalcogenides, and oxide nanostructures, on research and technology, leading to a discussion of incorporating graphene and semiconductor nanostructures into composites for use in energy storage. The final three chapters focus on the applications of these functional materials in photovoltaic cells, solid oxide fuel cells, and in environmental sensors including pH, dissolved oxygen, dissolved organic carbon, and dissolved metal ion sensors. Nanostructured Semiconductor Oxides for the Next Generation of Electronics and Functional Devices is a crucial resource for scientists, applied researchers, and production engineers working in the fabrication, design, testing, characterization, and analysis of new semiconductor materials. This book is a valuable reference for those working in the analysis and characterization of new nanomaterials, and for those who develop technologies for practical devices fabrication. Focuses on the development of semiconductor nanocrystals, their technologies and applications, including energy harvesting, solar cells, solid oxide fuel cells, and chemical sensors Reviews fundamental physics of conductivity and electron arrangement before proceeding to practical applications A vital resource for applied researchers and production engineers working with new semiconductor materials

Author : Vannessa Goodship,Ab Stevels
Publisher : Elsevier
Page : 752 pages
File Size : 49,8 Mb
Release : 2012-08-30
Category : Technology & Engineering
ISBN : 9780857096333

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Waste Electrical and Electronic Equipment (WEEE) Handbook by Vannessa Goodship,Ab Stevels Pdf

Electrical and electronic waste is a growing problem as volumes are increasing fast. Rapid product innovation and replacement, especially in information and communication technologies (ICT), combined with the migration from analog to digital technologies and to flat-screen televisions and monitors has resulted in some electronic products quickly reaching the end of their life. The EU directive on waste electrical and electronic equipment (WEEE) aims to minimise WEEE by putting organizational and financial responsibility on producers and distributors for collection, treatment, recycling and recovery of WEEE. Therefore all stakeholders need to be well-informed about their WEEE responsibilities and options. While focussing on the EU, this book draws lessons for policy and practice from all over the world. Part one introduces the reader to legislation and initiatives to manage WEEE. Part two discusses technologies for the refurbishment, treatment and recycling of waste electronics. Part three focuses on electronic products that present particular challenges for recyclers. Part four explores sustainable design of electronics and supply chains. Part five discusses national and regional WEEE management schemes and part six looks at corporate WEEE management strategies. With an authoritative collection of chapters from an international team of authors, Waste electrical and electronic equipment (WEEE) handbook is designed to be used as a reference by policy-makers, producers and treatment operators in both the developed and developing world. Draws lessons for waste electrical and electronic equipment (WEEE) policy and practice from around the world Discusses legislation and initiatives to manage WEEE, including global e-waste initiatives, EU legislation relating to electronic waste, and eco-efficiency evaluation of WEEE take-back systems Sections cover technologies for refurbishment, treatment and recycling of waste, sustainable design of electronics and supply chains, national and regional waste management schemes, and corporate WEEE management strategies

Author : Stergios Logothetidis
Publisher : Elsevier
Page : 478 pages
File Size : 45,8 Mb
Release : 2014-12-15
Category : Technology & Engineering
ISBN : 9781782420439

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Handbook of Flexible Organic Electronics by Stergios Logothetidis Pdf

Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.

Author : Anonim
Publisher : Emerald Group Publishing
Page : 72 pages
File Size : 42,7 Mb
Release : 2006
Category : Electronic packaging
ISBN : 9781846630101

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Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging by Anonim Pdf

This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.