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Author : Xiaonan Wang
Publisher : Unknown
Page : 350 pages
File Size : 52,5 Mb
Release : 2002
Category : Computer logic
ISBN : UCAL:X68167
Author : Anonim
Publisher : Unknown
Page : 936 pages
File Size : 48,6 Mb
Release : 2001
Category : Application-specific integrated circuits
ISBN : UIUC:30112043669917
Author : Philip Garrou,Mitsumasa Koyanagi,Peter Ramm
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 50,8 Mb
Release : 2014-04-22
Category : Technology & Engineering
ISBN : 9783527670123
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author : Katsuyuki Sakuma
Publisher : CRC Press
Page : 219 pages
File Size : 53,7 Mb
Release : 2018-04-17
Category : Technology & Engineering
ISBN : 9781351779821
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Author : Arup Bhattacharyya
Publisher : CRC Press
Page : 835 pages
File Size : 55,6 Mb
Release : 2017-07-06
Category : Technology & Engineering
ISBN : 9781351798310
The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides in-depth coverage of conventional nonvolatile memory devices, stack structures from device physics, historical perspectives, and identifies limitations of conventional devices. The second part reviews advances made in reducing and/or eliminating existing limitations of NVM device parameters from the standpoint of device scalability, application extendibility, and reliability. The final part proposes multiple options of silicon based unified (nonvolatile) memory cell concepts and stack designs (SUMs). The book provides Industrial R&D personnel with the knowledge to drive the future memory technology with the established silicon FET-based establishments of their own. It explores application potentials of memory in areas such as robotics, avionics, health-industry, space vehicles, space sciences, bio-imaging, genetics etc.
Author : Wai-Kai Chen
Publisher : CRC Press
Page : 1788 pages
File Size : 50,7 Mb
Release : 2019-07-17
Category : Technology & Engineering
ISBN : 1420049674
Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Author : Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Publisher : Springer
Page : 408 pages
File Size : 42,8 Mb
Release : 2015-12-09
Category : Science
ISBN : 9783319186757
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Author : John H. Lau
Publisher : Springer
Page : 368 pages
File Size : 40,6 Mb
Release : 2019-04-03
Category : Technology & Engineering
ISBN : 9789811372247
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author : Karl J. Puttlitz,Paul A. Totta
Publisher : Springer Science & Business Media
Page : 1250 pages
File Size : 54,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461513896
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : Youn-Long Steve Lin
Publisher : Springer Science & Business Media
Page : 405 pages
File Size : 43,6 Mb
Release : 2007-05-31
Category : Technology & Engineering
ISBN : 9781402053528
This book originated from a workshop held at the DATE 2005 conference, namely Designing Complex SOCs. State-of-the-art in issues related to System-on-Chip (SoC) design by leading experts in the fields, it covers IP development, verification, integration, chip implementation, testing and software. It contains valuable academic and industrial examples for those involved with the design of complex SOCs.
Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
Publisher : Springer Science & Business Media
Page : 251 pages
File Size : 51,6 Mb
Release : 2010-12-07
Category : Architecture
ISBN : 9781441909626
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Author : Andrew Marshall,Sreedhar Natarajan
Publisher : Springer Science & Business Media
Page : 392 pages
File Size : 48,9 Mb
Release : 2007-05-08
Category : Technology & Engineering
ISBN : 9780306481611
This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Author : Riko Radojcic
Publisher : Springer
Page : 182 pages
File Size : 49,7 Mb
Release : 2017-02-08
Category : Technology & Engineering
ISBN : 9783319525488
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Author : Wai-Kai Chen
Publisher : CRC Press
Page : 400 pages
File Size : 41,9 Mb
Release : 2003-03-19
Category : Technology & Engineering
ISBN : 9780203011508
As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including
Author : Rino Micheloni,Giovanni Campardo,Piero Olivo
Publisher : Springer Science & Business Media
Page : 313 pages
File Size : 46,9 Mb
Release : 2008-07-24
Category : Technology & Engineering
ISBN : 9783540790785
For the technological progress in communication technology it is necessary that the advanced studies in circuit and software design are accompanied with recent results of the technological research and physics in order to exceed its limitations. This book is a guide which treats many components used in mobile communications, and in particular focuses on non-volatile memories. It emerges following the conducting line of the non-volatile memory in the wireless system: On the one hand it develops the foundations of the interdisciplinary issues needed for design analysis and testing of the system. On the other hand it deals with many of the problems appearing when the systems are realized in industrial production. These cover the difficulties from the mobile system to the different types of non-volatile memories. The book explores memory cards, multichip technologies, and algorithms of the software management as well as error handling. It also presents techniques of assurance for the single components and a guide through the Datasheet lectures.
