More Than Moore 2 5d And 3d Sip Integration

Author : Riko Radojcic
Publisher : Springer
Page : 182 pages
File Size : 41,9 Mb
Release : 2017-02-08
Category : Technology & Engineering
ISBN : 9783319525488

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More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic Pdf

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 50,6 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : Peter Ring,Peter Schuck
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 51,7 Mb
Release : 2004-03-25
Category : Health & Fitness
ISBN : 354021206X

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The Nuclear Many-Body Problem by Peter Ring,Peter Schuck Pdf

Study Edition

Author : Ibrahim (Abe) M. Elfadel,Gerhard Fettweis
Publisher : Springer
Page : 339 pages
File Size : 42,7 Mb
Release : 2016-05-11
Category : Technology & Engineering
ISBN : 9783319204819

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3D Stacked Chips by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis Pdf

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Author : John H. Lau
Publisher : Springer
Page : 368 pages
File Size : 41,9 Mb
Release : 2019-04-03
Category : Technology & Engineering
ISBN : 9789811372247

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Heterogeneous Integrations by John H. Lau Pdf

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Author : Rino Micheloni
Publisher : Springer
Page : 380 pages
File Size : 41,6 Mb
Release : 2016-05-26
Category : Computers
ISBN : 9789401775120

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3D Flash Memories by Rino Micheloni Pdf

This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

Author : A. F. Kuckes,B. G. Thompson
Publisher : CUP Archive
Page : 224 pages
File Size : 46,9 Mb
Release : 1987-10-08
Category : Computers
ISBN : 0521321980

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Apple II by A. F. Kuckes,B. G. Thompson Pdf

Author : Emily S. McLaughlin
Publisher : Unknown
Page : 0 pages
File Size : 51,5 Mb
Release : 2012
Category : Burns and scalds
ISBN : 1621004465

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Burns by Emily S. McLaughlin Pdf

This book presents topical research in the study of the prevention, causes and treatment of burns. Topics discussed in this compilation include emergency burn care; nanotechnology and nanomedicine advancements in burn therapy; post-burn hand deformities; the role of apoptosis in burn injury; burns during arthroscopy due to the use of electrosurgical devices; the body's local and consecutive, systemic pathophysiological reaction to thermal lesions; the burn reconstructive units on the face and neck; use of modern day technology for pain management during burn injury rehabilitation; carbon monoxide intoxication in burns; the clinical application of Versajet Hydrosurgery System in burn debridement and escharotomy techniques in burn injuries.

Author : Thomas P. Keenan
Publisher : Greystone Books Ltd
Page : 264 pages
File Size : 42,7 Mb
Release : 2014
Category : Technology & Engineering
ISBN : 9781771641227

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Technocreep by Thomas P. Keenan Pdf

"Technology is rapidly moving into our bodies," writes cyber expert Keenan, "and this book gives a chilling look ahead into where that road may lead us - on a one way trip to the total surrender of privacy and the commoditization of intimacy." Here is the definitive dissection of privacy-eroding and life-invading technologies, coming at you from governments, corporations, and the person next door. Take, for example, "Girls Around Me": a Russian-made iPhone App that allowed anyone to scan the immediate vicinity for girls and women who checked in on Foursquare and had poorly secured Facebook profiles. It combined this information in a way never intended by the original poster. Going to a Disney theme park? Your creepy new "MagicBand" will alert Minnie Mouse that you're on the way and she'll know your kid's name when you approach her. Thinking about sending your DNA off to Ancestry.com for some "genetic genealogy"? Perhaps you should think again: your genetic information could be used against you. "This masterful weaving of the negatives and positives of technology makes for a book that is realistic about technology's perils yet optimistic about it's great potential."--Foreword Reviews

Author : Francisco Yus
Publisher : John Benjamins Publishing
Page : 370 pages
File Size : 47,8 Mb
Release : 2011-08-22
Category : Language Arts & Disciplines
ISBN : 9789027284662

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Cyberpragmatics by Francisco Yus Pdf

Cyberpragmatics is an analysis of Internet-mediated communication from the perspective of cognitive pragmatics. It addresses a whole range of interactions that can be found on the Net: the web page, chat rooms, instant messaging, social networking sites, 3D virtual worlds, blogs, videoconference, e-mail, Twitter, etc. Of special interest is the role of intentions and the quality of interpretations when these Internet-mediated interactions take place, which is often affected by the textual properties of the medium. The book also analyses the pragmatic implications of transferring offline discourses (e.g. printed paper, advertisements) to the screen-framed space of the Net. And although the main framework is cognitive pragmatics, the book also draws from other theories and models in order to build up a better picture of what really happens when people communicate on the Net. This book will interest analysts doing research on computer-mediated communication, university students and researchers undergoing post-graduate courses or writing a PhD thesis. Now Open Access as part of the Knowledge Unlatched 2017 Backlist Collection.

Author : Florent Calvo
Publisher : Newnes
Page : 432 pages
File Size : 45,5 Mb
Release : 2013-03-12
Category : Technology & Engineering
ISBN : 9780123946164

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Nanoalloys by Florent Calvo Pdf

Nanoalloys: From Fundamentals to Emergent Applications presents and discusses the major topics related to nanoalloys at a time when the literature on the subject remains scarce. Particular attention is paid to experimental and theoretical aspects under the form of broad reviews covering the most recent developments. The book is organized into 11 chapters covering the most fundamental aspects of nanoalloys related to their synthesis and characterization, as well as their theoretical study. Aspects related to their thermodynamics and kinetics are covered as well. The coverage then moves to more specific topics, including optics, magnetism and catalysis, and finally to biomedical applications and the technologically relevant issue of self-assembly. With no current single reference source on the subject, the work is invaluable for researchers as the nanoscience field moves swiftly to full monetization. Encapsulates physical science of structure, properties, size, composition and ordering at nanoscale, aiding synthesis of experimentation and modelling Multi-expert and interdisciplinary perspectives on growth, synthesis and characterization of bimetallic clusters and particulates supports expansion of your current research activity into applications Synthesizes concepts and draws links between fundamental metallurgy and cutting edge nanoscience, aiding interdisciplinary research activity

Author : T.H.K. Barron,G.K. White
Publisher : Springer Science & Business Media
Page : 342 pages
File Size : 48,6 Mb
Release : 2012-12-06
Category : Science
ISBN : 9781461546955

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Heat Capacity and Thermal Expansion at Low Temperatures by T.H.K. Barron,G.K. White Pdf

The birth of this monograph is partly due to the persistent efforts of the General Editor, Dr. Klaus Timmerhaus, to persuade the authors that they encapsulate their forty or fifty years of struggle with the thermal properties of materials into a book before they either expired or became totally senile. We recognize his wisdom in wanting a monograph which includes the closely linked properties of heat capacity and thermal expansion, to which we have added a little 'cement' in the form of elastic moduli. There seems to be a dearth of practitioners in these areas, particularly among physics postgraduate students, sometimes temporarily alleviated when a new generation of exciting materials are found, be they heavy fermion compounds, high temperature superconductors, or fullerenes. And yet the needs of the space industry, telecommunications, energy conservation, astronomy, medical imaging, etc. , place demands for more data and understanding of these properties for all classes of materials - metals, polymers, glasses, ceramics, and mixtures thereof. There have been many useful books, including Specific Heats at Low Tempera tures by E. S. Raja Gopal (1966) in this Plenum Cryogenic Monograph Series, but few if any that covered these related topics in one book in a fashion designed to help the cryogenic engineer and cryophysicist. We hope that the introductory chapter will widen the horizons of many without a solid state background but with a general interest in physics and materials.

Author : M.R. Oliver
Publisher : Springer Science & Business Media
Page : 444 pages
File Size : 53,5 Mb
Release : 2004-01-26
Category : Technology & Engineering
ISBN : 3540431810

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Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver Pdf

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Author : Stephen Mason
Publisher : Cambridge University Press
Page : 409 pages
File Size : 54,7 Mb
Release : 2012-01-26
Category : Business & Economics
ISBN : 9781107012295

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Electronic Signatures in Law by Stephen Mason Pdf

Using case law from multiple jurisdictions, Stephen Mason examines the nature and legal bearing of electronic signatures.

Author : Paul Siffert,Eberhard Krimmel
Publisher : Springer Science & Business Media
Page : 552 pages
File Size : 45,8 Mb
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 9783662098974

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Silicon by Paul Siffert,Eberhard Krimmel Pdf

With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.