Three Dimensional System Integration

Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
Publisher : Springer Science & Business Media
Page : 246 pages
File Size : 52,9 Mb
Release : 2010-12-07
Category : Architecture
ISBN : 9781441909626

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Three Dimensional System Integration by Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic Pdf

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Author : Er-Ping Li
Publisher : John Wiley & Sons
Page : 394 pages
File Size : 49,6 Mb
Release : 2012-04-10
Category : Technology & Engineering
ISBN : 9780470623466

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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Pdf

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Author : Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Publisher : CRC Press
Page : 376 pages
File Size : 42,6 Mb
Release : 2016-04-19
Category : Science
ISBN : 9789814303828

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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester Pdf

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Author : Er-Ping Li
Publisher : John Wiley & Sons
Page : 394 pages
File Size : 51,7 Mb
Release : 2012-03-19
Category : Technology & Engineering
ISBN : 9781118166741

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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Pdf

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Author : Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
Publisher : Springer Science & Business Media
Page : 280 pages
File Size : 44,6 Mb
Release : 2010-11-08
Category : Technology & Engineering
ISBN : 9781441976185

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3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch Pdf

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Author : Andreas Munding
Publisher : Cuvillier Verlag
Page : 137 pages
File Size : 42,6 Mb
Release : 2007
Category : Electronic
ISBN : 9783867274067

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Interconnect Technology for Three-dimensional Chip Integration by Andreas Munding Pdf

Author : Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Publisher : Springer
Page : 408 pages
File Size : 41,9 Mb
Release : 2015-12-09
Category : Science
ISBN : 9783319186757

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Three-Dimensional Integration of Semiconductors by Kazuo Kondo,Morihiro Kada,Kenji Takahashi Pdf

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
Publisher : Newnes
Page : 768 pages
File Size : 42,8 Mb
Release : 2017-07-04
Category : Technology & Engineering
ISBN : 9780124104846

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Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman Pdf

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author : Katsuyuki Sakuma
Publisher : CRC Press
Page : 219 pages
File Size : 53,7 Mb
Release : 2018-04-17
Category : Technology & Engineering
ISBN : 9781351779821

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3D Integration in VLSI Circuits by Katsuyuki Sakuma Pdf

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
Publisher : Springer Science & Business Media
Page : 292 pages
File Size : 48,7 Mb
Release : 2009-12-02
Category : Technology & Engineering
ISBN : 9781441907844

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Three-Dimensional Integrated Circuit Design by Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar Pdf

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Page : 551 pages
File Size : 44,7 Mb
Release : 2008-11-30
Category : Technology & Engineering
ISBN : 9781596932470

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Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Author : Rohit Sharma
Publisher : CRC Press
Page : 328 pages
File Size : 41,7 Mb
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781351831598

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Design of 3D Integrated Circuits and Systems by Rohit Sharma Pdf

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
Publisher : Springer
Page : 179 pages
File Size : 48,7 Mb
Release : 2014-08-21
Category : Technology & Engineering
ISBN : 9783319076119

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Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby Pdf

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Author : Vinod Pangracious,Zied Marrakchi,Habib Mehrez
Publisher : Springer
Page : 226 pages
File Size : 54,7 Mb
Release : 2015-06-25
Category : Technology & Engineering
ISBN : 9783319191744

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Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by Vinod Pangracious,Zied Marrakchi,Habib Mehrez Pdf

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Author : Yu Hao,Tan Chuan Seng
Publisher : World Scientific
Page : 392 pages
File Size : 46,9 Mb
Release : 2015-08-28
Category : Technology & Engineering
ISBN : 9789814699037

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Advances In 3d Integrated Circuits And Systems by Yu Hao,Tan Chuan Seng Pdf

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.