Assembly And Reliability Of Lead Free Solder Joints

Author : John H. Lau,Ning-Cheng Lee
Publisher : Springer Nature
Page : 545 pages
File Size : 47,9 Mb
Release : 2020-05-29
Category : Technology & Engineering
ISBN : 9789811539206

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Assembly and Reliability of Lead-Free Solder Joints by John H. Lau,Ning-Cheng Lee Pdf

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Author : Dongkai Shangguan
Publisher : ASM International
Page : 292 pages
File Size : 54,5 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 9781615030934

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Lead-Free Solder Interconnect Reliability by Dongkai Shangguan Pdf

Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 649 pages
File Size : 40,6 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461539100

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Solder Joint Reliability by John H. Lau Pdf

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Author : John W. Evans
Publisher : Springer Science & Business Media
Page : 206 pages
File Size : 51,5 Mb
Release : 2007-01-05
Category : Technology & Engineering
ISBN : 9781846283109

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A Guide to Lead-free Solders by John W. Evans Pdf

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Author : Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma
Publisher : Springer
Page : 253 pages
File Size : 47,9 Mb
Release : 2014-11-05
Category : Technology & Engineering
ISBN : 9781461492665

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Fundamentals of Lead-Free Solder Interconnect Technology by Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma Pdf

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Author : John Hock Lye Pang
Publisher : Springer Science & Business Media
Page : 184 pages
File Size : 44,7 Mb
Release : 2011-10-15
Category : Technology & Engineering
ISBN : 9781461404637

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Lead Free Solder by John Hock Lye Pang Pdf

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Author : KV Subramanian
Publisher : Springer Science & Business Media
Page : 378 pages
File Size : 49,5 Mb
Release : 2007-06-28
Category : Technology & Engineering
ISBN : 9780387484334

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Lead-Free Electronic Solders by KV Subramanian Pdf

Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Author : Jasbir Bath
Publisher : John Wiley & Sons
Page : 512 pages
File Size : 50,8 Mb
Release : 2020-06-12
Category : Technology & Engineering
ISBN : 9781119482048

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Lead-free Soldering Process Development and Reliability by Jasbir Bath Pdf

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Author : King-Ning Tu
Publisher : Springer Science & Business Media
Page : 370 pages
File Size : 44,9 Mb
Release : 2007-07-27
Category : Technology & Engineering
ISBN : 9780387388922

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Solder Joint Technology by King-Ning Tu Pdf

The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Author : Andrew E. Perkins,Suresh K. Sitaraman
Publisher : Springer Science & Business Media
Page : 202 pages
File Size : 46,9 Mb
Release : 2008-12-16
Category : Technology & Engineering
ISBN : 9780387793948

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Solder Joint Reliability Prediction for Multiple Environments by Andrew E. Perkins,Suresh K. Sitaraman Pdf

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Author : Mohd N. Tamin,Norhashimah M. Shaffiar
Publisher : Springer Science & Business
Page : 174 pages
File Size : 43,5 Mb
Release : 2014-04-26
Category : Technology & Engineering
ISBN : 9783319000923

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Solder Joint Reliability Assessment by Mohd N. Tamin,Norhashimah M. Shaffiar Pdf

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Author : Jasbir Bath
Publisher : Springer Science & Business Media
Page : 299 pages
File Size : 54,9 Mb
Release : 2007-06-26
Category : Technology & Engineering
ISBN : 9780387684222

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Lead-Free Soldering by Jasbir Bath Pdf

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Author : Sanka Ganesan,Michael G. Pecht
Publisher : John Wiley & Sons
Page : 804 pages
File Size : 53,5 Mb
Release : 2006-02-17
Category : Technology & Engineering
ISBN : 9780471786177

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Lead-free Electronics by Sanka Ganesan,Michael G. Pecht Pdf

Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.

Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Page : 1044 pages
File Size : 48,7 Mb
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 9780203021484

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter Pdf

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Page : 1044 pages
File Size : 42,9 Mb
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 9780824752491

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter Pdf

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.