Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 649 pages
File Size : 41,8 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461539100

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Solder Joint Reliability by John H. Lau Pdf

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Author : Mohd N. Tamin,Norhashimah M. Shaffiar
Publisher : Springer Science & Business
Page : 174 pages
File Size : 44,7 Mb
Release : 2014-04-26
Category : Technology & Engineering
ISBN : 9783319000923

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Solder Joint Reliability Assessment by Mohd N. Tamin,Norhashimah M. Shaffiar Pdf

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Author : King-Ning Tu
Publisher : Springer Science & Business Media
Page : 370 pages
File Size : 41,7 Mb
Release : 2007-07-27
Category : Technology & Engineering
ISBN : 9780387388922

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Solder Joint Technology by King-Ning Tu Pdf

The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 504 pages
File Size : 47,6 Mb
Release : 1991-05-31
Category : Computers
ISBN : 0442002602

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Solder Joint Reliability by John H. Lau Pdf

Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Author : Andrew E. Perkins,Suresh K. Sitaraman
Publisher : Springer Science & Business Media
Page : 202 pages
File Size : 48,8 Mb
Release : 2008-12-16
Category : Technology & Engineering
ISBN : 9780387793948

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Solder Joint Reliability Prediction for Multiple Environments by Andrew E. Perkins,Suresh K. Sitaraman Pdf

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Author : John H. Lau,Ning-Cheng Lee
Publisher : Springer Nature
Page : 545 pages
File Size : 51,9 Mb
Release : 2020-05-29
Category : Technology & Engineering
ISBN : 9789811539206

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Assembly and Reliability of Lead-Free Solder Joints by John H. Lau,Ning-Cheng Lee Pdf

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Author : John H. Lau
Publisher : Unknown
Page : 656 pages
File Size : 49,7 Mb
Release : 2014-09-01
Category : Electronic
ISBN : 1461539110

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Solder Joint Reliability by John H. Lau Pdf

Author : John H. Lau,Yi-hsin Pao
Publisher : McGraw-Hill Professional Publishing
Page : 440 pages
File Size : 47,8 Mb
Release : 1997
Category : Technology & Engineering
ISBN : UOM:39015041017537

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau,Yi-hsin Pao Pdf

The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.

Author : Erdogan Madenci,Ibrahim Guven,Bahattin Kilic
Publisher : Springer Science & Business Media
Page : 201 pages
File Size : 41,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461502555

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® by Erdogan Madenci,Ibrahim Guven,Bahattin Kilic Pdf

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Author : John Hock Lye Pang
Publisher : Springer Science & Business Media
Page : 184 pages
File Size : 47,8 Mb
Release : 2011-10-15
Category : Technology & Engineering
ISBN : 9781461404637

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Lead Free Solder by John Hock Lye Pang Pdf

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Author : Dongkai Shangguan
Publisher : ASM International
Page : 292 pages
File Size : 51,5 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 9781615030934

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Lead-Free Solder Interconnect Reliability by Dongkai Shangguan Pdf

Author : Benoit Eynard,Vincenzo Nigrelli,Salvatore Massimo Oliveri,Guillermo Peris-Fajarnes,Sergio Rizzuti
Publisher : Springer
Page : 1245 pages
File Size : 52,9 Mb
Release : 2016-09-02
Category : Technology & Engineering
ISBN : 9783319457819

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Advances on Mechanics, Design Engineering and Manufacturing by Benoit Eynard,Vincenzo Nigrelli,Salvatore Massimo Oliveri,Guillermo Peris-Fajarnes,Sergio Rizzuti Pdf

This book gathers papers presented at the International Joint Conference on Mechanics, Design Engineering and Advanced Manufacturing (JCM 2016), held on 14-16 September, 2016, in Catania, Italy. It reports on cutting-edge topics in product design and manufacturing, such as industrial methods for integrated product and process design; innovative design; and computer-aided design. Further topics covered include virtual simulation and reverse engineering; additive manufacturing; product manufacturing; engineering methods in medicine and education; representation techniques; and nautical, aeronautics and aerospace design and modeling. The book is divided into eight main sections, reflecting the focus and primary themes of the conference. The contributions presented here will not only provide researchers, engineers and experts in a range of industrial engineering subfields with extensive information to support their daily work; they are also intended to stimulate new research directions, advanced applications of the methods discussed, and future interdisciplinary collaborations.

Author : Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau
Publisher : Springer Science & Business Media
Page : 434 pages
File Size : 52,6 Mb
Release : 1994-01-31
Category : Computers
ISBN : 0442015054

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Mechanics of Solder Alloy Interconnects by Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau Pdf

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Author : Jasbir Bath
Publisher : John Wiley & Sons
Page : 512 pages
File Size : 50,7 Mb
Release : 2020-06-12
Category : Technology & Engineering
ISBN : 9781119482048

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Lead-free Soldering Process Development and Reliability by Jasbir Bath Pdf

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Author : John W. Evans
Publisher : Springer Science & Business Media
Page : 206 pages
File Size : 51,8 Mb
Release : 2007-01-05
Category : Technology & Engineering
ISBN : 9781846283109

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A Guide to Lead-free Solders by John W. Evans Pdf

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.