Chemical Mechanical Polishing Fundamentals And Challenges Volume 566
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Electrochemical Processing in ULSI Fabrication III by Panayotis C. Andricacos,Electrochemical Society. Electrodeposition Division,Electrochemical Society. Dielectric Science and Technology Division,Electrochemical Society. Electronics Division Pdf
"Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Microelectronic Applications of Chemical Mechanical Planarization by Yuzhuo Li Pdf
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Surfactants in Precision Cleaning by Rajiv Kohli,Kashmiri L. Mittal Pdf
Surfactants in Precision Cleaning: Removal of Contaminants at the Micro and Nanoscale is a single source of information on surfactants, emulsions, microemulsions and detergents for removal of surface contaminants at the micro and nanoscale. The topics covered include cleaning mechanisms, effect of surfactants, types of stable dispersions (emulsions, microemulsions, surfactants, detergents, etc.), cleaning technology, and cleaning applications. Users will find this volume an excellent resource on the use of stable dispersions in precision cleaning. Single source of current information on surfactants, emulsions, microemulsions and detergents for precision cleaning applications Includes a list of extensive reference sources Discusses specific selection and properties of surfactants and their use in cleaning Provides a guide for cleaning applications in different industry sectors
Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613 by Rajiv K. Singh,Rajeev Bajaj,Mansour Moinpour,Marc Meuris Pdf
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.
Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: Volume 671 by Materials Research Society. Meeting Pdf
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.