Author : Kim S. Siow
Publisher : Unknown
Page : 128 pages
File Size : 53,6 Mb
Release : 2019
Category : Microelectronic packaging
ISBN : 3319992570
Die-attach Materials for High Temperature Applications in Microelectronics Packaging by Kim S. Siow Pdf
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.