Electronic Packaging Materials And Their Properties

Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
Publisher : CRC Press
Page : 112 pages
File Size : 41,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351830041

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Electronic Packaging Materials and Their Properties by Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan Pdf

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
Publisher : CRC Press
Page : 120 pages
File Size : 54,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781498730860

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Electronic Packaging Materials and Their Properties by Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan Pdf

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Author : Deborah Chung
Publisher : Elsevier
Page : 368 pages
File Size : 42,7 Mb
Release : 1995-03-31
Category : Technology & Engineering
ISBN : 0080511171

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Materials for Electronic Packaging by Deborah Chung Pdf

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Author : Richard K. Ulrich,William D. Brown
Publisher : John Wiley & Sons
Page : 852 pages
File Size : 45,7 Mb
Release : 2006-02-24
Category : Technology & Engineering
ISBN : 9780471466093

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Advanced Electronic Packaging by Richard K. Ulrich,William D. Brown Pdf

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
Page : 633 pages
File Size : 53,5 Mb
Release : 2011-01-05
Category : Technology & Engineering
ISBN : 9781441977595

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Pdf

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : William M. Alvino
Publisher : McGraw-Hill Companies
Page : 394 pages
File Size : 51,7 Mb
Release : 1995
Category : Technology & Engineering
ISBN : UOM:39015033260939

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Plastics for Electronics by William M. Alvino Pdf

Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Density Electronic Packaging
Publisher : National Academies Press
Page : 154 pages
File Size : 45,8 Mb
Release : 1990-02-01
Category : Technology & Engineering
ISBN : 9780309042338

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Materials for High-Density Electronic Packaging and Interconnection by National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Density Electronic Packaging Pdf

Author : Sanjay Mavinkere Rangappa,Jyotishkumar Parameswaranpillai,Senthil Muthu Kumar Thiagamani,Senthilkumar Krishnasamy,Suchart Siengchin
Publisher : CRC Press
Page : 278 pages
File Size : 48,8 Mb
Release : 2020-10-20
Category : Technology & Engineering
ISBN : 9781000194371

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Food Packaging by Sanjay Mavinkere Rangappa,Jyotishkumar Parameswaranpillai,Senthil Muthu Kumar Thiagamani,Senthilkumar Krishnasamy,Suchart Siengchin Pdf

Food Packaging: Advanced Materials, Technologies, and Innovations is a one-stop reference for packaging materials researchers working across various industries. With chapters written by leading international researchers from industry, academia, government, and private research institutions, this book offers a broad view of important developments in food packaging. Presents an extensive survey of food packaging materials and modern technologies Demonstrates the potential of various materials for use in demanding applications Discusses the use of polymers, composites, nanotechnology, hybrid materials, coatings, wood-based, and other materials in packaging Describes biodegradable packaging, antimicrobial studies, and environmental issues related to packaging materials Offers current status, trends, opportunities, and future directions Aimed at advanced students, research scholars, and professionals in food packaging development, this application-oriented book will help expand the reader’s knowledge of advanced materials and their use of innovation in food packaging.

Author : Xingyou Tian
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 51,8 Mb
Release : 2023-12-12
Category : Technology & Engineering
ISBN : 9783527843107

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Thermal Management Materials for Electronic Packaging by Xingyou Tian Pdf

Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

Author : Steffen G. Scholz,Robert J. Howlett,Rossi Setchi
Publisher : Springer Nature
Page : 363 pages
File Size : 40,8 Mb
Release : 2021-09-17
Category : Technology & Engineering
ISBN : 9789811661280

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Sustainable Design and Manufacturing by Steffen G. Scholz,Robert J. Howlett,Rossi Setchi Pdf

This book consists of peer-reviewed papers, presented at the International Conference on Sustainable Design and Manufacturing (SDM 2021). Leading-edge research into sustainable design and manufacturing aims to enable the manufacturing industry to grow by adopting more advanced technologies and at the same time improve its sustainability by reducing its environmental impact. Relevant themes and topics include sustainable design, innovation and services; sustainable manufacturing processes and technology; sustainable manufacturing systems and enterprises; and decision support for sustainability. Application areas are wide and varied. The book will provide an excellent overview of the latest developments in the sustainable design and manufacturing area.

Author : Mohd Arif Anuar Mohd Salleh,Dewi Suriyani Che Halin,Kamrosni Abdul Razak,Mohd Izrul Izwan Ramli
Publisher : Springer Nature
Page : 873 pages
File Size : 43,6 Mb
Release : 2023-07-02
Category : Science
ISBN : 9789811992674

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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium by Mohd Arif Anuar Mohd Salleh,Dewi Suriyani Che Halin,Kamrosni Abdul Razak,Mohd Izrul Izwan Ramli Pdf

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Author : Guosheng Jiang,Liyong Diao,Ken Kuang
Publisher : Springer Science & Business Media
Page : 156 pages
File Size : 51,9 Mb
Release : 2012-09-13
Category : Technology & Engineering
ISBN : 9781461419631

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Advanced Thermal Management Materials by Guosheng Jiang,Liyong Diao,Ken Kuang Pdf

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

Author : Anonim
Publisher : ASM International
Page : 1234 pages
File Size : 52,8 Mb
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 0871702851

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Electronic Materials Handbook by Anonim Pdf

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Author : Michael Pecht
Publisher : CRC Press
Page : 904 pages
File Size : 44,6 Mb
Release : 2018-10-24
Category : Technology & Engineering
ISBN : 9781351838412

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Handbook of Electronic Package Design by Michael Pecht Pdf

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Author : Lyndhurst Collins
Publisher : Routledge
Page : 428 pages
File Size : 51,7 Mb
Release : 2019-07-23
Category : Social Science
ISBN : 9781000010497

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Use Of Models Soc Science by Lyndhurst Collins Pdf

This book deals with the philosophy of model use; focuses on the role of models in the natural sciences; and introduces a new paradigm to the social sciences, catastrophe model. It outlines the role of models concerned with conflict problems, particularly problems of military strategy.