Dielectric Breakdown In Gigascale Electronics

Author : Juan Pablo Borja,Toh-Ming Lu,Joel Plawsky
Publisher : Springer
Page : 105 pages
File Size : 42,6 Mb
Release : 2016-09-16
Category : Technology & Engineering
ISBN : 9783319432205

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Dielectric Breakdown in Gigascale Electronics by Juan Pablo Borja,Toh-Ming Lu,Joel Plawsky Pdf

This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.

Author : Ming He,Toh-Ming Lu
Publisher : Springer Science & Business Media
Page : 149 pages
File Size : 46,5 Mb
Release : 2012-02-02
Category : Technology & Engineering
ISBN : 1461418127

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Metal-Dielectric Interfaces in Gigascale Electronics by Ming He,Toh-Ming Lu Pdf

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Author : Dongkai Shangguan
Publisher : CRC Press
Page : 463 pages
File Size : 45,7 Mb
Release : 2024-06-28
Category : Technology & Engineering
ISBN : 9781040028643

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Direct Copper Interconnection for Advanced Semiconductor Technology by Dongkai Shangguan Pdf

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Author : Jeffrey A. Davis,James D. Meindl
Publisher : Springer Science & Business Media
Page : 417 pages
File Size : 43,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461504610

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Interconnect Technology and Design for Gigascale Integration by Jeffrey A. Davis,James D. Meindl Pdf

This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Author : Titu I. Băjenescu,Marius I. Bâzu
Publisher : Artech House
Page : 706 pages
File Size : 40,5 Mb
Release : 2010
Category : Technology & Engineering
ISBN : 9781596934368

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Component Reliability for Electronic Systems by Titu I. Băjenescu,Marius I. Bâzu Pdf

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Author : Titu I. Bajenescu,Marius I. Bazu
Publisher : Springer Science & Business Media
Page : 547 pages
File Size : 50,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9783642585050

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Reliability of Electronic Components by Titu I. Bajenescu,Marius I. Bazu Pdf

This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Author : Anonim
Publisher : Unknown
Page : 1046 pages
File Size : 48,8 Mb
Release : 2008
Category : Electronics
ISBN : UIUC:30112085966460

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IEICE Transactions on Electronics by Anonim Pdf

Author : Howard R. Huff,Werner Bergholz,Koji Sumino
Publisher : The Electrochemical Society
Page : 1284 pages
File Size : 50,5 Mb
Release : 1994
Category : Semiconductors
ISBN : 1566770424

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Semiconductor Silicon 1994 by Howard R. Huff,Werner Bergholz,Koji Sumino Pdf

Author : Anonim
Publisher : Unknown
Page : 520 pages
File Size : 51,8 Mb
Release : 2002
Category : Electrical engineering
ISBN : UCAL:C3572579

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Memorandum by Anonim Pdf

Author : Rolf E. Hummel
Publisher : Springer
Page : 412 pages
File Size : 47,8 Mb
Release : 2013-11-11
Category : Technology & Engineering
ISBN : 9789401749145

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Electronic Properties of Materials by Rolf E. Hummel Pdf

It is quite satisfying for an author to learn that his brainchild has been favorably accepted by students as well as by professors and thus seems to serve some useful purpose. This horizontally integrated text on the electronic properties of metals, alloys, semiconductors, insulators, ceramics, and poly meric materials has been adopted by many universities in the United States as well as abroad, probably because of the relative ease with which the material can be understood. The book has now gone through several re printing cycles (among them a few pirate prints in Asian countries). I am grateful to all readers for their acceptance and for the many encouraging comments which have been received. I have thought very carefully about possible changes for the second edition. There is, of course, always room for improvement. Thus, some rewording, deletions, and additions have been made here and there. I withstood, how ever, the temptation to expand considerably the book by adding completely new subjects. Nevertheless, a few pages on recent developments needed to be inserted. Among them are, naturally, the discussion of ceramic (high-tempera ture) superconductors, and certain elements of the rapidly expanding field of optoelectronics. Further, I felt that the readers might be interested in learning some more practical applications which result from the physical concepts which have been treated here.

Author : Anonim
Publisher : Unknown
Page : 306 pages
File Size : 50,6 Mb
Release : 2001
Category : Silicon dioxide
ISBN : UOM:39015058899272

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Silicon Nitride and Silicon Dioxide Thin Insulating Films by Anonim Pdf

Author : Ming Yang
Publisher : Unknown
Page : 688 pages
File Size : 40,7 Mb
Release : 2001
Category : Semiconductors
ISBN : UCAL:C3785029

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Semiconductor Technology (ISTC 2001) by Ming Yang Pdf

Author : Electrochemical Society. Dielectric Science and Technology Division
Publisher : The Electrochemical Society
Page : 304 pages
File Size : 44,6 Mb
Release : 2001
Category : Science
ISBN : 156677313X

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Silicon Nitride and Silicon Dioxide Thin Insulating Films by Electrochemical Society. Dielectric Science and Technology Division Pdf

Author : Rolf E. Hummel
Publisher : Springer Science & Business Media
Page : 323 pages
File Size : 49,6 Mb
Release : 2013-04-17
Category : Technology & Engineering
ISBN : 9783662024249

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Electronic Properties of Materials by Rolf E. Hummel Pdf

The present book on electrical, optical, magnetic and thermal properties of materials is in many aspects different from other introductory texts in solid state physics. First of all, this book is written for engineers, particularly materials and electrical engineers who want to gain a fundamental under standing of semiconductor devices, magnetic materials, lasers, alloys, etc. Second, it stresses concepts rather than mathematical formalism, which should make the presentation relatively easy to understand. Thus, this book provides a thorough preparation for advanced texts, monographs, or special ized journal articles. Third, this book is not an encyclopedia. The selection oftopics is restricted to material which is considered to be essential and which can be covered in a 15-week semester course. For those professors who want to teach a two-semester course, supplemental topics can be found which deepen the understanding. (These sections are marked by an asterisk [*]. ) Fourth, the present text leaves the teaching of crystallography, X-ray diffrac tion, diffusion, lattice defects, etc. , to those courses which specialize in these subjects. As a rule, engineering students learn this material at the beginning of their upper division curriculum. The reader is, however, reminded of some of these topics whenever the need arises. Fifth, this book is distinctly divided into five self-contained parts which may be read independently.

Author : IEEE Circuits and Systems Society
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 974 pages
File Size : 54,8 Mb
Release : 2003
Category : Technology & Engineering
ISBN : UOM:39015047929818

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IEEE International Symposium on Circuits and Systems by IEEE Circuits and Systems Society Pdf

These volumes relate to matters discussed during the 2003 IEEE International Symposium on Circuits and Systems, such as: analogue circuits and signal processing; communications; multimedia systems and applications; general and nonlinear circuits and systems; and neural networks and systems.