Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium

Author : Mohd Arif Anuar Mohd Salleh,Dewi Suriyani Che Halin,Kamrosni Abdul Razak,Mohd Izrul Izwan Ramli
Publisher : Springer Nature
Page : 873 pages
File Size : 51,5 Mb
Release : 2023-07-02
Category : Science
ISBN : 9789811992674

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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium by Mohd Arif Anuar Mohd Salleh,Dewi Suriyani Che Halin,Kamrosni Abdul Razak,Mohd Izrul Izwan Ramli Pdf

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Author : Kazuhiro Nogita,Mohd Arif Anuar Mohd Salleh,Mohd Mustafa Al Bakri Abdullah,Liyana Jamaludin,Muhammad Faheem Mohd Tahir
Publisher : Trans Tech Publications Ltd
Page : 210 pages
File Size : 44,6 Mb
Release : 2018-04-13
Category : Technology & Engineering
ISBN : 9783035733242

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Electronic Packaging Interconnect Technology by Kazuhiro Nogita,Mohd Arif Anuar Mohd Salleh,Mohd Mustafa Al Bakri Abdullah,Liyana Jamaludin,Muhammad Faheem Mohd Tahir Pdf

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.

Author : Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma
Publisher : Springer
Page : 253 pages
File Size : 46,7 Mb
Release : 2014-11-05
Category : Technology & Engineering
ISBN : 9781461492665

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Fundamentals of Lead-Free Solder Interconnect Technology by Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma Pdf

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Author : Fred D. Barlow, III,Aicha Elshabini
Publisher : CRC Press
Page : 456 pages
File Size : 44,6 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420018967

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Ceramic Interconnect Technology Handbook by Fred D. Barlow, III,Aicha Elshabini Pdf

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Author : John R. Susko,Randy W. Snyder,Robin A. Susko
Publisher : Unknown
Page : 228 pages
File Size : 45,9 Mb
Release : 1988
Category : Electrochemistry
ISBN : STANFORD:36105030501303

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Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications by John R. Susko,Randy W. Snyder,Robin A. Susko Pdf

Author : Dongkai Shangguan
Publisher : ASM International
Page : 292 pages
File Size : 50,7 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 9781615030934

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Lead-Free Solder Interconnect Reliability by Dongkai Shangguan Pdf

Author : Gerald A. Walker
Publisher : Springer
Page : 342 pages
File Size : 41,7 Mb
Release : 2013-12-11
Category : Technology & Engineering
ISBN : 9781489973115

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Advances in Electronic Circuit Packaging by Gerald A. Walker Pdf

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 51,6 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author : P. Bindra,Robin A. Susko
Publisher : Unknown
Page : 266 pages
File Size : 53,5 Mb
Release : 1989
Category : Electronic packaging
ISBN : STANFORD:36105030017508

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Proceedings of the Symposium on Packaging of Electronic Devices by P. Bindra,Robin A. Susko Pdf

Author : Ken Gilleo
Publisher : Springer Science & Business Media
Page : 450 pages
File Size : 43,8 Mb
Release : 1995-10-31
Category : Computers
ISBN : 0442012209

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Polymer Thick Film by Ken Gilleo Pdf

Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.

Author : Anonim
Publisher : Unknown
Page : 858 pages
File Size : 45,9 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015058766992

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Advances in Electronic Packaging by Anonim Pdf

Author : Anonim
Publisher : Unknown
Page : 322 pages
File Size : 40,9 Mb
Release : 2005
Category : Electronic packaging
ISBN : UOM:39015064359949

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International Symposium on Advanced Packaging Materials by Anonim Pdf

Author : Lawrence L. Rosine
Publisher : Springer
Page : 297 pages
File Size : 55,5 Mb
Release : 2013-12-01
Category : Technology & Engineering
ISBN : 9781489973078

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Advances in Electronic Circuit Packaging by Lawrence L. Rosine Pdf

Author : Anonim
Publisher : Unknown
Page : 998 pages
File Size : 44,9 Mb
Release : 1988
Category : Electronic packaging
ISBN : UCSD:31822018788679

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Proceedings of the Technical Conference by Anonim Pdf

Author : Mailadil T. Sebastian,Rick Ubic,Heli Jantunen
Publisher : John Wiley & Sons
Page : 1021 pages
File Size : 51,9 Mb
Release : 2017-05-08
Category : Technology & Engineering
ISBN : 9781119208525

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Microwave Materials and Applications, 2 Volume Set by Mailadil T. Sebastian,Rick Ubic,Heli Jantunen Pdf

The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.