Fine Pitch Surface Mount Technology

Author : Phil Marcoux
Publisher : Springer Science & Business Media
Page : 351 pages
File Size : 46,5 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461535324

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Fine Pitch Surface Mount Technology by Phil Marcoux Pdf

Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

Author : John H. Lau
Publisher : Springer
Page : 732 pages
File Size : 48,8 Mb
Release : 1994
Category : Computers
ISBN : UOM:39015033084396

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Handbook of Fine Pitch Surface Mount Technology by John H. Lau Pdf

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

Author : H. Danielsson
Publisher : Springer
Page : 264 pages
File Size : 42,8 Mb
Release : 1995
Category : Technology & Engineering
ISBN : UOM:39015032200944

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Surface Mount Technology with Fine Pitch Components by H. Danielsson Pdf

This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.

Author : Phil Marcoux
Publisher : Unknown
Page : 356 pages
File Size : 41,6 Mb
Release : 2014-09-01
Category : Electronic
ISBN : 1461535336

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Fine Pitch Surface Mount Technology by Phil Marcoux Pdf

Author : Vern Solberg
Publisher : McGraw-Hill Professional Publishing
Page : 296 pages
File Size : 47,8 Mb
Release : 1996
Category : Technology & Engineering
ISBN : UOM:39015037859207

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Design Guidelines for Surface Mount and Fine Pitch Technology by Vern Solberg Pdf

Very Good,No Highlights or Markup,all pages are intact.

Author : Frank Classon
Publisher : McGraw-Hill Companies
Page : 312 pages
File Size : 42,8 Mb
Release : 1993
Category : Technology & Engineering
ISBN : UOM:39015029559211

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Surface Mount Technology for Concurrent Engineering and Manufacturing by Frank Classon Pdf

A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.

Author : Ray Prasad
Publisher : Springer Science & Business Media
Page : 791 pages
File Size : 50,8 Mb
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 9781461540847

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Surface Mount Technology by Ray Prasad Pdf

A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Author : Vern Solberg,Charles A. Harper
Publisher : McGraw-Hill
Page : 261 pages
File Size : 42,5 Mb
Release : 1999-11
Category : Architecture
ISBN : 007136045X

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Design Guidelines for Surface Mount and Fine-Pitch Technology by Vern Solberg,Charles A. Harper Pdf

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 47,9 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

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Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : Ning-Cheng Lee
Publisher : Elsevier
Page : 288 pages
File Size : 54,8 Mb
Release : 2002-01-24
Category : Technology & Engineering
ISBN : 9780080492247

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Reflow Soldering Processes by Ning-Cheng Lee Pdf

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Author : Glenn R. Blackwell,James K. Hollomon
Publisher : Delmar Thomson Learning
Page : 548 pages
File Size : 54,9 Mb
Release : 2006
Category : Computers
ISBN : UOM:39015062615169

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Surface-mount Technology for PC Boards by Glenn R. Blackwell,James K. Hollomon Pdf

Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.

Author : Carmen Capillo
Publisher : McGraw-Hill Companies
Page : 376 pages
File Size : 52,7 Mb
Release : 1989
Category : Computers
ISBN : STANFORD:36105030501162

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Surface Mount Technology by Carmen Capillo Pdf

Author : Robert J. Rowland,Paul Belangia
Publisher : Springer
Page : 274 pages
File Size : 46,6 Mb
Release : 1993-02-28
Category : Computers
ISBN : UOM:39015042556749

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Applied Surface Mount Assembly by Robert J. Rowland,Paul Belangia Pdf

A practical guide to setting up and running a surface mount operation, now the most widely used method of placing components on printed circuit boards as part of assembling electronic devices. Among the topics are laying out a printed circuit board, choosing the right component and the manufacturing process, plant layout and process flow, and monitoring and evaluating the process. Annotation copyright by Book News, Inc., Portland, OR

Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Page : 1044 pages
File Size : 48,7 Mb
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 9780203021484

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter Pdf

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Author : Richard C. Dorf
Publisher : CRC Press
Page : 2758 pages
File Size : 50,9 Mb
Release : 1997-09-26
Category : Technology & Engineering
ISBN : 1420049763

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The Electrical Engineering Handbook,Second Edition by Richard C. Dorf Pdf

In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.