Microelectronics Packaging Handbook

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 54,9 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461560371

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 49,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461540861

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 51,5 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

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Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer
Page : 3000 pages
File Size : 48,9 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084619

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Microelectronics Packaging Handbook, 3-part set by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : R. R. Tummala,Eugene J Rymaszewski,Alan G Klopfenstein
Publisher : Unknown
Page : 752 pages
File Size : 54,7 Mb
Release : 1997-01-31
Category : Electronic
ISBN : 1461540879

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Microelectronics Packaging Handbook by R. R. Tummala,Eugene J Rymaszewski,Alan G Klopfenstein Pdf

Author : R. R. Tummala,E.J. Rymaszewski
Publisher : Van Nostrand Reinhold Company
Page : 1000 pages
File Size : 40,6 Mb
Release : 1996-09-15
Category : Electronic
ISBN : 0442019637

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Microelectronics Packaging Handbook by R. R. Tummala,E.J. Rymaszewski Pdf

Author : R.R. Tummala
Publisher : Springer
Page : 0 pages
File Size : 43,5 Mb
Release : 1989-01-14
Category : Technology & Engineering
ISBN : 1461310695

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Microelectronics Packaging Handbook by R.R. Tummala Pdf

RALPH E. GOMORY IBM SENIOR VICE-PRESIDENT, SCIENCE AND TECHNOLOGY Far from being passive containers for microelectronic devices, the so-called "packages" in today's advanced computers pose at least as many engineering challenges as the chips that they interconnect, power, and cool. New pack aging concepts often lead their developers into uncharted areas of science. Ultimately, progress in packaging is likely to set the limits on how far computers can evolve. And yet, this technology has never captured the public imagination in the way that chips have. Worse, it has been largely overlooked by universities as a prime subject for teaching and research. In part, this academic oversight stems from packaging's multidiscipli nary nature. Packaging involves the solution of electrical, mechanical, and thermal problems; it requires understanding at the molecular level not only of silicon but of metals, ceramics, polymers, glass, and composites. In short, iii iv FOREWORD it is poorly matched to the traditional separation of university disciplines. Another roadblock has been the lack of a comprehensive book dealing ade quately with state of the art packaging design and modern industry require ments.

Author : TUMMALA RAO R.
Publisher : Springer
Page : 128 pages
File Size : 48,5 Mb
Release : 1996-12-15
Category : Science
ISBN : 0442019939

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Microelectronics Packaging Handbook by TUMMALA RAO R. Pdf

Author : Anonim
Publisher : ASM International
Page : 1234 pages
File Size : 49,6 Mb
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 0871702851

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Electronic Materials Handbook by Anonim Pdf

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer
Page : 628 pages
File Size : 49,8 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

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Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : Jerry E. Sergent,Charles A. Harper
Publisher : McGraw-Hill Companies
Page : 778 pages
File Size : 46,6 Mb
Release : 1995
Category : Hybrid integrated circuits
ISBN : UOM:39015034411028

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Hybrid Microelectronics Handbook by Jerry E. Sergent,Charles A. Harper Pdf

Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.

Author : Rao R. Tummala,Eugene J. Raymaszewski
Publisher : Unknown
Page : 128 pages
File Size : 50,9 Mb
Release : 1997
Category : Electronic
ISBN : 0412844311

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Microelectronics Packaging Handbook by Rao R. Tummala,Eugene J. Raymaszewski Pdf

Author : Rao Tummala
Publisher : McGraw Hill Professional
Page : 978 pages
File Size : 46,5 Mb
Release : 2001-05-29
Category : Technology & Engineering
ISBN : 9780071418072

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Fundamentals of Microsystems Packaging by Rao Tummala Pdf

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 832 pages
File Size : 42,8 Mb
Release : 2002
Category : Business & Economics
ISBN : UOM:39015053514967

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Area Array Packaging Handbook by Ken Gilleo Pdf

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 638 pages
File Size : 50,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420049848

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.