Handbook Of Electronics Packaging Design And Engineering

Author : Bernard S. Matisoff
Publisher : Springer Science & Business Media
Page : 480 pages
File Size : 46,8 Mb
Release : 2012-12-06
Category : Science
ISBN : 9789401169790

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Handbook Of Electronics Packaging Design and Engineering by Bernard S. Matisoff Pdf

The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 638 pages
File Size : 45,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781420049848

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author : Michael Pecht
Publisher : CRC Press
Page : 904 pages
File Size : 49,7 Mb
Release : 2018-10-24
Category : Technology & Engineering
ISBN : 9781351838412

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Handbook of Electronic Package Design by Michael Pecht Pdf

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Author : Bernie Matisoff
Publisher : Springer Science & Business Media
Page : 691 pages
File Size : 42,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461560470

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Handbook of Electronics Manufacturing Engineering by Bernie Matisoff Pdf

This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products. Providing a stategic yet simplified layout, this handbook is set up with an eye toward maximizing productivity in each phase of the eletronics manufacturing process. Not only does this handbook inform the reader on vital issues concerning electronics manufacturing and design, it also provides practical insight and will be of essential use to manufacturing and process engineers in electronics and aerospace manufacturing. In addition, electronics packaging engineers and electronics manufacturing managers and supervisors will gain a wealth of knowledge.

Author : Anonim
Publisher : ASM International
Page : 1234 pages
File Size : 42,9 Mb
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 0871702851

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Electronic Materials Handbook by Anonim Pdf

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Author : John H. Lau,John Prince,C. P. Wong,Wataru Nakayama
Publisher : McGraw-Hill Professional Publishing
Page : 0 pages
File Size : 50,7 Mb
Release : 1998
Category : Electronic packaging
ISBN : 0070371350

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Electronic Packaging by John H. Lau,John Prince,C. P. Wong,Wataru Nakayama Pdf

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Author : Ali Jamnia
Publisher : CRC Press
Page : 336 pages
File Size : 49,5 Mb
Release : 2008-11-20
Category : Technology & Engineering
ISBN : 9781439870921

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Practical Guide to the Packaging of Electronics, Second Edition by Ali Jamnia Pdf

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

Author : Ali Jamnia
Publisher : CRC Press
Page : 226 pages
File Size : 42,6 Mb
Release : 2002-10-08
Category : Technology & Engineering
ISBN : 0824708652

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Practical Guide to the Packaging of Electronics by Ali Jamnia Pdf

Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

Author : Bernard S. Matisoff
Publisher : Springer Science & Business Media
Page : 574 pages
File Size : 41,6 Mb
Release : 2012-12-06
Category : Science
ISBN : 9789401170383

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Handbook of Electronics Manufacturing Engineering by Bernard S. Matisoff Pdf

Author : Charles A. Harper
Publisher : McGraw Hill Professional
Page : 1002 pages
File Size : 53,7 Mb
Release : 2005
Category : Technology & Engineering
ISBN : 0071430482

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Electronic Packaging and Interconnection Handbook 4/E by Charles A. Harper Pdf

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Author : Joseph F. Hanlon,Robert J. Kelsey,Hallie Forcinio
Publisher : CRC Press
Page : 730 pages
File Size : 47,7 Mb
Release : 1998-04-23
Category : Technology & Engineering
ISBN : 1566763061

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Handbook of Package Engineering, Third Edition by Joseph F. Hanlon,Robert J. Kelsey,Hallie Forcinio Pdf

Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in the materials and structures of packaging. It reviews the essentials of production - packaging operations, line layout, and the machines that are required in order to perform basic packaging functions. It introduces the increasing web of laws and regulations controlling virtually all packaged products.

Author : Charles A. Harper
Publisher : McGraw-Hill Professional Publishing
Page : 1398 pages
File Size : 48,9 Mb
Release : 2001
Category : Reference
ISBN : UOM:39015053384502

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Handbook of Materials for Product Design by Charles A. Harper Pdf

HANDBOOK OF MATERIALS FOR PRODUCT DESIGN This unique reference can help you: * Generate ideas for new products * Specify expertly for robust, manufacturable, economical, customer-pleasing products * Compare options easily with plentiful data tables, charts, graphs, and illustrations * Cut costs and improve performance with new products * Create unique materials with expert guidance * Find needed data on design, testing, specifications, standards, recyclability, and biodegradability * Get selection tips from the world's leading experts * Know you've made the best choices For those needing to generate new product concepts, select materials and designs that make these innovative ideas work, or stay ahead of the learning curve in the fast-evolving field of materials technology, this in-depth HANDBOOK OF MATERIALS FOR PRODUCT DESIGN provides a one-stop source of answers. Edited by an internationally respected expert in materials technology, HANDBOOK OF MATERIALS FOR PRODUCT DESIGN is an indispensable asset to anyone involved in product creation.

Author : Charles A. Harper
Publisher : McGraw Hill Professional
Page : 765 pages
File Size : 45,8 Mb
Release : 2003-08-22
Category : Technology & Engineering
ISBN : 9780071433464

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Electronic Materials and Processes Handbook by Charles A. Harper Pdf

Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling

Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 832 pages
File Size : 40,5 Mb
Release : 2002
Category : Business & Economics
ISBN : UOM:39015053514967

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Area Array Packaging Handbook by Ken Gilleo Pdf

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 42,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461540861

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.