High Performance Design Automation For Multi Chip Modules And Packages

Author : Jun-Dong Cho,Paul D. Franzon
Publisher : World Scientific
Page : 272 pages
File Size : 52,6 Mb
Release : 1996
Category : Technology & Engineering
ISBN : 9810223072

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High Performance Design Automation for Multi-chip Modules and Packages by Jun-Dong Cho,Paul D. Franzon Pdf

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Author : Ernest S. Kuh
Publisher : World Scientific
Page : 172 pages
File Size : 46,5 Mb
Release : 1992
Category : Technology & Engineering
ISBN : 9810209258

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Multichip Modules by Ernest S. Kuh Pdf

Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.

Author : Lei He,Shauki Elassaad,Yiyu Shi
Publisher : Now Publishers Inc
Page : 93 pages
File Size : 49,9 Mb
Release : 2011-06-20
Category : Computers
ISBN : 9781601984586

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System-in-Package by Lei He,Shauki Elassaad,Yiyu Shi Pdf

Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.

Author : Naveed A. Sherwani
Publisher : Springer Science & Business Media
Page : 572 pages
File Size : 44,8 Mb
Release : 2007-05-08
Category : Computers
ISBN : 9780306475092

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Algorithms for VLSI Physical Design Automation by Naveed A. Sherwani Pdf

Algorithms for VLSI Physical Design Automation, Third Edition covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concepts and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level. Algorithms for VLSI Physical Design Automation, Third Edition provides a comprehensive background in the principles and algorithms of VLSI physical design. The goal of this book is to serve as a basis for the development of introductory-level graduate courses in VLSI physical design automation. It provides self-contained material for teaching and learning algorithms of physical design. All algorithms which are considered basic have been included, and are presented in an intuitive manner. Yet, at the same time, enough detail is provided so that readers can actually implement the algorithms given in the text and use them. The first three chapters provide the background material, while the focus of each chapter of the rest of the book is on each phase of the physical design cycle. In addition, newer topics such as physical design automation of FPGAs and MCMs have been included. The basic purpose of the third edition is to investigate the new challenges presented by interconnect and process innovations. In 1995 when the second edition of this book was prepared, a six-layer process and 15 million transistor microprocessors were in advanced stages of design. In 1998, six metal process and 20 million transistor designs are in production. Two new chapters have been added and new material has been included in almost allother chapters. A new chapter on process innovation and its impact on physical design has been added. Another focus of the third edition is to promote use of the Internet as a resource, so wherever possible URLs have been provided for further investigation. Algorithms for VLSI Physical Design Automation, Third Edition is an important core reference work for professionals as well as an advanced level textbook for students.

Author : Michael Niedermayer
Publisher : Artech House
Page : 243 pages
File Size : 51,9 Mb
Release : 2011-12
Category : Technology & Engineering
ISBN : 9781608070855

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Cost-driven Design of Smart Microsystems by Michael Niedermayer Pdf

Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.

Author : Daryl Ann Doane,Paul Franzon
Publisher : Springer Science & Business Media
Page : 895 pages
File Size : 44,7 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461531005

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Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane,Paul Franzon Pdf

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Author : Sergei A Gurevich
Publisher : World Scientific
Page : 212 pages
File Size : 55,5 Mb
Release : 1998-01-15
Category : Science
ISBN : 9789814497060

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High Speed Diode Lasers by Sergei A Gurevich Pdf

This book is composed of seven invited papers which present the current status of high speed diode lasers. Fast carrier and photon dynamics in directly modulated MQW lasers is analyzed and novel design approaches are considered which were critical for the demonstration and record of 40 GHz modulation bandwidth. Attention is centered on the challenges in creation of high speed and low chirp single mode DFB lasers. Recent progress in mode-locked diode lasers is covered, specifically by the examples of 160 fs pulse generation and appearance of microwave pulse repetition rates. Future trends in increasing of high speed laser performance are also examined.

Author : Mark J. W. Rodwell
Publisher : World Scientific
Page : 372 pages
File Size : 42,5 Mb
Release : 2001
Category : Technology & Engineering
ISBN : 9789810246389

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High-speed Integrated Circuit Technology by Mark J. W. Rodwell Pdf

This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.

Author : Keh-Chung Wang
Publisher : World Scientific
Page : 376 pages
File Size : 45,6 Mb
Release : 1999
Category : Technology & Engineering
ISBN : 9810235364

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High-speed Circuits for Lightwave Communications by Keh-Chung Wang Pdf

High speed circuits are crucial for increasing the bandwidth of transmission and switching of voice/video/data over optical fiber networks. The ever-increasing demand for bit rates higher than those available due to the explosion of Internet traffic has driven engineers to develop integrated circuits of performance approaching 100 Gb/s. Commercial lightwave products using high speed circuits of 10 Gb/s and beyond are readily available.High Speed Circuits for Lightwave Communications presents the latest information on circuit design, measured results, applications, and product development. It covers electronic and opto-electronic circuits for transmission, receiving, and cross-point switching. These circuits were implemented with various state-of-the-art IC technologies, including Si BJT, GaAs MESFET, HEMT, HBT, as well as InP HEMT and HBT. The book, written by more than 50 experts, will benefit graduate students, researchers, and engineers who are interested in or work in this exciting and challenging field of optical communications.

Author : Keh-Chung Wang
Publisher : World Scientific
Page : 372 pages
File Size : 46,7 Mb
Release : 1999-01-25
Category : Technology & Engineering
ISBN : 9789814495899

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High-Speed Circuits for Lightwave Communications by Keh-Chung Wang Pdf

High speed circuits are crucial for increasing the bandwidth of transmission and switching of voice/video/data over optical fiber networks. The ever-increasing demand for bit rates higher than those available due to the explosion of Internet traffic has driven engineers to develop integrated circuits of performance approaching 100 Gb/s. Commercial lightwave products using high speed circuits of 10 Gb/s and beyond are readily available. High Speed Circuits for Lightwave Communications presents the latest information on circuit design, measured results, applications, and product development. It covers electronic and opto-electronic circuits for transmission, receiving, and cross-point switching. These circuits were implemented with various state-of-the-art IC technologies, including Si BJT, GaAs MESFET, HEMT, HBT, as well as InP HEMT and HBT. The book, written by more than 50 experts, will benefit graduate students, researchers, and engineers who are interested in or work in this exciting and challenging field of optical communications. Contents:High Speed Circuits for Lightwave Communications (K Pedrotti)Si and SiGe Bipolar ICs for 10 to 40 Gb/s Optical-Fiber TDM Links (H-M Rein)Low Transimpedance-Fluctuation Design for 10-GHz Si-Bipolar Preamplifier in 10 Gb/s Optical Transmission Systems (T Masuda et al.)20–40-Gbit/s-Class GaAs MESFET Digital ICs for Future Optical Fiber Communications Systems (T Otsuji et al.)20–40 Gbit/s GaAs-HEMT Chip Set for Optical Data Receiver (Z Lao et al.)AlGaAs/GaAs HBT Circuits for Optical TDM Communications (K Runge et al.)High Speed Cross-Point Switches (C E Chang et al.)HBT ICs for OC-192 Equipment (J Sitch & R Surridge)Present Status and Future Prospects of High-Speed Lightwave IC's Based on InP (E Sano et al.)InP HBT ICs for 40 Gb/s Optical Links (M Mokhtari et al.)A Review of Recent Progress in InP-Based Optoelectronic Integrated Circuit Receiver Front-Ends (R H Walden)Ultrahigh fmax AlInAs/GaInAs Transferred-Substrate Heterojunction Bipolar Transistors for Integrated Circuits Applications (B Agarwal et al.) Readership: Researchers in the field of semiconductors and high speed transmission over optic fibres. Keywords:IC;Circuit;Optical-Fiber Communications;Lightwave Communications;10Gb;40Gb;OEIC;Transceiver;Crosspoint Switch;GaAs;InP

Author : Yervant Zorian
Publisher : Springer Science & Business Media
Page : 161 pages
File Size : 52,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461561071

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Multi-Chip Module Test Strategies by Yervant Zorian Pdf

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Author : Anonim
Publisher : Newnes
Page : 5485 pages
File Size : 45,7 Mb
Release : 2014-04-07
Category : Technology & Engineering
ISBN : 9780080965338

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Comprehensive Materials Processing by Anonim Pdf

Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources

Author : Mysore Sriram,Sung-Mo (Steve) Kang
Publisher : Springer Science & Business Media
Page : 205 pages
File Size : 42,9 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461526827

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Physical Design for Multichip Modules by Mysore Sriram,Sung-Mo (Steve) Kang Pdf

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Author : Anonim
Publisher : Unknown
Page : 836 pages
File Size : 41,5 Mb
Release : 1994
Category : Aeronautics
ISBN : UIUC:30112067190055

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Scientific and Technical Aerospace Reports by Anonim Pdf

Author : Naveed A. Sherwani,Qiong Yu,Sandeep Badida
Publisher : Wiley-Interscience
Page : 352 pages
File Size : 47,7 Mb
Release : 1995-11-23
Category : Computers
ISBN : UOM:39015038441898

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Introduction to Multichip Modules by Naveed A. Sherwani,Qiong Yu,Sandeep Badida Pdf

Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.