Physical Design For Multichip Modules

Author : Mysore Sriram,Sung-Mo (Steve) Kang
Publisher : Springer Science & Business Media
Page : 205 pages
File Size : 48,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461526827

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Physical Design for Multichip Modules by Mysore Sriram,Sung-Mo (Steve) Kang Pdf

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Author : Bernhard M. Riess
Publisher : Unknown
Page : 127 pages
File Size : 43,7 Mb
Release : 1997
Category : Electronic packaging
ISBN : 3826521854

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Physical Design for Multichip Modules by Bernhard M. Riess Pdf

Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 51,5 Mb
Release : 2024-05-20
Category : Electronic
ISBN : 9789814500265

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High Performance Design Automation for Multi-Chip Modules and Packages by Anonim Pdf

Author : Peter A. Sandborn,Hector Moreno
Publisher : Springer Science & Business Media
Page : 270 pages
File Size : 48,8 Mb
Release : 2013-03-14
Category : Technology & Engineering
ISBN : 9781475748413

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Conceptual Design of Multichip Modules and Systems by Peter A. Sandborn,Hector Moreno Pdf

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Author : Jun-Dong Cho,Paul D. Franzon
Publisher : World Scientific
Page : 272 pages
File Size : 44,9 Mb
Release : 1996
Category : Technology & Engineering
ISBN : 9810223072

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High Performance Design Automation for Multi-chip Modules and Packages by Jun-Dong Cho,Paul D. Franzon Pdf

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 50,9 Mb
Release : 2024-05-20
Category : Electronic
ISBN : 9789814505727

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Multichip Modules by Anonim Pdf

Author : Naveed A. Sherwani
Publisher : Springer Science & Business Media
Page : 572 pages
File Size : 41,7 Mb
Release : 2007-05-08
Category : Computers
ISBN : 9780306475092

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Algorithms for VLSI Physical Design Automation by Naveed A. Sherwani Pdf

Algorithms for VLSI Physical Design Automation, Third Edition covers all aspects of physical design. The book is a core reference for graduate students and CAD professionals. For students, concepts and algorithms are presented in an intuitive manner. For CAD professionals, the material presents a balance of theory and practice. An extensive bibliography is provided which is useful for finding advanced material on a topic. At the end of each chapter, exercises are provided, which range in complexity from simple to research level. Algorithms for VLSI Physical Design Automation, Third Edition provides a comprehensive background in the principles and algorithms of VLSI physical design. The goal of this book is to serve as a basis for the development of introductory-level graduate courses in VLSI physical design automation. It provides self-contained material for teaching and learning algorithms of physical design. All algorithms which are considered basic have been included, and are presented in an intuitive manner. Yet, at the same time, enough detail is provided so that readers can actually implement the algorithms given in the text and use them. The first three chapters provide the background material, while the focus of each chapter of the rest of the book is on each phase of the physical design cycle. In addition, newer topics such as physical design automation of FPGAs and MCMs have been included. The basic purpose of the third edition is to investigate the new challenges presented by interconnect and process innovations. In 1995 when the second edition of this book was prepared, a six-layer process and 15 million transistor microprocessors were in advanced stages of design. In 1998, six metal process and 20 million transistor designs are in production. Two new chapters have been added and new material has been included in almost allother chapters. A new chapter on process innovation and its impact on physical design has been added. Another focus of the third edition is to promote use of the Internet as a resource, so wherever possible URLs have been provided for further investigation. Algorithms for VLSI Physical Design Automation, Third Edition is an important core reference work for professionals as well as an advanced level textbook for students.

Author : Daryl Ann Doane,Paul Franzon
Publisher : Springer Science & Business Media
Page : 920 pages
File Size : 52,5 Mb
Release : 1992-10-31
Category : Computers
ISBN : 0442012365

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Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane,Paul Franzon Pdf

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Author : Sadiq M. Sait,Habib Youssef
Publisher : World Scientific
Page : 506 pages
File Size : 42,8 Mb
Release : 1999
Category : Technology & Engineering
ISBN : 9810238835

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VLSI Physical Design Automation by Sadiq M. Sait,Habib Youssef Pdf

&Quot;VLSI Physical Design Automation: Theory and Practice is an essential introduction for senior undergraduates, postgraduates and anyone starting work in the field of CAD for VLSI. It covers all aspects of physical design, together with such related areas as automatic cell generation, silicon compilation, layout editors and compaction. A problem-solving approach is adopted and each solution is illustrated with examples. Each topic is treated in a standard format: Problem Definition, Cost Functions and Constraints, Possible Approaches and Latest Developments."--BOOK JACKET.

Author : Naveed A. Sherwani,Qiong Yu,Sandeep Badida
Publisher : Wiley-Interscience
Page : 352 pages
File Size : 55,6 Mb
Release : 1995-11-23
Category : Computers
ISBN : UOM:39015038441898

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Introduction to Multichip Modules by Naveed A. Sherwani,Qiong Yu,Sandeep Badida Pdf

Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 44,6 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461560371

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : Anonim
Publisher : Unknown
Page : 676 pages
File Size : 47,6 Mb
Release : 1994
Category : Electronic packaging
ISBN : UCSD:31822016891624

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Multichip Modules by Anonim Pdf

Author : Michael Niedermayer
Publisher : Artech House
Page : 243 pages
File Size : 43,7 Mb
Release : 2011-12
Category : Technology & Engineering
ISBN : 9781608070855

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Cost-driven Design of Smart Microsystems by Michael Niedermayer Pdf

Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.

Author : Ernest S. Kuh
Publisher : World Scientific
Page : 172 pages
File Size : 44,6 Mb
Release : 1992
Category : Technology & Engineering
ISBN : 9810209258

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Multichip Modules by Ernest S. Kuh Pdf

Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.

Author : Yervant Zorian
Publisher : Springer Science & Business Media
Page : 161 pages
File Size : 42,5 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461561071

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Multi-Chip Module Test Strategies by Yervant Zorian Pdf

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).