Interconnect Technologies For Integrated Circuits And Flexible Electronics

Author : Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam
Publisher : Springer Nature
Page : 286 pages
File Size : 45,9 Mb
Release : 2023-10-17
Category : Technology & Engineering
ISBN : 9789819944767

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Interconnect Technologies for Integrated Circuits and Flexible Electronics by Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Pdf

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Author : Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam
Publisher : Springer
Page : 0 pages
File Size : 41,5 Mb
Release : 2023-10-07
Category : Technology & Engineering
ISBN : 9819944759

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Interconnect Technologies for Integrated Circuits and Flexible Electronics by Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Pdf

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Author : Jeffrey A. Davis,James D. Meindl
Publisher : Springer Science & Business Media
Page : 417 pages
File Size : 44,6 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461504610

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Interconnect Technology and Design for Gigascale Integration by Jeffrey A. Davis,James D. Meindl Pdf

This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Page : 551 pages
File Size : 44,6 Mb
Release : 2008-11-30
Category : Technology & Engineering
ISBN : 9781596932470

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Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Author : Gerald L. Ginsberg
Publisher : Springer Science & Business Media
Page : 285 pages
File Size : 44,7 Mb
Release : 2013-11-27
Category : Science
ISBN : 9781461535423

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Electronic Equipment Packaging Technology by Gerald L. Ginsberg Pdf

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Author : Joachim Burghartz
Publisher : Springer Science & Business Media
Page : 467 pages
File Size : 42,7 Mb
Release : 2010-11-18
Category : Technology & Engineering
ISBN : 9781441972767

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Ultra-thin Chip Technology and Applications by Joachim Burghartz Pdf

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Author : Yue Kuo
Publisher : The Electrochemical Society
Page : 350 pages
File Size : 42,6 Mb
Release : 2009-07
Category : Science
ISBN : 9781566777353

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2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors by Yue Kuo Pdf

This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.

Author : YongAn Huang,YeWang Su,Shan Jiang
Publisher : Springer Nature
Page : 423 pages
File Size : 55,5 Mb
Release : 2023-01-01
Category : Science
ISBN : 9789811966231

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Flexible Electronics by YongAn Huang,YeWang Su,Shan Jiang Pdf

Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design like liquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.

Author : Hartmut Grabinski
Publisher : Springer Science & Business Media
Page : 234 pages
File Size : 50,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461543497

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Interconnects in VLSI Design by Hartmut Grabinski Pdf

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Author : Deepalekshmi Ponnamma,Kishor Kumar Sadasivuni,Chaoying Wan,Sabu Thomas,Mariam Al-Ali AlMa'adeed
Publisher : Springer
Page : 390 pages
File Size : 54,5 Mb
Release : 2015-10-16
Category : Technology & Engineering
ISBN : 9783319236636

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Flexible and Stretchable Electronic Composites by Deepalekshmi Ponnamma,Kishor Kumar Sadasivuni,Chaoying Wan,Sabu Thomas,Mariam Al-Ali AlMa'adeed Pdf

This book is the first comprehensive collection of electronic aspects of different kinds of elastomer composites, including combinations of synthetic, natural and thermoplastic elastomers with different conducting fillers like metal nanoparticles, carbon nanotubes, or graphenes, and many more. It covers elastomer composites, which are useful in electronic applications, including chemical and physical as well as material science aspects. The presented elastomer composites have great potential for solving emerging new material application requirements, for example as flexible and wearable electronics. The book is structured and organized by the rubber/elastomer type: each chapter describes a different elastomer matrix and its composites. While introducing to important fundamentals, it is application-oriented, discussing the current issues and challenges in the field of elastomer composites. This book will thus appeal to researchers and scientists, to engineers and technologists, but also to graduate students, working on elastomer composites, or on electronics engineering with the composites, providing the readers with a sound introduction to the field and solutions to both fundamental and applied problems.

Author : Avram Bar-Cohen,Jeffrey C. Suhling,Andrew A. O. Tay
Publisher : World Scientific
Page : 1079 pages
File Size : 53,5 Mb
Release : 2019
Category : Packaging
ISBN : 9789811209635

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Encyclopedia of Packaging Materials, Processes, and Mechanics by Avram Bar-Cohen,Jeffrey C. Suhling,Andrew A. O. Tay Pdf

"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Author : John R. Susko,Randy W. Snyder,Robin A. Susko
Publisher : Unknown
Page : 228 pages
File Size : 50,9 Mb
Release : 1988
Category : Electrochemistry
ISBN : STANFORD:36105030501303

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Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications by John R. Susko,Randy W. Snyder,Robin A. Susko Pdf

Author : Tünde Kirstein
Publisher : Elsevier
Page : 540 pages
File Size : 44,5 Mb
Release : 2013-04-04
Category : Technology & Engineering
ISBN : 9780857093530

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Multidisciplinary Know-How for Smart-Textiles Developers by Tünde Kirstein Pdf

Smart-textiles developers draw on diverse fields of knowledge to produce unique materials with enhanced properties and vast potential. Several disciplines outside the traditional textile area are involved in the construction of these smart textiles, and each individual field has its own language, specific terms and approaches. Multidisciplinary know-how for smart-textiles developers provides a filtered knowledge of these areas of expertise, explaining key expressions and demonstrating their relevance to the smart-textiles field. Following an introduction to the new enabling technologies, commercialisation and market trends that make up the future of smart-textiles development, part one reviews materials employed in the production of smart textiles. Types and processing of electro-conductive and semiconducting materials, optical fibres for smart photonic textiles, conductive nanofibres and nanocoatings, polymer-based resistive sensors, and soft capacitance fibres for touch-sensitive smart textiles are all discussed. Part two then investigates such technologies as the embedding of electronic functions, the integration of thin-film electronics, and the development of organic and large-area electronic (OLAE) technologies for smart textiles. Joining technologies are also discussed, alongside kinetic, thermoelectric and solar energy harvesting technologies, and signal processing technologies for activity-aware smart textiles. Finally, product development and applications are the focus of part three, which investigates strategies for technology management, innovation and improved sustainability, before the book concludes by exploring medical, automotive and architectural applications of smart textiles. With its distinguished editor and international team of expert contributors, Multidisciplinary know-how for smart-textiles developers is a key tool for readers working in industries including design, fashion, textiles, through to electronics, computing and material science. It also provides a useful guide to the subject for academics working across a wide range of fields. Reviews materials used in the production of smart textiles Examines the technologies used in smart textiles, such as optical fibres and polymer based resistive sensors Investigates strategies for technology management, innovation and improved development

Author : Young Suh Song
Publisher : Springer Nature
Page : 930 pages
File Size : 47,5 Mb
Release : 2024-06-15
Category : Electronic
ISBN : 9789819966493

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Handbook of Emerging Materials for Semiconductor Industry by Young Suh Song Pdf

Author : United States. National Aeronautics and Space Administration
Publisher : Unknown
Page : 792 pages
File Size : 47,8 Mb
Release : 2024-06-15
Category : Electronic
ISBN : STANFORD:36105112109157

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Research and Technology Program Digest by United States. National Aeronautics and Space Administration Pdf