Integrated Interconnect Technologies For 3d Nanoelectronic Systems

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Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Muhannad S. Bakir,James D. Meindl
Integrated Interconnect Technologies for 3D Nanoelectronic Systems Book PDF

Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Page : 551 pages
File Size : 46,6 Mb
Release : 2008-11-30
Category : Technology & Engineering
ISBN : 9781596932470

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Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir,James D. Meindl Pdf

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

3D Integration for VLSI Systems

Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
3D Integration for VLSI Systems Book PDF

Author : Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Publisher : CRC Press
Page : 376 pages
File Size : 49,6 Mb
Release : 2016-04-19
Category : Science
ISBN : 9789814303828

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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester Pdf

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Handbook of 3D Integration, Volume 4

Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Handbook of 3D Integration Volume 4 Book PDF

Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
Page : 265 pages
File Size : 54,7 Mb
Release : 2019-01-25
Category : Technology & Engineering
ISBN : 9783527697045

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Handbook of 3D Integration, Volume 4 by Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir Pdf

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Physical Design for 3D Integrated Circuits

Aida Todri-Sanial,Chuan Seng Tan
Physical Design for 3D Integrated Circuits Book PDF

Author : Aida Todri-Sanial,Chuan Seng Tan
Publisher : CRC Press
Page : 397 pages
File Size : 52,6 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781498710374

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Physical Design for 3D Integrated Circuits by Aida Todri-Sanial,Chuan Seng Tan Pdf

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

3D Integration for NoC-based SoC Architectures

Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
3D Integration for NoC based SoC Architectures Book PDF

Author : Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
Publisher : Springer Science & Business Media
Page : 280 pages
File Size : 50,9 Mb
Release : 2010-11-08
Category : Technology & Engineering
ISBN : 9781441976185

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3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch Pdf

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Wireless Interface Technologies for 3D IC and Module Integration

Tadahiro Kuroda,Wai-Yeung Yip
Wireless Interface Technologies for 3D IC and Module Integration Book PDF

Author : Tadahiro Kuroda,Wai-Yeung Yip
Publisher : Cambridge University Press
Page : 337 pages
File Size : 40,7 Mb
Release : 2021-09-30
Category : Technology & Engineering
ISBN : 9781108841214

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Wireless Interface Technologies for 3D IC and Module Integration by Tadahiro Kuroda,Wai-Yeung Yip Pdf

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Novel Advances in Microsystems Technologies and Their Applications

Laurent A. Francis,Krzysztof Iniewski
Novel Advances in Microsystems Technologies and Their Applications Book PDF

Author : Laurent A. Francis,Krzysztof Iniewski
Publisher : CRC Press
Page : 621 pages
File Size : 43,8 Mb
Release : 2017-07-28
Category : Technology & Engineering
ISBN : 9781466560673

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Novel Advances in Microsystems Technologies and Their Applications by Laurent A. Francis,Krzysztof Iniewski Pdf

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.

Thermal and Electro-thermal System Simulation 2020

Márta Rencz,Lorenzo Codecasa,Andras Poppe
Thermal and Electro thermal System Simulation 2020 Book PDF

Author : Márta Rencz,Lorenzo Codecasa,Andras Poppe
Publisher : MDPI
Page : 310 pages
File Size : 42,8 Mb
Release : 2021-01-12
Category : Technology & Engineering
ISBN : 9783039438310

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Thermal and Electro-thermal System Simulation 2020 by Márta Rencz,Lorenzo Codecasa,Andras Poppe Pdf

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Three Dimensional System Integration

Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
Three Dimensional System Integration Book PDF

Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
Publisher : Springer Science & Business Media
Page : 246 pages
File Size : 55,9 Mb
Release : 2010-12-07
Category : Architecture
ISBN : 9781441909626

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Three Dimensional System Integration by Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic Pdf

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

VLSI-SoC: Design Trends

Andrea Calimera,Pierre-Emmanuel Gaillardon,Kunal Korgaonkar,Shahar Kvatinsky,Ricardo Reis
VLSI SoC Design Trends Book PDF

Author : Andrea Calimera,Pierre-Emmanuel Gaillardon,Kunal Korgaonkar,Shahar Kvatinsky,Ricardo Reis
Publisher : Springer Nature
Page : 372 pages
File Size : 52,9 Mb
Release : 2021-07-14
Category : Computers
ISBN : 9783030816414

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VLSI-SoC: Design Trends by Andrea Calimera,Pierre-Emmanuel Gaillardon,Kunal Korgaonkar,Shahar Kvatinsky,Ricardo Reis Pdf

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.* The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.

3D Microelectronic Packaging

Yan Li,Deepak Goyal
3D Microelectronic Packaging Book PDF

Author : Yan Li,Deepak Goyal
Publisher : Springer
Page : 463 pages
File Size : 41,8 Mb
Release : 2017-01-20
Category : Technology & Engineering
ISBN : 9783319445861

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3D Microelectronic Packaging by Yan Li,Deepak Goyal Pdf

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Materials for Advanced Packaging

Daniel Lu,C.P. Wong
Materials for Advanced Packaging Book PDF

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 54,5 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

MEMS

Vikas Choudhary,Krzysztof Iniewski
MEMS Book PDF

Author : Vikas Choudhary,Krzysztof Iniewski
Publisher : CRC Press
Page : 478 pages
File Size : 50,9 Mb
Release : 2017-12-19
Category : Medical
ISBN : 9781466515826

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MEMS by Vikas Choudhary,Krzysztof Iniewski Pdf

The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.

Advanced Interconnects for ULSI Technology

Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Advanced Interconnects for ULSI Technology Book PDF

Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 52,8 Mb
Release : 2012-04-02
Category : Technology & Engineering
ISBN : 9780470662540

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Advanced Interconnects for ULSI Technology by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech Pdf

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Beth Keser,Steffen Kröhnert
Advances in Embedded and Fan Out Wafer Level Packaging Technologies Book PDF

Author : Beth Keser,Steffen Kröhnert
Publisher : John Wiley & Sons
Page : 576 pages
File Size : 46,8 Mb
Release : 2019-02-20
Category : Technology & Engineering
ISBN : 9781119313977

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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by Beth Keser,Steffen Kröhnert Pdf

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.