Low Cost Flip Chip Technologies

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
Page : 616 pages
File Size : 51,6 Mb
Release : 2000
Category : Technology & Engineering
ISBN : UOM:39015048856325

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Low Cost Flip Chip Technologies by John H. Lau Pdf

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
Page : 600 pages
File Size : 45,5 Mb
Release : 1996
Category : Technology & Engineering
ISBN : UOM:39015037863928

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Flip Chip Technologies by John H. Lau Pdf

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Author : John H. Lau
Publisher : Springer Nature
Page : 515 pages
File Size : 55,7 Mb
Release : 2024-06-26
Category : Electronic
ISBN : 9789819721405

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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau Pdf

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 616 pages
File Size : 41,7 Mb
Release : 2000
Category : Business & Economics
ISBN : 0071351418

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Low Cost Flip Chip Technologies by John H. Lau Pdf

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.

Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Page : 1044 pages
File Size : 54,9 Mb
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 9780203021484

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz,Kathleen A. Stalter Pdf

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Author : Daryl Ann Doane,Paul Franzon
Publisher : Springer Science & Business Media
Page : 895 pages
File Size : 50,8 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461531005

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Multichip Module Technologies and Alternatives: The Basics by Daryl Ann Doane,Paul Franzon Pdf

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Author : Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Publisher : Springer Science & Business Media
Page : 562 pages
File Size : 53,8 Mb
Release : 2013-03-20
Category : Technology & Engineering
ISBN : 9781441957689

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong Pdf

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Author : John H. Lau
Publisher : Springer Nature
Page : 513 pages
File Size : 44,7 Mb
Release : 2021-05-17
Category : Technology & Engineering
ISBN : 9789811613760

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Semiconductor Advanced Packaging by John H. Lau Pdf

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author : Yi (Grace) Li,Daniel Lu,C.P. Wong
Publisher : Springer Science & Business Media
Page : 445 pages
File Size : 54,8 Mb
Release : 2009-10-08
Category : Technology & Engineering
ISBN : 9780387887838

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Electrical Conductive Adhesives with Nanotechnologies by Yi (Grace) Li,Daniel Lu,C.P. Wong Pdf

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Author : John H. Lau
Publisher : Springer Nature
Page : 542 pages
File Size : 55,7 Mb
Release : 2023-03-27
Category : Technology & Engineering
ISBN : 9789811999178

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Chiplet Design and Heterogeneous Integration Packaging by John H. Lau Pdf

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author : Herman F. Mark
Publisher : John Wiley & Sons
Page : 1490 pages
File Size : 49,9 Mb
Release : 2013-10-16
Category : Science
ISBN : 9780470073698

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Encyclopedia of Polymer Science and Technology, Concise by Herman F. Mark Pdf

The compact, affordable reference, revised and updated The Encyclopedia of Polymer Science and Technology, Concise Third Edition provides the key information from the complete, twelve-volume Mark's Encyclopedia in an affordable, condensed format. Completely revised and updated, this user-friendly desk reference offers quick access to all areas of polymer science, including important advances in nanotechnology, imaging and analytical techniques, controlled polymer architecture, biomimetics, and more, all in one volume. Like the twelve-volume full edition, the Encyclopedia of Polymer Science and Technology, Concise Third Edition provides both SI and common units, carefully selected key references for each article, and hundreds of tables, charts, figures, and graphs.

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 640 pages
File Size : 40,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351835541

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author : Junmo Kim
Publisher : AuthorHouse
Page : 86 pages
File Size : 42,7 Mb
Release : 2018-06-07
Category : Business & Economics
ISBN : 9781546245766

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Technology Development and Marketing by Junmo Kim Pdf

Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.

Author : Karl J. Puttlitz,Paul A. Totta
Publisher : Springer Science & Business Media
Page : 1250 pages
File Size : 46,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461513896

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Area Array Interconnection Handbook by Karl J. Puttlitz,Paul A. Totta Pdf

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Author : Daniel Lu,C.P. Wong
Publisher : Springer
Page : 969 pages
File Size : 46,9 Mb
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 9783319450988

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Materials for Advanced Packaging by Daniel Lu,C.P. Wong Pdf

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.