Mems Reliability

Author : Osamu Tabata,Toshiyuki Tsuchiya
Publisher : John Wiley & Sons
Page : 328 pages
File Size : 48,8 Mb
Release : 2008-02-04
Category : Technology & Engineering
ISBN : 3527314946

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Reliability of MEMS by Osamu Tabata,Toshiyuki Tsuchiya Pdf

This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

Author : Allyson L. Hartzell,Mark G. da Silva,Herbert R. Shea
Publisher : Springer Science & Business Media
Page : 300 pages
File Size : 52,7 Mb
Release : 2010-11-02
Category : Technology & Engineering
ISBN : 9781441960184

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MEMS Reliability by Allyson L. Hartzell,Mark G. da Silva,Herbert R. Shea Pdf

The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Author : J. Sebastian Perera
Publisher : Unknown
Page : 82 pages
File Size : 46,6 Mb
Release : 2000
Category : Microelectromechanical systems
ISBN : NASA:31769000451388

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Reliability Modeling of Microelectromechanical Systems Using Neural Networks by J. Sebastian Perera Pdf

Author : Tarek Sobh,Khaled Elleithy,Ausif Mahmood,Mohammad A. Karim
Publisher : Springer Science & Business Media
Page : 597 pages
File Size : 53,6 Mb
Release : 2008-08-15
Category : Technology & Engineering
ISBN : 9781402087370

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Novel Algorithms and Techniques in Telecommunications, Automation and Industrial Electronics by Tarek Sobh,Khaled Elleithy,Ausif Mahmood,Mohammad A. Karim Pdf

Novel Algorithms and Techniques in Telecommunications, Automation and Industrial Electronics includes a set of rigorously reviewed world-class manuscripts addressing and detailing state-of-the-art research projects in the areas of Industrial Electronics, Technology and Automation, Telecommunications and Networking. Novel Algorithms and Techniques in Telecommunications, Automation and Industrial Electronics includes selected papers form the conference proceedings of the International Conference on Industrial Electronics, Technology and Automation (IETA 2007) and International Conference on Telecommunications and Networking (TeNe 07) which were part of the International Joint Conferences on Computer, Information and Systems Sciences and Engineering (CISSE 2007).

Author : Leo Kounis
Publisher : BoD – Books on Demand
Page : 206 pages
File Size : 54,8 Mb
Release : 2020-07-01
Category : Technology & Engineering
ISBN : 9781789239515

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Reliability and Maintenance by Leo Kounis Pdf

Amid a plethora of challenges, technological advances in science and engineering are inadvertently affecting an increased spectrum of today’s modern life. Yet for all supplied products and services provided, robustness of processes, methods, and techniques is regarded as a major player in promoting safety. This book on systems reliability, which equally includes maintenance-related policies, presents fundamental reliability concepts that are applied in a number of industrial cases. Furthermore, to alleviate potential cost and time-specific bottlenecks, software engineering and systems engineering incorporate approximation models, also referred to as meta-processes, or surrogate models to reproduce a predefined set of problems aimed at enhancing safety, while minimizing detrimental outcomes to society and the environment.

Author : Robert Osiander,M. Ann Garrison Darrin,John L. Champion
Publisher : CRC Press
Page : 400 pages
File Size : 47,5 Mb
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 9781420027747

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MEMS and Microstructures in Aerospace Applications by Robert Osiander,M. Ann Garrison Darrin,John L. Champion Pdf

The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.

Author : Markku Tilli,Mervi Paulasto-Krockel,Teruaki Motooka,Veikko Lindroos
Publisher : William Andrew
Page : 826 pages
File Size : 41,7 Mb
Release : 2015-09-02
Category : Technology & Engineering
ISBN : 9780323312233

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Handbook of Silicon Based MEMS Materials and Technologies by Markku Tilli,Mervi Paulasto-Krockel,Teruaki Motooka,Veikko Lindroos Pdf

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory

Author : Dan Zhang,Bin Wei
Publisher : Springer
Page : 718 pages
File Size : 41,6 Mb
Release : 2016-10-18
Category : Technology & Engineering
ISBN : 9783319321806

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Advanced Mechatronics and MEMS Devices II by Dan Zhang,Bin Wei Pdf

This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intelligent manufacturing.

Author : Russell A. Lawton
Publisher : SPIE-International Society for Optical Engineering
Page : 162 pages
File Size : 53,5 Mb
Release : 2000
Category : Technology & Engineering
ISBN : UOM:39015050329922

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MEMS Reliability for Critical Applications by Russell A. Lawton Pdf

Author : Stepan Lucyszyn
Publisher : Cambridge University Press
Page : 441 pages
File Size : 42,8 Mb
Release : 2010-08-19
Category : Technology & Engineering
ISBN : 9781139491662

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Advanced RF MEMS by Stepan Lucyszyn Pdf

An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation

Author : P. Rai-Choudhury
Publisher : SPIE Press
Page : 544 pages
File Size : 40,8 Mb
Release : 2000
Category : Technology & Engineering
ISBN : 0819437166

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MEMS and MOEMS Technology and Applications by P. Rai-Choudhury Pdf

The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.

Author : William Robert Ashurst
Publisher : Unknown
Page : 462 pages
File Size : 42,9 Mb
Release : 2003
Category : Electronic
ISBN : UCAL:C3486160

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Surface Engineering for MEMS Reliability by William Robert Ashurst Pdf

Author : Lee Yung-cheng,Cheng Yu-ting,Ramadoss Ramesh
Publisher : World Scientific
Page : 364 pages
File Size : 53,7 Mb
Release : 2018-01-03
Category : Technology & Engineering
ISBN : 9789813229372

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Mems Packaging by Lee Yung-cheng,Cheng Yu-ting,Ramadoss Ramesh Pdf

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics

Author : Atul Tiwari,Baldev Raj
Publisher : John Wiley & Sons
Page : 432 pages
File Size : 54,6 Mb
Release : 2015-09-11
Category : Technology & Engineering
ISBN : 9781119083863

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Materials and Failures in MEMS and NEMS by Atul Tiwari,Baldev Raj Pdf

The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.

Author : Russell A. Lawton
Publisher : SPIE-International Society for Optical Engineering
Page : 190 pages
File Size : 51,8 Mb
Release : 1999
Category : Technology & Engineering
ISBN : UOM:39015043411860

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MEMS Reliability for Critical and Space Applications by Russell A. Lawton Pdf

A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.