Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging Book PDF

Author : Xing-Chang Wei
Publisher : CRC Press
Page : 322 pages
File Size : 45,7 Mb
Release : 2017-09-19
Category : Computers
ISBN : 9781315305868

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei Pdf

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging Book PDF

Author : Xing-Chang Wei
Publisher : CRC Press
Page : 266 pages
File Size : 44,7 Mb
Release : 2017-09-19
Category : Computers
ISBN : 9781315305851

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei Pdf

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Power Distribution Networks with On-Chip Decoupling Capacitors

Mikhail Popovich,Andrey Mezhiba,Eby G. Friedman
Power Distribution Networks with On Chip Decoupling Capacitors Book PDF

Author : Mikhail Popovich,Andrey Mezhiba,Eby G. Friedman
Publisher : Springer Science & Business Media
Page : 516 pages
File Size : 52,9 Mb
Release : 2007-10-08
Category : Technology & Engineering
ISBN : 9780387716015

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Power Distribution Networks with On-Chip Decoupling Capacitors by Mikhail Popovich,Andrey Mezhiba,Eby G. Friedman Pdf

This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.

Power Distribution Networks with On-Chip Decoupling Capacitors

Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman
Power Distribution Networks with On Chip Decoupling Capacitors Book PDF

Author : Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman
Publisher : Springer Science & Business Media
Page : 644 pages
File Size : 49,7 Mb
Release : 2010-11-23
Category : Technology & Engineering
ISBN : 9781441978714

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Power Distribution Networks with On-Chip Decoupling Capacitors by Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman Pdf

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Signal Integrity and Radiated Emission of High-Speed Digital Systems

Spartaco Caniggia,Francescaromana Maradei
Signal Integrity and Radiated Emission of High Speed Digital Systems Book PDF

Author : Spartaco Caniggia,Francescaromana Maradei
Publisher : John Wiley & Sons
Page : 552 pages
File Size : 44,6 Mb
Release : 2008-11-20
Category : Science
ISBN : 9780470772881

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Signal Integrity and Radiated Emission of High-Speed Digital Systems by Spartaco Caniggia,Francescaromana Maradei Pdf

Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.

On-Chip Power Delivery and Management

Inna P. Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman
On Chip Power Delivery and Management Book PDF

Author : Inna P. Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman
Publisher : Springer
Page : 742 pages
File Size : 55,7 Mb
Release : 2016-04-26
Category : Technology & Engineering
ISBN : 9783319293950

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On-Chip Power Delivery and Management by Inna P. Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman Pdf

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

EMC and the Printed Circuit Board

Mark I. Montrose
EMC and the Printed Circuit Board Book PDF

Author : Mark I. Montrose
Publisher : John Wiley & Sons
Page : 344 pages
File Size : 55,8 Mb
Release : 2004-04-05
Category : Science
ISBN : 9780471660903

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EMC and the Printed Circuit Board by Mark I. Montrose Pdf

This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination

High-Speed Circuit Board Signal Integrity, Second Edition

Stephen C. Thierauf
High Speed Circuit Board Signal Integrity Second Edition Book PDF

Author : Stephen C. Thierauf
Publisher : Artech House
Page : 320 pages
File Size : 43,8 Mb
Release : 2017-04-30
Category : Technology & Engineering
ISBN : 9781630814441

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High-Speed Circuit Board Signal Integrity, Second Edition by Stephen C. Thierauf Pdf

This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Power Integrity Modeling and Design for Semiconductors and Systems

Madhavan Swaminathan,Ege Engin
Power Integrity Modeling and Design for Semiconductors and Systems Book PDF

Author : Madhavan Swaminathan,Ege Engin
Publisher : Pearson Education
Page : 597 pages
File Size : 49,5 Mb
Release : 2007-11-19
Category : Technology & Engineering
ISBN : 9780132797177

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Power Integrity Modeling and Design for Semiconductors and Systems by Madhavan Swaminathan,Ege Engin Pdf

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Grounds for Grounding

Elya B. Joffe,Kai-Sang Lock
Grounds for Grounding Book PDF

Author : Elya B. Joffe,Kai-Sang Lock
Publisher : John Wiley & Sons
Page : 1220 pages
File Size : 55,9 Mb
Release : 2023-01-25
Category : Technology & Engineering
ISBN : 9781119770930

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Grounds for Grounding by Elya B. Joffe,Kai-Sang Lock Pdf

GROUNDS FOR GROUNDING Gain a comprehensive understanding of all aspects of grounding theory and application in this new, expanded edition Grounding design and installation are crucial to ensure the safety and performance of any electrical or electronic system irrespective of size. Successful grounding design requires a thorough familiarity with theory combined with practical experience with real-world systems. Rarely taught in schools due to its complexity, identifying and implementing the appropriate solution to grounding problems is nevertheless a vital skill in the industrial world for any electrical engineer. In Grounds for Grounding, readers will discover a complete and thorough approach to the topic that blends theory and practice to demonstrate that a few rules apply to many applications. The book provides basic concepts of Electromagnetic Compatibility (EMC) that act as the foundation for understanding grounding theory and its applications. Each avenue of grounding is covered in its own chapter, topics from safety aspects in facilities, lightning, and NEMP to printed circuit board, cable shields, and enclosure grounding, and more. Grounds for Grounding readers will also find: Revised and updated information presented in every chapter New chapters on grounding for generators, uninterruptible power sources (UPSs) New appendices including a grounding design checklist, grounding documentation content, and grounding verification procedures Grounds for Grounding is a useful reference for engineers in circuit design, equipment, and systems, as well as power engineers, platform, and facility designers.

Electrical Modeling and Design for 3D System Integration

Er-Ping Li
Electrical Modeling and Design for 3D System Integration Book PDF

Author : Er-Ping Li
Publisher : John Wiley & Sons
Page : 394 pages
File Size : 45,9 Mb
Release : 2012-03-19
Category : Technology & Engineering
ISBN : 9781118166741

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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Pdf

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Robust Electronic Design Reference Book: no special title

John R. Barnes
Robust Electronic Design Reference Book no special title Book PDF

Author : John R. Barnes
Publisher : Springer Science & Business Media
Page : 1356 pages
File Size : 48,9 Mb
Release : 2004
Category : Technology & Engineering
ISBN : 1402077378

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Robust Electronic Design Reference Book: no special title by John R. Barnes Pdf

If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements.

High-speed Circuit Board Signal Integrity

Stephen C. Thierauf
High speed Circuit Board Signal Integrity Book PDF

Author : Stephen C. Thierauf
Publisher : Artech House
Page : 243 pages
File Size : 49,7 Mb
Release : 2004
Category : Technology & Engineering
ISBN : 9781580531313

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High-speed Circuit Board Signal Integrity by Stephen C. Thierauf Pdf

As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.

Principles and Techniques of Electromagnetic Compatibility

Christos Christopoulos
Principles and Techniques of Electromagnetic Compatibility Book PDF

Author : Christos Christopoulos
Publisher : CRC Press
Page : 485 pages
File Size : 46,7 Mb
Release : 2022-07-14
Category : Technology & Engineering
ISBN : 9781000631777

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Principles and Techniques of Electromagnetic Compatibility by Christos Christopoulos Pdf

This book provides a sound grasp of the fundamental concepts, applications, and practice of EMC. Developments in recent years have resulted in further increases in electrical component density, wider penetration of wireless technologies, and a significant increase in complexity of electrical and electronic equipment. New materials, which can be customized to meet EMC needs, have been introduced. Considerable progress has been made in developing numerical tools for complete system EMC simulation. EMC is now a central consideration in all industrial sectors. Maintaining the holistic approach of the previous edition of Principles and Techniques of Electromagnetic Compatibility, the Third Edition updates coverage of EMC to reflects recent important developments. What is new in the Third Edition? A comprehensive treatment of new materials (meta- and nano-) and their impact on EMC Numerical modelling of complex systems and complexity reduction methods Impact of wireless technologies and the Internet of Things (IoT) on EMC Testing in reverberation chambers, and in the time-domain A comprehensive treatment of the scope and development of stochastic models for EMC EMC issues encountered in automotive, railway, aerospace, and marine applications Impact of EMC and Intentional EMI (IEMI) on infrastructure, and risk assessment In addition to updating material, new references, examples, and appendices were added to offer further support to readers interested in exploring further. As in previous editions, the emphasis is on building a sound theoretical framework, and demonstrating how it can be turned to practical use in challenging applications. The expectation is that this approach will serve EMC engineers through the inevitable future technological shifts and developments.

Electrical Modeling and Design for 3D System Integration

Er-Ping Li
Electrical Modeling and Design for 3D System Integration Book PDF

Author : Er-Ping Li
Publisher : John Wiley & Sons
Page : 394 pages
File Size : 50,8 Mb
Release : 2012-04-10
Category : Technology & Engineering
ISBN : 9780470623466

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Electrical Modeling and Design for 3D System Integration by Er-Ping Li Pdf

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.