More Than Moore Devices And Integration For Semiconductors

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More-than-Moore Devices and Integration for Semiconductors

Francesca Iacopi,Francis Balestra
More than Moore Devices and Integration for Semiconductors Book PDF

Author : Francesca Iacopi,Francis Balestra
Publisher : Springer Nature
Page : 271 pages
File Size : 47,5 Mb
Release : 2023-02-17
Category : Technology & Engineering
ISBN : 9783031216107

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More-than-Moore Devices and Integration for Semiconductors by Francesca Iacopi,Francis Balestra Pdf

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

More than Moore

Guo Qi Zhang,Alfred van Roosmalen
More than Moore Book PDF

Author : Guo Qi Zhang,Alfred van Roosmalen
Publisher : Springer Science & Business Media
Page : 338 pages
File Size : 53,6 Mb
Release : 2010-01-23
Category : Technology & Engineering
ISBN : 9780387755939

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More than Moore by Guo Qi Zhang,Alfred van Roosmalen Pdf

In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Managing More-than-Moore Integration Technology Development

Riko Radojcic
Managing More than Moore Integration Technology Development Book PDF

Author : Riko Radojcic
Publisher : Unknown
Page : 128 pages
File Size : 44,6 Mb
Release : 2019
Category : Electrical engineering
ISBN : 3319927027

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Managing More-than-Moore Integration Technology Development by Riko Radojcic Pdf

This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way. Based on real, hands-on experiences and presents actual lessons learned; Describes various aspects of managing an engineering development program; Explains key technical aspects of semiconductor technology to non-experts; Written in a novelized form that makes it very easy to read; Enables an understanding of how and why the chip industry evolved over the last 50 years into what it is today.

Managing More-than-Moore Integration Technology Development

Riko Radojcic
Managing More than Moore Integration Technology Development Book PDF

Author : Riko Radojcic
Publisher : Springer
Page : 211 pages
File Size : 55,9 Mb
Release : 2018-07-20
Category : Technology & Engineering
ISBN : 9783319927015

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Managing More-than-Moore Integration Technology Development by Riko Radojcic Pdf

This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.

Lateral Power Transistors in Integrated Circuits

Tobias Erlbacher
Lateral Power Transistors in Integrated Circuits Book PDF

Author : Tobias Erlbacher
Publisher : Springer
Page : 235 pages
File Size : 46,5 Mb
Release : 2014-10-08
Category : Technology & Engineering
ISBN : 9783319005003

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Lateral Power Transistors in Integrated Circuits by Tobias Erlbacher Pdf

The book summarizes and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications. In its first part, the book motivates the necessity for lateral power transistors by a top-down approach: First, it presents typical energy conversion applications in modern industrial, automotive and consumer electronics. Next, it introduces common circuit topologies suitable for these applications, and discusses the feasibility for monolithic integration. Finally, the combination of power and logic functionality on a single chip is motivated and the requirements and limitations for the power semiconductor devices are deduced. The second part describes the evolution of lateral power transistors over the past decades from the simple pin-type concept to double-acting RESURF topologies. It describes the principle of operation for these LDMOS devices and discusses limitations of lateral power devices. Moreover, figures-of-merit are presented which can be used to evaluate the performance of the novel lateral power transistors described in this book with respect to the LDMOS devices. In the last part, [..] the fundamental physical concepts including charge compensation and trench gate topologies are discussed. Also, the status of research in LDMOS devices on silicon carbide is presented. Advantages and drawbacks for each of these integration approaches are summarized, and the feasibility with respect to power electronic applications is evaluated.

Convergence of More Moore, More than Moore and Beyond Moore

Simon Deleonibus
Convergence of More Moore More than Moore and Beyond Moore Book PDF

Author : Simon Deleonibus
Publisher : CRC Press
Page : 302 pages
File Size : 50,5 Mb
Release : 2021-02-16
Category : Science
ISBN : 9781000064599

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Convergence of More Moore, More than Moore and Beyond Moore by Simon Deleonibus Pdf

The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing. Besides data processing, data storage, new sensing modes and communication capabilities need the revision of process architecture to enable the Heterogeneous co integration of add-on devices with CMOS: the new defined functions and paradigms open the way to Augmented Nanosystems. The choices for future breakthroughs will request the study of new devices, circuits and computing architectures and to take new unexplored paths including as well new materials and integration schmes. This book reviews in two sections, including seven chapters, essential modules to build Diversified Nanosystems based on Nanoelectronics and finally how they pave the way to the definition of Nanofunctions for Augmented Nanosystems.

Advanced Flip Chip Packaging

Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Advanced Flip Chip Packaging Book PDF

Author : Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Publisher : Springer Science & Business Media
Page : 562 pages
File Size : 54,6 Mb
Release : 2013-03-20
Category : Technology & Engineering
ISBN : 9781441957689

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong Pdf

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Three-Dimensional Integration of Semiconductors

Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Three Dimensional Integration of Semiconductors Book PDF

Author : Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Publisher : Springer
Page : 408 pages
File Size : 41,9 Mb
Release : 2015-12-09
Category : Science
ISBN : 9783319186757

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Three-Dimensional Integration of Semiconductors by Kazuo Kondo,Morihiro Kada,Kenji Takahashi Pdf

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques

Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo
Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques Book PDF

Author : Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo
Publisher : CRC Press
Page : 354 pages
File Size : 51,5 Mb
Release : 2018-09-13
Category : Computers
ISBN : 9781351248662

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Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques by Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo Pdf

This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.

Molecular Beam Epitaxy

Mohamed Henini
Molecular Beam Epitaxy Book PDF

Author : Mohamed Henini
Publisher : Elsevier
Page : 788 pages
File Size : 52,6 Mb
Release : 2018-06-27
Category : Science
ISBN : 9780128121375

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Molecular Beam Epitaxy by Mohamed Henini Pdf

Molecular Beam Epitaxy (MBE): From Research to Mass Production, Second Edition, provides a comprehensive overview of the latest MBE research and applications in epitaxial growth, along with a detailed discussion and ‘how to’ on processing molecular or atomic beams that occur on the surface of a heated crystalline substrate in a vacuum. The techniques addressed in the book can be deployed wherever precise thin-film devices with enhanced and unique properties for computing, optics or photonics are required. It includes new semiconductor materials, new device structures that are commercially available, and many that are at the advanced research stage. This second edition covers the advances made by MBE, both in research and in the mass production of electronic and optoelectronic devices. Enhancements include new chapters on MBE growth of 2D materials, Si-Ge materials, AIN and GaN materials, and hybrid ferromagnet and semiconductor structures. Condenses the fundamental science of MBE into a modern reference, speeding up literature review Discusses new materials, novel applications and new device structures, grounding current commercial applications with modern understanding in industry and research Includes coverage of MBE as mass production epitaxial technology and how it enhances processing efficiency and throughput for the semiconductor industry and nanostructured semiconductor materials research community

3D and Circuit Integration of MEMS

Masayoshi Esashi
3D and Circuit Integration of MEMS Book PDF

Author : Masayoshi Esashi
Publisher : John Wiley & Sons
Page : 528 pages
File Size : 52,9 Mb
Release : 2021-03-16
Category : Technology & Engineering
ISBN : 9783527823253

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3D and Circuit Integration of MEMS by Masayoshi Esashi Pdf

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Atomic Layer Deposition Applications 3

Ana Londergan
Atomic Layer Deposition Applications 3 Book PDF

Author : Ana Londergan
Publisher : The Electrochemical Society
Page : 300 pages
File Size : 49,8 Mb
Release : 2007
Category : Atomic layer deposition
ISBN : 9781566775731

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Atomic Layer Deposition Applications 3 by Ana Londergan Pdf

The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the symposium focus. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties. Following two successful years, this symposium is well on its way to becoming a forum for the sharing of cutting edge research in the various areas where ALD is used.

Handbook of Integrated Circuit Industry

Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen
Handbook of Integrated Circuit Industry Book PDF

Author : Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen
Publisher : Springer Nature
Page : 2006 pages
File Size : 49,7 Mb
Release : 2023-12-29
Category : Technology & Engineering
ISBN : 9789819928361

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Handbook of Integrated Circuit Industry by Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen Pdf

Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.

Intelligent Integrated Systems

Simon Deleonibus
Intelligent Integrated Systems Book PDF

Author : Simon Deleonibus
Publisher : CRC Press
Page : 518 pages
File Size : 48,7 Mb
Release : 2014-04-09
Category : Technology & Engineering
ISBN : 9789814411424

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Intelligent Integrated Systems by Simon Deleonibus Pdf

This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.

Encapsulation Technologies for Electronic Applications

Haleh Ardebili,Jiawei Zhang,Michael Pecht
Encapsulation Technologies for Electronic Applications Book PDF

Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
Publisher : William Andrew
Page : 508 pages
File Size : 51,6 Mb
Release : 2018-10-23
Category : Technology & Engineering
ISBN : 9780128119792

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Encapsulation Technologies for Electronic Applications by Haleh Ardebili,Jiawei Zhang,Michael Pecht Pdf

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them