Managing More Than Moore Integration Technology Development

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Managing More-than-Moore Integration Technology Development

Riko Radojcic
Managing More than Moore Integration Technology Development Book PDF

Author : Riko Radojcic
Publisher : Springer
Page : 211 pages
File Size : 48,6 Mb
Release : 2018-07-20
Category : Technology & Engineering
ISBN : 9783319927015

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Managing More-than-Moore Integration Technology Development by Riko Radojcic Pdf

This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.

More-than-Moore 2.5D and 3D SiP Integration

Riko Radojcic
More than Moore 2 5D and 3D SiP Integration Book PDF

Author : Riko Radojcic
Publisher : Springer
Page : 182 pages
File Size : 52,6 Mb
Release : 2017-02-08
Category : Technology & Engineering
ISBN : 9783319525488

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More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic Pdf

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

More than Moore

Guo Qi Zhang,Alfred van Roosmalen
More than Moore Book PDF

Author : Guo Qi Zhang,Alfred van Roosmalen
Publisher : Springer Science & Business Media
Page : 338 pages
File Size : 51,6 Mb
Release : 2010-01-23
Category : Technology & Engineering
ISBN : 9780387755939

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More than Moore by Guo Qi Zhang,Alfred van Roosmalen Pdf

In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Handbook of Integrated Circuit Industry

Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen
Handbook of Integrated Circuit Industry Book PDF

Author : Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen
Publisher : Springer Nature
Page : 2006 pages
File Size : 41,7 Mb
Release : 2023-12-29
Category : Technology & Engineering
ISBN : 9789819928361

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Handbook of Integrated Circuit Industry by Yangyuan Wang,Min-Hwa Chi,Jesse Jen-Chung Lou,Chun-Zhang Chen Pdf

Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.

Management of Technology

Hans J. Thamhain
Management of Technology Book PDF

Author : Hans J. Thamhain
Publisher : John Wiley & Sons
Page : 400 pages
File Size : 52,9 Mb
Release : 2013-10-11
Category : Technology & Engineering
ISBN : 9781118854259

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Management of Technology by Hans J. Thamhain Pdf

* Presents assessment methods for organization and managementprocesses. * Provides special tools and techniques for managing and organizingR&D, new product, and project-oriented challenges. * Includes real-world case studies.

Nanoelectronics

Robert Puers,Livio Baldi,Marcel Van de Voorde,Sebastiaan E. van Nooten
Nanoelectronics Book PDF

Author : Robert Puers,Livio Baldi,Marcel Van de Voorde,Sebastiaan E. van Nooten
Publisher : John Wiley & Sons
Page : 600 pages
File Size : 42,9 Mb
Release : 2017-04-11
Category : Technology & Engineering
ISBN : 9783527800735

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Nanoelectronics by Robert Puers,Livio Baldi,Marcel Van de Voorde,Sebastiaan E. van Nooten Pdf

Offering first-hand insights by top scientists and industry experts at the forefront of R&D into nanoelectronics, this book neatly links the underlying technological principles with present and future applications. A brief introduction is followed by an overview of present and emerging logic devices, memories and power technologies. Specific chapters are dedicated to the enabling factors, such as new materials, characterization techniques, smart manufacturing and advanced circuit design. The second part of the book provides detailed coverage of the current state and showcases real future applications in a wide range of fields: safety, transport, medicine, environment, manufacturing, and social life, including an analysis of emerging trends in the internet of things and cyber-physical systems. A survey of main economic factors and trends concludes the book. Highlighting the importance of nanoelectronics in the core fields of communication and information technology, this is essential reading for materials scientists, electronics and electrical engineers, as well as those working in the semiconductor and sensor industries.

More-than-Moore Devices and Integration for Semiconductors

Francesca Iacopi,Francis Balestra
More than Moore Devices and Integration for Semiconductors Book PDF

Author : Francesca Iacopi,Francis Balestra
Publisher : Springer Nature
Page : 271 pages
File Size : 40,9 Mb
Release : 2023-02-17
Category : Technology & Engineering
ISBN : 9783031216107

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More-than-Moore Devices and Integration for Semiconductors by Francesca Iacopi,Francis Balestra Pdf

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

VLSI-SoC: Technologies for Systems Integration

Jürgen Becker,Marcelo De Oliveira Johann,Ricardo Reis
VLSI SoC Technologies for Systems Integration Book PDF

Author : Jürgen Becker,Marcelo De Oliveira Johann,Ricardo Reis
Publisher : Springer
Page : 202 pages
File Size : 45,9 Mb
Release : 2011-08-22
Category : Computers
ISBN : 9783642231209

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VLSI-SoC: Technologies for Systems Integration by Jürgen Becker,Marcelo De Oliveira Johann,Ricardo Reis Pdf

This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

Handbook of 3D Integration, Volume 3

Philip Garrou,Mitsumasa Koyanagi,Peter Ramm
Handbook of 3D Integration Volume 3 Book PDF

Author : Philip Garrou,Mitsumasa Koyanagi,Peter Ramm
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 42,7 Mb
Release : 2014-07-21
Category : Technology & Engineering
ISBN : 9783527334667

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Handbook of 3D Integration, Volume 3 by Philip Garrou,Mitsumasa Koyanagi,Peter Ramm Pdf

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Nanoscale Devices

Gianfranco Cerofolini
Nanoscale Devices Book PDF

Author : Gianfranco Cerofolini
Publisher : Springer Science & Business Media
Page : 212 pages
File Size : 41,8 Mb
Release : 2009-08-26
Category : Technology & Engineering
ISBN : 9783540927327

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Nanoscale Devices by Gianfranco Cerofolini Pdf

The second half of the twentieth century and the beginning of the twenty ?rst have been characterized by the most impressive industrial revolution ever seen. In - proximately 40years, the complexity of integrated circuits (ICs) has increased by a 9 factor of 10 , with a corresponding reduction of the cost per bit by eight orders of magnitude. Not only has this evolution allowed dramatic progress in allscienti?c ?elds (large computers, space probes, etc.), but also has fueled the economic development with the raise of new markets (personal computers, cellular phones, etc.) and even social revolutions (world wide web, global village, etc.). In last years, however, the situation has signi?cantly changed: the continuous scaling down of device size has eventually brought the IC major technique, p- tolithography, to its limits. Overcoming its original limits has been proved to be possible, but the price to pay for that has changed the playing rules – while at the beginning of the IC history the evolution was driven by technology, now it is driven by economy, the cost of a medium size production plant being in the range of a few billion dollars.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging Book PDF

Author : Xing-Chang Wei
Publisher : CRC Press
Page : 322 pages
File Size : 47,7 Mb
Release : 2017-09-19
Category : Computers
ISBN : 9781315305868

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei Pdf

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Material-Integrated Intelligent Systems

Stefan Bosse,Dirk Lehmhus,Walter Lang,Matthias Busse
Material Integrated Intelligent Systems Book PDF

Author : Stefan Bosse,Dirk Lehmhus,Walter Lang,Matthias Busse
Publisher : John Wiley & Sons
Page : 696 pages
File Size : 55,8 Mb
Release : 2018-03-12
Category : Technology & Engineering
ISBN : 9783527336067

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Material-Integrated Intelligent Systems by Stefan Bosse,Dirk Lehmhus,Walter Lang,Matthias Busse Pdf

Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.

Through-Silicon Vias for 3D Integration

John Lau
Through Silicon Vias for 3D Integration Book PDF

Author : John Lau
Publisher : McGraw Hill Professional
Page : 512 pages
File Size : 50,9 Mb
Release : 2012-08-05
Category : Technology & Engineering
ISBN : 9780071785150

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Through-Silicon Vias for 3D Integration by John Lau Pdf

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

Vinod Pangracious,Zied Marrakchi,Habib Mehrez
Three Dimensional Design Methodologies for Tree based FPGA Architecture Book PDF

Author : Vinod Pangracious,Zied Marrakchi,Habib Mehrez
Publisher : Springer
Page : 226 pages
File Size : 55,7 Mb
Release : 2015-06-25
Category : Technology & Engineering
ISBN : 9783319191744

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Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by Vinod Pangracious,Zied Marrakchi,Habib Mehrez Pdf

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Modeling Analysis Design and Tests for Electronics Packaging beyond Moore Book PDF

Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
Publisher : Woodhead Publishing
Page : 436 pages
File Size : 45,8 Mb
Release : 2019-11-14
Category : Technology & Engineering
ISBN : 9780081025338

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao Pdf

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging