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Author : Anonim
Publisher : Unknown
Page : 194 pages
File Size : 54,5 Mb
Release : 1998
Category : Electronic apparatus and appliances
ISBN : UOM:39015040307921
Author : Anonim
Publisher : Unknown
Page : 420 pages
File Size : 53,7 Mb
Release : 1994
Category : Electronic apparatus and appliances
ISBN : UOM:39015030269503
Author : Ch36205
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 500 pages
File Size : 42,7 Mb
Release : 1998
Category : Technology & Engineering
ISBN : 0780345231
The IEMT is an international forum for presenting research, development and applications of manufacturing technology and systems for use in the manufacture of electronic components, assemblies, and systems.
Author : Anonim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 479 pages
File Size : 43,6 Mb
Release : 1999-01-01
Category : Ball grid array technology
ISBN : 0780355032
Author : Anonim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 520 pages
File Size : 45,6 Mb
Release : 1996
Category : Electronic apparatus and appliances
ISBN : UCSD:31822021657127
Author : Anonim
Publisher : Unknown
Page : 479 pages
File Size : 40,9 Mb
Release : 1999
Category : Electronic apparatus and appliances
ISBN : 0780355024
Author : Anonim
Publisher : Unknown
Page : 128 pages
File Size : 49,9 Mb
Release : 2010
Category : Ball grid array technology
ISBN : 1424433932
Author : IEEE.,Components, Packaging, and Manufacturing Technology Society,Institute of Electrical and Electronics Engineers,Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter,Components, Packaging & Manufacturing Technology Society. Malaysia Chapter
Publisher : Unknown
Page : 706 pages
File Size : 50,7 Mb
Release : 2008
Category : Components, Circuits, Devices & Systems
ISBN : 1424433924
Author : Anonim
Publisher : Unknown
Page : 426 pages
File Size : 42,7 Mb
Release : 1993
Category : Electronic apparatus and appliances
ISBN : UOM:39015026534241
Author : Pedro Costa,Carlos M Costa,Senentxu Lanceros-Mendez
Publisher : Woodhead Publishing
Page : 552 pages
File Size : 51,6 Mb
Release : 2020-11-19
Category : Technology & Engineering
ISBN : 9780128185025
Advanced Lightweight Multifunctional Materials presents the current state-of-the-art on multifunctional materials research, focusing on different morphologies and their preparation and applications. The book emphasizes recent advances on these types of materials as well as their application. Chapters cover porous multifunctional materials, thermochromic and thermoelectric materials, shape memory materials, piezoelectric multifunctional materials, electrochromic and electrorheological, soft materials, magnetic and photochromic materials, and more. The book will be a valuable reference resource for academic researchers and industrial engineers working in the design and manufacture of multifunctional materials, composites and nanocomposites. Provides detailed information on design, modeling and structural applications Focuses on characteristics, processing, design and applications Discusses the main types of lightweight multifunctional materials and processing techniques, as well as the physico-chemical insights that can lead to improved performance
Author : IEEE Staff
Publisher : Unknown
Page : 128 pages
File Size : 47,7 Mb
Release : 2016-09-20
Category : Electronic
ISBN : 1509034447
It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field
Author : Walt Trybula
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 536 pages
File Size : 43,9 Mb
Release : 1995
Category : Electronic apparatus and appliances
ISBN : UCSD:31822021339395
Author : Christopher Corti,Richard Holliday
Publisher : CRC Press
Page : 446 pages
File Size : 52,5 Mb
Release : 2009-12-02
Category : Science
ISBN : 9781420065268
Gold is used in a wide range of industrial and medical applications and accounts for over 10 percent of the annual demand for metal, worth billions of dollars annually. While much has been written about the mystique and trade of gold, very little has been written about the science and technology in which it is involved. Edited by two respected auth
Author : IEEE Staff
Publisher : Unknown
Page : 0 pages
File Size : 54,7 Mb
Release : 2022-10-19
Category : Electronic
ISBN : 1665471719
This is an international event organized by the IEEE EPS, Malaysia Chapter, with co sponsorship from Electronic Packaging Society (EPS) of IEEE, Santa Clara Valley Chapter This conference include original and previously unpublished, non confidential and non commercial information on new developments, technology and knowledge in the areas including, but not limited to those given below Advanced Packaging, Power modules for EV, 2 5D, 3 0D, TSV, interposer, flip chip, SiP, PoP, FOWLP, FOPLP, embedded & advanced substrates, heterogeneous integration Assembly and Manufacturing Technology, Thermal Mechanical Electrical Simulation & Characterization Material & Processing Emerging Packaging & Interconnections Technologies ? Opto electronics, Medical Electronics, Nano Technology, Wearable Electronics LED,MEM & Sensor Packaging & IoT IC Testing Technology Surface Mount Technology Quality, Reliability & Failure Analysis High Speed and Wireless & Components
Author : Dipak Kumar Mandal,Chanan Singh Syan
Publisher : Springer
Page : 831 pages
File Size : 51,9 Mb
Release : 2016-01-05
Category : Technology & Engineering
ISBN : 9788132227403
This volume is based on the proceedings of the 28th International Conference on CAD/CAM, Robotics and Factories of the Future. This book specially focuses on the positive changes made in the field of robotics, CAD/CAM and future outlook for emerging manufacturing units. Some of the important topics discussed in the conference are product development and sustainability, modeling and simulation, automation, robotics and handling systems, supply chain management and logistics, advanced manufacturing processes, human aspects in engineering activities, emerging scenarios in engineering education and training. The contents of this set of proceedings will prove useful to both researchers and practitioners.