Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 640 pages
File Size : 52,7 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 9781351835541

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author : Joseph F. Hanlon,Robert J. Kelsey,Hallie Forcinio
Publisher : CRC Press
Page : 730 pages
File Size : 52,9 Mb
Release : 1998-04-23
Category : Technology & Engineering
ISBN : 1566763061

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Handbook of Package Engineering, Third Edition by Joseph F. Hanlon,Robert J. Kelsey,Hallie Forcinio Pdf

Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in the materials and structures of packaging. It reviews the essentials of production - packaging operations, line layout, and the machines that are required in order to perform basic packaging functions. It introduces the increasing web of laws and regulations controlling virtually all packaged products.

Author : Joseph F. Hanlon
Publisher : McGraw-Hill Companies
Page : 568 pages
File Size : 44,6 Mb
Release : 1984
Category : Technology & Engineering
ISBN : UOM:39015004553098

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Handbook of Package Engineering by Joseph F. Hanlon Pdf

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 48,7 Mb
Release : 2013-11-27
Category : Computers
ISBN : 9781461560371

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 832 pages
File Size : 49,5 Mb
Release : 2002
Category : Business & Economics
ISBN : UOM:39015053514967

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Area Array Packaging Handbook by Ken Gilleo Pdf

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Author : Frank A. Paine,Heather Y. Paine
Publisher : Springer Science & Business Media
Page : 511 pages
File Size : 52,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461528104

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A Handbook of Food Packaging by Frank A. Paine,Heather Y. Paine Pdf

This is the second edition of a successful title first published in 1983 and now therefore a decade out of date. The authors consider the development of the right package for a particular food in a particular market, from the point of view of the food technologist, the packaging engineer and those concerned with marketing. While the original format has been retained, the contents have been thoroughly revised to take account of the considerable advances made in recent years in the techniques of food processing, packaging and distribution. While efficient packaging is even more a necessity for every kind of food, whether fresh or processed, and is an essential link between the food producer and the consumer, the emphasis on its several functions has changed. Its basic function is to identify the product and ensure that it travels safely through the distribution system to the consumer. Packaging designed and constructed solely for this purpose adds little or nothing to the value of the product, merely preserving farm or processor freshness or preventing physical damage, and cost effectiveness is the sole criterion for success. If, however, the packaging facilitates the use of the product, is reusable or has an after-use, some extra value can be added to justify the extra cost and promote sales. Many examples of packaging providing such extra value can be cited over the last decade.

Author : Ray Klimovitz,Karl Ockert
Publisher : Unknown
Page : 474 pages
File Size : 50,7 Mb
Release : 2014
Category : Beer
ISBN : 0978772679

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Beer Packaging by Ray Klimovitz,Karl Ockert Pdf

Author : Mark J. Kirwan
Publisher : John Wiley & Sons
Page : 449 pages
File Size : 51,8 Mb
Release : 2012-11-07
Category : Technology & Engineering
ISBN : 9781118470923

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Handbook of Paper and Paperboard Packaging Technology by Mark J. Kirwan Pdf

The definitive industry reference on the paper and paperboard packaging sector. Now in a fully revised and updated second edition, this book discusses all the main types of packaging based on paper and paperboard. It considers the raw materials, the manufacture of paper and paperboard, and the basic properties and features on which packaging made from these materials depends for its appearance and performance. The manufacture of twelve types of paper- and paperboard-based packaging is described, together with their end-use applications and the packaging machinery involved. The importance of pack design is stressed, as well as how these materials offer packaging designers opportunities for imaginative and innovative design solutions. Environmental factors, including resource sustainability, societal and waste management issues are addressed in a dedicated chapter. The book is directed at readers based in companies which manufacture packaging grades of paper and paperboard, companies involved in the design, printing and production of packaging, and companies which manufacture inks, coatings, adhesives and packaging machinery. It will be essential reading for students of packaging technology and technologists working in food manufacturing who are users of paper and paperboard packaging products. Praise for the First Edition ‘This book is a valuable addition to the library of any forward-looking company by providing in-depth coverage of all aspects of packaging which involve the most ecologically acceptable material, namely paper and paperboard.’—International Journal of Dairy Technology ‘...a welcome contribution to a field where coverage was previously limited to subject-specific books... or to single chapters in textbooks on broader aspects of packaging technology.’—Packaging Technology and Science

Author : Frank A. Paine
Publisher : Springer Science & Business Media
Page : 608 pages
File Size : 55,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461314837

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The Packaging User’s Handbook by Frank A. Paine Pdf

The first version of this book, Packaging Materials and Containers was published in 1967 and was revised extensively ten years later under the title The Packaging Media. Some thirty or so authors were involved in producing the initial texts for these books, and I must acknowledge their material, much of which is still valid. It is now thirteen years since The Packaging Media-high time to take stock and incorporate the considerable advances in materials, forms, techniques and machinery that have taken place. In 1977, wherever possible, we asked the original authors to carry out the revisions, but retirements and job changes have now eliminated over twenty of the original authors. We have therefore appointed an Editorial Board to advise on this more extensive revision, and I wish to thank them for their detailed and helpful assistance: Dr C. J. Mackson and Professor Y. Dagel for general comments and guidance on the overall plan and, in particular, the Introduction (chapter 1); Graham Gordon and Harri Mostyn for assistance with much of Part D on Distribution Packages, and Dennis Hine and Susan Selke for their work in respect of paperboard and plastics retail packaging, respectively. A major contribution was made by the seventh member of the Editorial Board, David Osborne, who advised in the area of glass.

Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 742 pages
File Size : 40,8 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461540861

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Microelectronics Packaging Handbook by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author : Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 51,7 Mb
Release : 1997-01-31
Category : Computers
ISBN : 0412084511

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Microelectronics Packaging Handbook by Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein Pdf

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Author : Max Sherman
Publisher : CRC Press
Page : 422 pages
File Size : 46,6 Mb
Release : 1998-08-25
Category : Medical
ISBN : 0849384494

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Medical Device Packaging Handbook, Revised and Expanded by Max Sherman Pdf

This volume details current developments in industry practices and standards relating to medical device packaging. This edition offers entirely new as well as revised chapters on packaging materials, package validation and methods and integrity testing, bar-coding technology, environmentally sound packaging and disposal procedures, storage autoclave sytems, international standards, customer needs, regulatory aspects, and more.

Author : Bernie Matisoff
Publisher : Springer Science & Business Media
Page : 691 pages
File Size : 53,7 Mb
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9781461560470

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Handbook of Electronics Manufacturing Engineering by Bernie Matisoff Pdf

This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products. Providing a stategic yet simplified layout, this handbook is set up with an eye toward maximizing productivity in each phase of the eletronics manufacturing process. Not only does this handbook inform the reader on vital issues concerning electronics manufacturing and design, it also provides practical insight and will be of essential use to manufacturing and process engineers in electronics and aerospace manufacturing. In addition, electronics packaging engineers and electronics manufacturing managers and supervisors will gain a wealth of knowledge.

Author : Jairus R. D. David,Ralph H. Graves,Thomas Szemplenski
Publisher : CRC Press
Page : 389 pages
File Size : 55,8 Mb
Release : 2012-11-15
Category : Technology & Engineering
ISBN : 9781439807200

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Handbook of Aseptic Processing and Packaging by Jairus R. D. David,Ralph H. Graves,Thomas Szemplenski Pdf

Since publication of the first edition of this book, Aseptic Processing and Packaging of Food, significant changes have taken place in several aseptic processing and packaging areas. These include changes in aseptic filling of nutritional beverages in plastic bottles; the popularity of value-added commodity products such as juice, concentrate, and

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 648 pages
File Size : 47,5 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1420049844

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.