Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 53,6 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410539

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Power Electronic Packaging by Yong Liu Pdf

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author : Mark Johnson
Publisher : Energy Engineering
Page : 400 pages
File Size : 51,7 Mb
Release : 2018-06-26
Category : Technology & Engineering
ISBN : 1785612522

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Power Electronics Packaging Reliability by Mark Johnson Pdf

This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability.

Author : Richard K. Ulrich,William D. Brown
Publisher : John Wiley & Sons
Page : 852 pages
File Size : 42,8 Mb
Release : 2006-02-24
Category : Technology & Engineering
ISBN : 9780471466093

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Advanced Electronic Packaging by Richard K. Ulrich,William D. Brown Pdf

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Author : Henry Shu-hung Chung,Huai Wang,Frede Blaabjerg,Michael Pecht
Publisher : IET
Page : 502 pages
File Size : 50,9 Mb
Release : 2015-12-07
Category : Technology & Engineering
ISBN : 9781849199018

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Reliability of Power Electronic Converter Systems by Henry Shu-hung Chung,Huai Wang,Frede Blaabjerg,Michael Pecht Pdf

The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.

Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 50,6 Mb
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 9781461410522

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Power Electronic Packaging by Yong Liu Pdf

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
Page : 633 pages
File Size : 41,7 Mb
Release : 2011-01-05
Category : Technology & Engineering
ISBN : 9781441977595

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong Pdf

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Page : 240 pages
File Size : 49,8 Mb
Release : 2018-05-28
Category : Technology & Engineering
ISBN : 9780081020951

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Wide Bandgap Power Semiconductor Packaging by Katsuaki Suganuma Pdf

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 648 pages
File Size : 40,8 Mb
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1420049844

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The Electronic Packaging Handbook by Glenn R. Blackwell Pdf

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Density Electronic Packaging
Publisher : National Academies Press
Page : 154 pages
File Size : 54,9 Mb
Release : 1990-02-01
Category : Technology & Engineering
ISBN : 9780309042338

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Materials for High-Density Electronic Packaging and Interconnection by National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Density Electronic Packaging Pdf

Author : Shichun Qu,Yong Liu
Publisher : Springer
Page : 322 pages
File Size : 44,7 Mb
Release : 2014-09-10
Category : Technology & Engineering
ISBN : 9781493915569

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Wafer-Level Chip-Scale Packaging by Shichun Qu,Yong Liu Pdf

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Author : Xingsheng Liu,Wei Zhao,Lingling Xiong,Hui Liu
Publisher : Springer
Page : 402 pages
File Size : 46,7 Mb
Release : 2014-07-14
Category : Technology & Engineering
ISBN : 9781461492634

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Packaging of High Power Semiconductor Lasers by Xingsheng Liu,Wei Zhao,Lingling Xiong,Hui Liu Pdf

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Author : John H. Lau,John Prince,C. P. Wong,Wataru Nakayama
Publisher : McGraw-Hill Professional Publishing
Page : 0 pages
File Size : 54,5 Mb
Release : 1998
Category : Electronic packaging
ISBN : 0070371350

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Electronic Packaging by John H. Lau,John Prince,C. P. Wong,Wataru Nakayama Pdf

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Author : Ken Kuang,Keith Easler
Publisher : Springer Science & Business Media
Page : 254 pages
File Size : 47,5 Mb
Release : 2007-08-26
Category : Science
ISBN : 9780387473246

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Fuel Cell Electronics Packaging by Ken Kuang,Keith Easler Pdf

Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.

Author : Muhammad H. Rashid
Publisher : Elsevier
Page : 1192 pages
File Size : 51,8 Mb
Release : 2010-07-19
Category : Technology & Engineering
ISBN : 0080467652

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Power Electronics Handbook by Muhammad H. Rashid Pdf

Power electronics, which is a rapidly growing area in terms of research and applications, uses modern electronics technology to convert electric power from one form to another, such as ac-dc, dc-dc, dc-ac, and ac-ac with a variable output magnitude and frequency. Power electronics has many applications in our every day life such as air-conditioners, electric cars, sub-way trains, motor drives, renewable energy sources and power supplies for computers. This book covers all aspects of switching devices, converter circuit topologies, control techniques, analytical methods and some examples of their applications. * 25% new content * Reorganized and revised into 8 sections comprising 43 chapters * Coverage of numerous applications, including uninterruptable power supplies and automotive electrical systems * New content in power generation and distribution, including solar power, fuel cells, wind turbines, and flexible transmission

Author : King-Ning Tu,Chih Chen,Hung-Ming Chen
Publisher : John Wiley & Sons
Page : 340 pages
File Size : 50,6 Mb
Release : 2021-12-29
Category : Science
ISBN : 9781119418313

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Electronic Packaging Science and Technology by King-Ning Tu,Chih Chen,Hung-Ming Chen Pdf

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.